Patent US5291653A successfully refreshed from Google Patents.
US5291653A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacturing printed wiring boards having electromagnetic wave shielding
Assignee: Nippon CMK Corp
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Filing: 1992-04-16
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Granted: 1994-03-08
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Expires: 2012-04-16
Abstract
Abstract A method of manufacturing a printed wiring board comprises providing a substrate and forming a printed circuit having a ground circuit on the substrate. An insulating layer is formed on the substrate over the printed circuit and consists of two successively formed insulating layers having concentric circular apertures defining an opening above the ground circuit. The opening has a circular, stepped shape effective to facilitate the subsequent formation of an electromagnetic wave shielding layer. An electromagnetic wave shielding layer is formed by silk screening a conductive paste on the substrate over the insulating layer and through the opening and over the ground circuit.
Inventors
- 👤 Junichi Ichikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:55
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K2201/00; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K3/00; H05K3/46; H05K3/4644; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
155 words
A method of manufacturing a printed wiring board having electromagnetic wave shielding in which a printed wiring circuit made of an electrical conductor is provided on at least one side of a substrate, an electromagnetic wave shielding layer is provided over the entire surface or a desired portion of the printed wiring circuit through an insulating layer, and the printed wiring circuit is electrically connected with the electromagnetic wave shielding layer by way of a ground circuit of the printed wiring circuit, the insulating layer consisting of a plurality of electrically insulating layers, and the insulating layers defining above the ground circuit an opening having a configuration of a cup in section, the improvement comprising: form first and second insulating layers one atop the other each constituting part of said insulating layer so as to form said opening defined above the ground circuit having a configuration of a circle as viewed in top plan view.
Claim 2
Independent Claim
155 words
A method of manufacturing a printed wiring board having electromagnetic wave shielding in which a printed wiring circuit made of an electrical conductor is provided on at least one side of a substrate, an electromagnetic wave shielding layer is provided over the entire surface or a desired portion of the printed wiring circuit through an insulating layer, and the printed wiring circuit is electrically connected with the electromagnetic wave shielding layer by way of a ground circuit of the printed wiring circuit, the insulating layer consisting of a plurality of electrically insulating layers, and the insulating layers defining above the ground circuit an opening having a configuration of a cup in section, the improvement comprising: form first and second insulating layers one atop the other each constituting part of said insulating layer so as to form said opening defined above the ground circuit having a configuration of a circle as viewed in top plan view.
Claim 3
Independent Claim
114 words
A method of manufacturing a printed wiring board, comprising the steps: providing a substrate; forming a printed circuit having at least one ground circuit on at least one side of the substrate; successively forming only two insulating layers, one atop the other, on the substrate over the printed circuit, the two insulating layers jointly defining an opening above each ground circuit, each opening having a stepped, circular shape as viewed in top plan view to facilitate the subsequent formation of an electromagnetic wave shielding layer; and forming an electromagnetic wave shielding layer on the substrate and over the two insulating layers and through each opening and over each ground circuit which underlies each opening.
Claim 4
Independent Claim
114 words
A method of manufacturing a printed wiring board, comprising the steps: providing a substrate; forming a printed circuit having at least one ground circuit on at least one side of the substrate; successively forming only two insulating layers, one atop the other, on the substrate over the printed circuit, the two insulating layers jointly defining an opening above each ground circuit, each opening having a stepped, circular shape as viewed in top plan view to facilitate the subsequent formation of an electromagnetic wave shielding layer; and forming an electromagnetic wave shielding layer on the substrate and over the two insulating layers and through each opening and over each ground circuit which underlies each opening.
Claim 5
Dependent Claim
31 words
A method of manufacturing a printed circuit board according to claim 2; wherein the step of forming the printed circuit includes forming the printed circuit on both sides of the substrate.
Claim 6
Dependent Claim
40 words
A method of manufacturing a printed circuit board according to claim 2; wherein the step of forming the electromagnetic wave shielding layer is carried out by silk screening a conductive paste over the two insulating layers and through each opening.
Claim 7
Dependent Claim
39 words
A method of manufacturing a printed circuit board according to claim 2; wherein each circular opening in the first formed insulating layer has a diameter smaller than that of the overlying circular opening in the second formed insulating layer.
Claim 8
Independent Claim
157 words
A method of manufacturing a printed wiring board, comprising the steps: providing a substrate; forming a printed circuit having at least one ground circuit on at least one side of the substrate; successively forming only two insulating layers, one atop the other, on the substrate and over the printed circuit to define concentric circular apertures extending through the two insulating layers at locations above each ground circuit, each circular aperture in the first-formed insulating layer having a diameter smaller than that of the overlying circular aperture in the second-formed insulating layer to form an opening above each grounding circuit, each opening having a stepped, circular shape as viewed in top plan view to facilitate the subsequent formation of an electromagnetic wave shielding layer; and forming an electromagnetic wave shielding layer by silk screening a conductive paste on the substrate and over the insulating layer and through each opening and over each ground circuit which underlies each opening.
Claim 9
Independent Claim
157 words
A method of manufacturing a printed wiring board, comprising the steps: providing a substrate; forming a printed circuit having at least one ground circuit on at least one side of the substrate; successively forming only two insulating layers, one atop the other, on the substrate and over the printed circuit to define concentric circular apertures extending through the two insulating layers at locations above each ground circuit, each circular aperture in the first-formed insulating layer having a diameter smaller than that of the overlying circular aperture in the second-formed insulating layer to form an opening above each grounding circuit, each opening having a stepped, circular shape as viewed in top plan view to facilitate the subsequent formation of an electromagnetic wave shielding layer; and forming an electromagnetic wave shielding layer by silk screening a conductive paste on the substrate and over the insulating layer and through each opening and over each ground circuit which underlies each opening.
Claim 10
Dependent Claim
31 words
A method of manufacturing a printed circuit board according to claim 6; wherein the step of forming the printed circuit includes forming the printed circuit on both sides of the substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-07 | 1997-09-06 | 1998-03-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-07 | 2001-09-06 | 2002-03-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-07 | 2005-09-06 | 2006-03-08 | $7700.00 | Window Closed / Lapsed |