Abstract A fin device includes a plate having a bottom surface for contacting an upper surface of an integrated circuit and an upper surface from which two opposite end walls extend upward. A plurality of rows of fins extend between the opposite end walls and extend upward from the upper surface of the plate. A substantially L-shaped member extends outward and upward from each fin of first and last rows which are adjacent to and extend parallel to the opposite end walls. Each L-shaped member extends to a height above the fins. The fins of the first and last rows respectively define a groove with associated adjacent end walls for receiving at least one snapping fastener. Each snapping fastener is substantially T-shaped, including a substantially inverted L-shaped portion with a distal snapping head at an end thereof and two arms extending laterally from the other end thereof. The arms have a recessed portion at an underside thereof. The distal snapping head releasably engages with a bottom surface of the integrated circuit to retain a reliable contact of the bottom surface of the plate and the upper surface of the integrated circuit. A fan is securely mounted on the L-shaped members in which a space is defined between the fins and the fan to increase the effect of heat dissipation.
A fin device for dissipating heat generated by an integrated circuit comprising: a plate (10) having a bottom surface for contacting an upper surface of an integrated circuit (30) and an upper surface, two opposite end walls (15) extending upward from said upper surface; a plurality of rows of fins (12) extending between said end walls (15) and extending upward from said upper surface of said plate; a substantially L-shaped member (13) extending outward and upward from each said fin (12) of first and last rows which are adjacent to and extend parallel to the end walls (15), each said L-shaped member (13) extending to a height above said fins, said fins (12) of said first and last rows respectively defining a groove (11) with associated adjacent said end walls (15) for receiving at least one snapping fastener (20), said snapping fastener (20) being substantially T-shaped, comprising a substantially inverted L-shaped portion (24) with a distal snapping head (22) at an end thereof and two arms (21) extending laterally from the other end thereof, said arms (21) having a recessed portion (210) at an underside thereof, said distal snapping head (22) releasably engaging with a bottom surface of said integrated circuit to reliably retain a heat transfer contact relationship of said bottom surface of said plate (10) and said upper surface of said integrated circuit; a fan means (40); and means (131 and 132) for securely retaining said fan means on said L-shaped members, defining a space between said fins and said fan means.
Claim 2
Dependent Claim
254 words
A fin device for dissipating heat generated by an integrated circuit comprising: a plate (10) having a bottom surface for contacting an upper surface of an integrated circuit (30) and an upper surface, two opposite end walls (15) extending upward from said upper surface; a plurality of rows of fins (12) extending between said end walls (15) and extending upward from said upper surface of said plate; a substantially L-shaped member (13) extending outward and upward from each said fin (12) of first and last rows which are adjacent to and extend parallel to the end walls (15), each said L-shaped member (13) extending to a height above said fins, said fins (12) of said first and last rows respectively defining a groove (11) with associated adjacent said end walls (15) for receiving at least one snapping fastener (20), said snapping fastener (20) being substantially T-shaped, comprising a substantially inverted L-shaped portion (24) with a distal snapping head (22) at an end thereof and two arms (21) extending laterally from the other end thereof, said arms (21) having a recessed portion (210) at an underside thereof, said distal snapping head (22) releasably engaging with a bottom surface of said integrated circuit to reliably retain a heat transfer contact relationship of said bottom surface of said plate (10) and said upper surface of said integrated circuit; a fan means (40); and means (131 and 132) for securely retaining said fan means on said L-shaped members, defining a space between said fins and said fan means.
Claim 3
Dependent Claim
40 words
The fin device as claimed in claim 1 wherein said retaining means comprises an upper ledge (132) at a top portion of each said L-shaped member and a lower ledge (131) at a mediate portion of each said L-shaped member.
Claim 4
Dependent Claim
20 words
The fin device as claimed in claim 2 wherein said L-shaped member has a snapping head at a top thereof.