Patent DE952484C successfully refreshed from Google Patents.
Patent US5308791A successfully refreshed from Google Patents.
US5308791A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for processing surface of semiconductor layer
Assignee: Tokyo Electron Ltd
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Filing: 1992-03-09
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Granted: 1994-05-03
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Expires: 2012-03-09
Abstract
Abstract An apparatus for processing the surface of an Si wafer includes a vacuum cleaning chamber in which said Si wafer is housed. He gas is supplied into the cleaning chamber and micro-wave and magnetic field are applied to the He gas to generate excited species which emit vacuum ultraviolet. The vacuum ultraviolet is radiated onto the wafer surface to enable its energy to cut bonds between Si atoms of said wafer and O atoms and forming a natural oxide film on the wafer surface. Ar gas is also supplied into the cleaning chamber to create ions of said Ar gas due to energy added from said excited species. Said ions are supplied onto the wafer surface to form floating potential above said wafer surface. Said ions collide against said wafer surface to eliminate O atoms from said wafer surface. A process chamber is connected to the cleaning chamber through a load lock chamber. Al film is formed on the wafer surface, from which the natural oxide film has been eliminated, in the process chamber.
Inventors
- 👤 Yasuhiro Horiike
- 👤 Kohei Kawamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 09:05
CPC Classifications
H; H10; H10P; H10P52/00; H10P70/00; H10P70/10; H10P70/12; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; Y; Y10; Y10S; Y10S438/00; Y10S438/906; Y10S438/974
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
184 words
A method of processing that surface of a semi-conductor layer on a substrate where atoms of the semi-conductor layer are bonded to atoms of contaminants, comprising the steps of: loading the substrate into a first chamber; keeping the first chamber highly reduced in pressure while exhausting it; irradiating the surface of said semiconductor layer with vacuum ultraviolet in the highly-reduced pressure in the first chamber to allow the energy of said ultraviolet to cut bonds between the atoms of the surface of said semiconductor layer and the atoms of the contaminants; and supplying ions of an inactive gas onto the surface of said semiconductor layer while irradiating it with the vacuum ultraviolet, thereby forming floating potential of said ions above the surface of said semiconductor layer and causing said ions to collide against the atoms of said contaminants to eliminate them from the surface of said semiconductor layer, carrying said substrate from said first chamber into a second chamber through a passage, pressures in said passage and said second chamber being highly reduced, and forming a film on the surface of said semiconductor layer.
Claim 2
Independent Claim
184 words
A method of processing that surface of a semi-conductor layer on a substrate where atoms of the semi-conductor layer are bonded to atoms of contaminants, comprising the steps of: loading the substrate into a first chamber; keeping the first chamber highly reduced in pressure while exhausting it; irradiating the surface of said semiconductor layer with vacuum ultraviolet in the highly-reduced pressure in the first chamber to allow the energy of said ultraviolet to cut bonds between the atoms of the surface of said semiconductor layer and the atoms of the contaminants; and supplying ions of an inactive gas onto the surface of said semiconductor layer while irradiating it with the vacuum ultraviolet, thereby forming floating potential of said ions above the surface of said semiconductor layer and causing said ions to collide against the atoms of said contaminants to eliminate them from the surface of said semiconductor layer, carrying said substrate from said first chamber into a second chamber through a passage, pressures in said passage and said second chamber being highly reduced, and forming a film on the surface of said semiconductor layer.
Claim 3
Independent Claim
171 words
A method of processing that surface of a semiconductor layer on a substrate where atoms of the semiconductor layer are bonded to atoms of contaminants, comprising the steps of: loading the substrate into a first chamber; keeping the first chamber highly reduced in pressure while exhausting it; irradiating the surface of said semiconductor layer with vacuum ultraviolet in the highly-reduced pressure in the first chamber to allow the energy of said ultraviolet to cut bonds between the atoms of the surface of said semiconductor layer and the atoms of the contaminants; and supplying ions of an inactive gas onto the surface of said semiconductor layer while irradiating it with the vacuum ultraviolet, thereby forming floating potential of said ions above the surface of said semiconductor layer and causing said ions to collide against the atoms of said contaminants to eliminate them from the surface of said semiconductor layer, wherein said vacuum ultraviolet is emitted from excited species derived from plasma of a first gas, which is introduced into said first chamber.
Claim 4
Independent Claim
171 words
A method of processing that surface of a semiconductor layer on a substrate where atoms of the semiconductor layer are bonded to atoms of contaminants, comprising the steps of: loading the substrate into a first chamber; keeping the first chamber highly reduced in pressure while exhausting it; irradiating the surface of said semiconductor layer with vacuum ultraviolet in the highly-reduced pressure in the first chamber to allow the energy of said ultraviolet to cut bonds between the atoms of the surface of said semiconductor layer and the atoms of the contaminants; and supplying ions of an inactive gas onto the surface of said semiconductor layer while irradiating it with the vacuum ultraviolet, thereby forming floating potential of said ions above the surface of said semiconductor layer and causing said ions to collide against the atoms of said contaminants to eliminate them from the surface of said semiconductor layer, wherein said vacuum ultraviolet is emitted from excited species derived from plasma of a first gas, which is introduced into said first chamber.
Claim 5
Dependent Claim
43 words
The method according to claim 2, further comprising carrying said substrate from said first chamber into a second chamber through a passage, pressures in said passage and second chamber being highly reduced, and forming a film on the surface of said semiconductor layer.
Claim 6
Dependent Claim
21 words
The method according to claim 2, wherein said vacuum ultraviolet is radiated from an ultraviolet emitter located outside the first chamber.
Claim 7
Dependent Claim
22 words
The method according to claim 2, wherein said ions of said inactive gas are generated by energy added by said excited species.
Claim 8
Dependent Claim
13 words
The method according to claim 5, wherein said first gas is He gas.
Claim 9
Dependent Claim
21 words
The method according to claim 6, wherein said inactive gas is selected from a group consisting of Ar, Kr and Xe.
References Cited (Backward Citations)
US5024968A
Cited
US5147465A
Cited
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