Patent US5309979A successfully refreshed from Google Patents.
US5309979A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Self clamping heat sink assembly
Assignee: Delphi Technologies Inc
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Filing: 1993-06-08
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Granted: 1994-05-10
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Expires: 2013-06-08
Abstract
Abstract A heat sink assembly for clamping stand-up power components to a heat sink wherein the components are mounted on a circuit board and enclosed within a housing. A spring clamp lightly clamps an electrical component to a heat sink during a soldering process. Thereafter, the housing assembly sandwiches the electrical component between the spring clamp and a heat sink; thus ensuring optimum heat dissipation from and stability of the electrical component.
Inventors
- 👤 Eric A. Brauer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:48
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/641
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
118 words
A heat sink for dissipating thermal energy from a heat generating electrical component mounted on a circuit board, said assembly comprising: a heat sink means for dissipating heat from said electrical component, said heat sink means placed adjacent to said electrical component on a first side thereof; a resilient means placed adjacent to said electrical component on a second side thereof opposite to said first side; and biasing means including an angled surface affixed to a housing member, the angled surface engaging said resilient means for applying a biasing force to said resilient means when said housing member is positioned about said heat sink and component, thereby to resiliently press said electrical component against said heat sink means.
Claim 2
Dependent Claim
118 words
A heat sink for dissipating thermal energy from a heat generating electrical component mounted on a circuit board, said assembly comprising: a heat sink means for dissipating heat from said electrical component, said heat sink means placed adjacent to said electrical component on a first side thereof; a resilient means placed adjacent to said electrical component on a second side thereof opposite to said first side; and biasing means including an angled surface affixed to a housing member, the angled surface engaging said resilient means for applying a biasing force to said resilient means when said housing member is positioned about said heat sink and component, thereby to resiliently press said electrical component against said heat sink means.
Claim 3
Dependent Claim
71 words
The heat sink assembly according to claim 1, wherein said biasing means comprises a cover member adapted to cover and enclose said circuit board, said cover member having internal opposed surfaces which contact said heat sink means and said resilient means and bias said heat sink means and said resilient means against said electrical component, at least one of said internal opposed surfaces forming an outer wall of said cover member.
Claim 4
Independent Claim
101 words
A method for clamping a heat generating electrical component to a heat sink comprising the steps of: mounting said electrical component to a circuit board adjacent said heat sink; mounting a resilient clip to said circuit board adjacent said electrical component so as to lightly clamp said electrical component against said heat sink during soldering of said electrical component to said circuit board; and affixing a housing member to said circuit board after the soldering of said electrical component to said circuit board, wherein said housing member engages said resilient clip and firmly biases said electrical component toward said heat sink.
Claim 5
Independent Claim
101 words
A method for clamping a heat generating electrical component to a heat sink comprising the steps of: mounting said electrical component to a circuit board adjacent said heat sink; mounting a resilient clip to said circuit board adjacent said electrical component so as to lightly clamp said electrical component against said heat sink during soldering of said electrical component to said circuit board; and affixing a housing member to said circuit board after the soldering of said electrical component to said circuit board, wherein said housing member engages said resilient clip and firmly biases said electrical component toward said heat sink.
References Cited (Backward Citations)
DE3440334A1
Cited
US4707726A
Cited
JPS62252157A
Cited
US4972294A
Cited
WO1991011897A1
Cited
US5060112A
Cited
US5031028A
Cited
US5225965A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-09 | 1997-11-08 | 1998-05-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-09 | 2001-11-08 | 2002-05-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-09 | 2005-11-08 | 2006-05-10 | $7700.00 | Window Closed / Lapsed |