US5286926A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package and process for producing same
Assignee: Niterra Co Ltd
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Filing: 1992-04-15
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Granted: 1994-02-15
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Expires: 2012-04-15
Abstract
Abstract The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.
Inventors
- 👤 Yukihiro Kimura
- 👤 Nobuhiko Miyawaki
- 👤 Masao Kuroda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W44/00; H10W44/20; H10W44/203; H10W44/209; H10W44/212; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
71 words
An integrated circuit package comprising: an insulating substrate having through holes; conductor poles extending respectively through the substrate holes; metallized layers disposed along said substrate holes and disposed about and shielding said conductor poles, said metallized layers being in direct contact with the walls of of said through holes; and insulating layers located respectively intermediate said metallized layers and said conductor poles to insulate said metallized layers from said conductor poles.
Claim 2
Dependent Claim
71 words
An integrated circuit package comprising: an insulating substrate having through holes; conductor poles extending respectively through the substrate holes; metallized layers disposed along said substrate holes and disposed about and shielding said conductor poles, said metallized layers being in direct contact with the walls of of said through holes; and insulating layers located respectively intermediate said metallized layers and said conductor poles to insulate said metallized layers from said conductor poles.
Claim 3
Dependent Claim
19 words
The integrated circuit package of claim 1, wherein said metallized layers are formed by sputtering, plating, or evaporation processes.
Claim 4
Dependent Claim
25 words
The integrated circuit package of claim 2, further comprising a conductive layer disposed on said substrate and electrically connecting said metallized layers to each other.
Claim 5
Dependent Claim
21 words
The integrated circuit package of claim 3, wherein said metallized layers have a thickness of not more than about 10 μm.
Claim 6
Dependent Claim
18 words
The integrated circuit package of claim 1, wherein said conductor poles are formed by sputtering, plating or casting.
Claim 7
Dependent Claim
26 words
The integrated circuit package of claim 1, wherein said insulating layers are disposed along the substrate holes and on the inner peripheries of said metallized layers.
Claim 8
Dependent Claim
21 words
The integrated circuit package of claim 1, wherein said conductor poles are pin members which are coated with said insulating layers.
Claim 9
Dependent Claim
24 words
The integrated circuit package of claim 5, wherein said conductor poles have a pitch within an approximate range of 0.20 mm to 0.40 mm.
Claim 10
Dependent Claim
24 words
The integrated circuit package of claim 7, wherein said conductor poles have a pitch within an approximate range of 0.20 mm to 0.40 mm.
Claim 11
Dependent Claim
24 words
The integrated circuit package of claim 6, wherein said insulating layers have a thickness within an approximate range of 2 mm to 20 mm.
Claim 12
Dependent Claim
23 words
The integrated circuit package of claim 7, wherein said insulating layers have a thickness of from about 10 μm to about 20 μm.
Claim 13
Independent Claim
70 words
A method for forming an integrated circuit package comprising the steps of: providing an insulating substrate having through holes, disposing conductor poles to extend through the substrate holes; forming metallized layers in direct contact with the walls of the substrate holes to provide a shield about the conductor poles; and forming insulating layers intermediate said metallized layers and said conductor poles to insulate said metallized layers from said conductor poles.
Claim 14
Independent Claim
70 words
A method for forming an integrated circuit package comprising the steps of: providing an insulating substrate having through holes, disposing conductor poles to extend through the substrate holes; forming metallized layers in direct contact with the walls of the substrate holes to provide a shield about the conductor poles; and forming insulating layers intermediate said metallized layers and said conductor poles to insulate said metallized layers from said conductor poles.
Claim 15
Dependent Claim
26 words
The method of claim 12, wherein said step of forming said metallized layers comprises sputtering metal on the walls of the selected number of through holes.
Claim 16
Dependent Claim
26 words
The method of claim 12, wherein said step of forming said metallized layers comprises plating metal on the walls of the selected number of through holes.
Claim 17
Dependent Claim
26 words
The method of claim 12, wherein said step of forming said metallized layers comprises evaporating metal on the walls of the selected number of through holes.
Claim 18
Dependent Claim
41 words
The method of claim 12, wherein said step of forming said metallized layers includes the step of electrically connecting said metallized layers to each other through a conductive layer dipped on a side of said substrate from which the holes extend.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-14 | 1997-08-16 | 1998-02-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-14 | 2001-08-16 | 2002-02-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-14 | 2005-08-16 | 2006-02-15 | $7700.00 | Window Closed / Lapsed |