US5297331A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for aligning a substrate with respect to orifices in an inkjet printhead
Assignee: HP Inc
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Filing: 1992-04-03
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Granted: 1994-03-29
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Expires: 2012-04-03
Abstract
Abstract In a printhead according to the preferred embodiment of the invention, a polymer tape having orifices formed therein and containing conductive traces is provided with one or more windows exposing ends of the conductive traces. A separate substrate contains heating elements and electrodes. A conventional, commercially available automatic inner lead bonder is then used to automatically align the orifices to the heating elements. The automatic alignment of the orifices and heating elements also inherently aligns the electrodes on the substrate with the exposed ends of the traces. The wire bonder is then used to bond the traces to the associated substrate electrodes through the window.
Inventors
- 👤 Winthrop D. Childers
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 10:07
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/16; B41J2/1621; B41J2/1623; B41J2/1601; B41J2/1603; B41J2/1631; B41J2/1632; B41J2/1634; B41J2/14; B41J2002/14362; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49083; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49401
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
100 words
A method for bonding conductive leads to electrodes on a substrate in the formation of a printhead comprising the steps of: providing conductive leads on a nozzle member containing orifices for ejecting ink; positioning a substrate, having ink ejection elements and electrodes on a front surface thereof, with respect to said nozzle member so as to align said ink ejection elements with said orifices, wherein alignment of said ink ejection elements with said orifices also aligns said electrodes with ends of said conductive leads; and using a bonding tool to bond said conductive leads to said electrodes on said substrate.
Claim 2
Independent Claim
100 words
A method for bonding conductive leads to electrodes on a substrate in the formation of a printhead comprising the steps of: providing conductive leads on a nozzle member containing orifices for ejecting ink; positioning a substrate, having ink ejection elements and electrodes on a front surface thereof, with respect to said nozzle member so as to align said ink ejection elements with said orifices, wherein alignment of said ink ejection elements with said orifices also aligns said electrodes with ends of said conductive leads; and using a bonding tool to bond said conductive leads to said electrodes on said substrate.
Claim 3
Dependent Claim
69 words
The method of claim 1 further comprising the step of: providing one or more windows through said nozzle member containing orifices for exposing said conductive leads on said nozzle member so that said step of positioning said substrate aligns said electrodes with said conductive leads as viewed through said one or more windows, said one or more windows allowing said bonding tool to gain access to said conductive leads.
Claim 4
Dependent Claim
34 words
The method of claim 1 wherein said bonding tool includes a pattern recognition alignment means which automatically aligns said substrate with respect to said nozzle member prior to bonding said leads to said electrodes.
Claim 5
Dependent Claim
19 words
The method of claim 3 wherein said bonding tool bonds said conductive leads to said electrodes using thermocompression bonding.
Claim 6
Dependent Claim
19 words
The method of claim 1 wherein said nozzle member comprises a flexible polymer tape having said conductive photolithographic process.
Claim 7
Dependent Claim
58 words
The method of claim 1 wherein said orifices are formed in said nozzle member so as to be in a predetermined relationship with said conductive leads on said nozzle member so that, when said ink ejection elements on said substrate are aligned with said orifices, said conductive leads will also be aligned with said electrodes on said substrate.
Claim 8
Independent Claim
156 words
A method for bonding conductors to electrodes on a substrate in the formation of an inkjet printhead comprising the steps of: providing one or more windows trough a nozzle member, said nozzle member containing orifices for ejecting ink, said one or more windows for exposing ends of conductive leads affixed to said nozzle member, said orifices being aligned with said conductive leads; positioning a substrate, having ink ejection elements and electrodes formed on a front surface thereof, with respect to said nozzle member so as to align said ink ejection elements with said orifice, said step of positioning also aligning ends of said conducive leads with said electrodes; and using an automated bonding tool to bond said conductive leads to said electrodes on said substrate, said bonding tool gaining access to said conductive leads through said one or more windows. substrate, said bonding tool gaining access to said conductive leads through aid one or more windows.
Claim 9
Independent Claim
156 words
A method for bonding conductors to electrodes on a substrate in the formation of an inkjet printhead comprising the steps of: providing one or more windows trough a nozzle member, said nozzle member containing orifices for ejecting ink, said one or more windows for exposing ends of conductive leads affixed to said nozzle member, said orifices being aligned with said conductive leads; positioning a substrate, having ink ejection elements and electrodes formed on a front surface thereof, with respect to said nozzle member so as to align said ink ejection elements with said orifice, said step of positioning also aligning ends of said conducive leads with said electrodes; and using an automated bonding tool to bond said conductive leads to said electrodes on said substrate, said bonding tool gaining access to said conductive leads through said one or more windows. substrate, said bonding tool gaining access to said conductive leads through aid one or more windows.
Claim 10
Dependent Claim
32 words
The method of claim 7 wherein said bonding tool includes a pattern recognition alignment means which automatically aligns said substrate with said nozzle member prior to bonding said leads to said electrodes.
Claim 11
Dependent Claim
19 words
The method of claim 8 wherein said boding tool bonds said conductive leads to said electrodes using thermocompression bonding.
Claim 12
Dependent Claim
27 words
The method of claim 7 wherein said nozzle member comprises a flexible polymer tape having said conductive leads formed on a surface thereof using a photolithographic process.
References Cited (Backward Citations)
US4312009A
Cited
US4450455A
Cited
US4558333A
Cited
US4490728A
Cited
US4611219A
Cited
US4568953A
Cited
US4587534A
Cited
US4675693A
Cited
US4550326A
Cited
US4502060A
Cited
US4500895A
Cited
US4712172A
Cited
US4580149A
Cited
US4746935A
Cited
US4683481A
Cited
JPS62170350A
Cited
US4695854A
Cited
US4773971A
Cited
US4734717A
Cited
EP0309146B1
Cited
US4847630A
Cited
US4780177A
Cited
US4842677A
Cited
US4926197A
Cited
US4915981A
Cited
EP0367541A2
Cited
US4942408A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-28 | 1997-09-27 | 1998-03-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-28 | 2001-09-27 | 2002-03-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-28 | 2005-09-27 | 2006-03-29 | $7700.00 | Window Closed / Lapsed |