US5294750A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic packages and ceramic wiring board
Assignee: NGK Insulators Ltd
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Filing: 1991-09-16
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Granted: 1994-03-15
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Expires: 2011-09-16
Abstract
Abstract A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The heat radiating plate and the ceramic board are made of silicon nitride sintered body, which is characterized in that the number of grain boundaries per a 10 (my)m straight line drawn in an arbitrary section of the sintered (polycrystal) body is 20 or fewer.
Inventors
- 👤 Hiroaki Sakai
- 👤 Shinsuke Yano
- 👤 Takao Soma
- 👤 Manabu Isomura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:47
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/401; H10W40/00; H10W40/20; H10W40/25; H10W40/259; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W70/69; H10W70/692; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
82 words
A ceramic package for containing a semiconductor chip, comprising: a wiring board comprising a first wire distribution for transferring electrical signals and a second wire distribution for power supply; and a heat radiating plate for mounting a semiconductor chip thereon, said heat radiating plate being coupled to said wiring board and comprising silicon nitride, wherein said heat radiating plate has not more than 20 grain boundaries per a 10 μm straight line extending along an arbitrary section of said heat radiating plate.
Claim 2
Dependent Claim
82 words
A ceramic package for containing a semiconductor chip, comprising: a wiring board comprising a first wire distribution for transferring electrical signals and a second wire distribution for power supply; and a heat radiating plate for mounting a semiconductor chip thereon, said heat radiating plate being coupled to said wiring board and comprising silicon nitride, wherein said heat radiating plate has not more than 20 grain boundaries per a 10 μm straight line extending along an arbitrary section of said heat radiating plate.
Claim 3
Dependent Claim
24 words
The ceramic package of claim 1, wherein said heat radiating plate contains not more than 0.3 wt % of aluminum when calculated as alumina.
Claim 4
Dependent Claim
12 words
The ceramic package of claim 1, wherein said wiring board contains mullite.
Claim 5
Dependent Claim
52 words
The ceramic package of claim 1, wherein said wiring board contains a ceramic having a sintering temperature not greater than 1100° C., and wherein wire distribution conductors are formed in the heat radiating plate, said wire distribution conductors comprising an Ag series metal, a Cu series metal, or an Au series metal.
Claim 6
Dependent Claim
15 words
The ceramic package of claim 1, wherein said wiring board contains a polyimide series resin.
Claim 7
Dependent Claim
96 words
A ceramic package for containing a semiconductor chip, comprising: a ceramic base for mounting a semiconductor chip thereon, said ceramic base being a silicon nitride sintered body, wherein said ceramic base has not more than 20 grain boundaries per a 10 μm straight line extending along an arbitrary section of said ceramic base; a ceramic cap covering said ceramic base and being connected to said ceramic base by a glass or resin agent to seal the semiconductor chip in the ceramic package; and a metal lead frame arranged between the ceramic base and said ceramic cap.
Claim 8
Dependent Claim
96 words
A ceramic package for containing a semiconductor chip, comprising: a ceramic base for mounting a semiconductor chip thereon, said ceramic base being a silicon nitride sintered body, wherein said ceramic base has not more than 20 grain boundaries per a 10 μm straight line extending along an arbitrary section of said ceramic base; a ceramic cap covering said ceramic base and being connected to said ceramic base by a glass or resin agent to seal the semiconductor chip in the ceramic package; and a metal lead frame arranged between the ceramic base and said ceramic cap.
Claim 9
Dependent Claim
85 words
A ceramic package containing a semiconductor chip, comprising: a ceramic base for mounting a semiconductor chip thereon, said ceramic base being a silicon nitride sintered body, said ceramic base comprising not more than 0.3 wt % of aluminum when calculated as alumina; a ceramic cap covering said ceramic base and being connected to said ceramic base by a glass or resin agent to seal the semiconductor chip in the ceramic package; and a metal lead frame arranged between said ceramic base and said ceramic cap.
Claim 10
Dependent Claim
85 words
A ceramic package containing a semiconductor chip, comprising: a ceramic base for mounting a semiconductor chip thereon, said ceramic base being a silicon nitride sintered body, said ceramic base comprising not more than 0.3 wt % of aluminum when calculated as alumina; a ceramic cap covering said ceramic base and being connected to said ceramic base by a glass or resin agent to seal the semiconductor chip in the ceramic package; and a metal lead frame arranged between said ceramic base and said ceramic cap.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-14 | 1997-09-13 | 1998-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-14 | 2001-09-13 | 2002-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-14 | 2005-09-13 | 2006-03-15 | $7700.00 | Window Closed / Lapsed |