US5296653A
Expired / Lapsed
US
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Device having a multi-layered conductor structure
Assignee: Japan Display Central Inc
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Filing: 1992-12-09
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Granted: 1994-03-22
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Expires: 2012-12-09
Abstract
Abstract A multi-layered conductor structure device has a substrate, a first conductor layer formed on the substrate, which provides an electrode or wiring, and an insulating film covering the first conductor layer and the substrate. On the insulating film, a second conductor layer is formed which comprises an indium tin oxide, and which provides an electrode or wiring. The first conductor layer is formed of an alloy of aluminum with copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and/or silver.
Inventors
- 👤 Toshiya Kiyota
- 👤 Mitsushi Ikeda
- 👤 Meiko Ogawa
- 👤 Yoshifumi Ogawa
- 👤 Michio Murooka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 04:21
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G03; G03G; G03G5/00; G03G5/10; G03G5/104; G02F1/133; G02F1/1333; G02F1/1343; G02F1/136; G02F1/1362; G02F1/136286; G02F1/13629
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
94 words
A device having a multi-layered conductor structure comprising: a substrate; a first conductor layer formed on the substrate, which provides an electrode or wiring; an insulating film covering the first conductor layer and the substrate; and a second conductor layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring; wherein said first conductor layer is formed of an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver.
Claim 2
Independent Claim
94 words
A device having a multi-layered conductor structure comprising: a substrate; a first conductor layer formed on the substrate, which provides an electrode or wiring; an insulating film covering the first conductor layer and the substrate; and a second conductor layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring; wherein said first conductor layer is formed of an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver.
Claim 3
Dependent Claim
23 words
The device according to claim 1, wherein said first conductor layer comprises an aluminum-copper alloy containing 10 to 95 atomic % of copper.
Claim 4
Dependent Claim
23 words
The device according to claim 1, wherein said first conductor layer is covered with a high-melting point metallic material or a nitride thereof.
Claim 5
Dependent Claim
26 words
The device according to claim 1, wherein said first conductor layer is covered with an insulating material comprising a tantalum oxide or an oxide containing tantalum.
Claim 6
Dependent Claim
21 words
The device according to claim 1, wherein the surface of said first conductor layer is oxidized, nitrided, borided, carbided or silicided.
Claim 7
Dependent Claim
96 words
A driving circuit board for liquid crystal display device comprising: a substrate; a first conductor layer formed on the substrate, which provides an electrode or wiring; an insulating film covering the first conductor layer and the substrate; and a second conductor layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring; wherein said first conductor layer is formed of an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver.
Claim 8
Dependent Claim
96 words
A driving circuit board for liquid crystal display device comprising: a substrate; a first conductor layer formed on the substrate, which provides an electrode or wiring; an insulating film covering the first conductor layer and the substrate; and a second conductor layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring; wherein said first conductor layer is formed of an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver.
Claim 9
Dependent Claim
41 words
The circuit board according to claim 6, wherein said first conductor layer is formed of an aluminum-copper alloy containing 15 to 65 atomic % or 85 to less than 100 atomic % of copper, and the balance consisting essentially of aluminum.
Claim 10
Dependent Claim
35 words
The circuit board according to claim 6, wherein said first conductor layer is formed of an aluminum-titanium alloy containing 25 to less than 100 atomic % of titanium, and the balance consisting essentially of aluminum.
Claim 11
Dependent Claim
35 words
The circuit board according to claim 6, wherein said first conductor layer is formed of an aluminum-tungsten alloy containing 10 to less than 100 atomic % of tungsten, and the balance consisting essentially of aluminum.
Claim 12
Dependent Claim
18 words
The device according to claim 1, wherein said aluminum alloy is resistant to an indium tin oxide-etching liquid.
Claim 13
Dependent Claim
19 words
The circuit board according to claim 6, wherein said aluminum alloy is resistant to an indium tin oxide-etching liquid.
Claim 14
Dependent Claim
40 words
The device according to claim 1, wherein said first conductor layer is formed of an aluminum-copper alloy containing 15 to 65 atomic % or 85 to less than 100 atomic % of copper, and the balance consisting essentially of aluminum.
Claim 15
Dependent Claim
34 words
The device according to claim 1, wherein said first conductor layer is formed of an aluminum-titanium alloy containing 25 to less than 100 atomic % of titanium, and the balance consisting essentially of aluminum.
Claim 16
Dependent Claim
34 words
The device according to claim 1, wherein said first conductor layer is formed of an aluminum-tungsten alloy containing 10 to less than 100 atomic % of tungsten, and the balance consisting essentially of aluminum.
Claim 17
Independent Claim
123 words
A device having a multi-layered conductor structure comprising: a substrate; a first conductor patterned layer formed on the substrate, which provides an electrode or wiring, said first conductor layer comprising an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver; an insulating film covering the first conductor layer and the substrate; and a second conductor patterned layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring, said second conductor patterned layer having been patterned with an indium tin oxide-etching layer after said first conductor patterned layer and said insulating film have been formed on said substrate.
Claim 18
Independent Claim
123 words
A device having a multi-layered conductor structure comprising: a substrate; a first conductor patterned layer formed on the substrate, which provides an electrode or wiring, said first conductor layer comprising an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver; an insulating film covering the first conductor layer and the substrate; and a second conductor patterned layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring, said second conductor patterned layer having been patterned with an indium tin oxide-etching layer after said first conductor patterned layer and said insulating film have been formed on said substrate.
Claim 19
Dependent Claim
18 words
The device according to claim 15, wherein said aluminum alloy is resistant to an indium tin oxide-etching liquid.
Claim 20
Dependent Claim
41 words
The device according to claim 15, wherein said first conductor patterned layer is formed of an aluminum-copper alloy containing 15 to 65 atomic % or 85 to less than 100 atomic % of copper, and the balance consisting essentially of aluminum.
Claim 21
Dependent Claim
34 words
The device according to claim 15, wherein said first conductor layer is formed of an aluminum-titanium alloy containing 25 to less than 100 atomic % of titanium, and the balance consisting essentially of aluminum.
Claim 22
Dependent Claim
34 words
The device according to claim 15, wherein said first conductor layer is formed of an aluminum-tungsten alloy containing 10 to less than 100 atomic % of tungsten, and the balance consisting essentially of aluminum.
References Cited (Backward Citations)
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JPH01134426A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-21 | 1997-09-20 | 1998-03-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-21 | 2001-09-20 | 2002-03-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-21 | 2005-09-20 | 2006-03-22 | $7700.00 | Window Closed / Lapsed |