Method of manufacturing a semiconductor device of an anode short circuit structure

Claim 1

A method of manufacturing a semiconductor device, comprising the steps of: selectively diffusing an impurity of a first conductivity type and another impurity of a second conductivity type into a main surface region of a semiconductor substrate so as to form first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types by thermal diffusion of impurities into the first semiconductor layer; and polishing the opposite main surface of the semiconductor substrate to expose the first semiconductor regions of the first conductivity type and the second semiconductor regions of the second conductivity type.

Claim 2

A method of manufacturing a semiconductor device, comprising the steps of: selectively diffusing an impurity of a first conductivity type and another impurity of a second conductivity type into a main surface region of a semiconductor substrate so as to form first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types by thermal diffusion of impurities into the first semiconductor layer; and polishing the opposite main surface of the semiconductor substrate to expose the first semiconductor regions of the first conductivity type and the second semiconductor regions of the second conductivity type.

Claim 3

A method of manufacturing a semiconductor device, comprising the steps of: selectively diffusing an impurity of a first conductivity type and another impurity of a second conductivity type into a main surface region of a semiconductor substrate so as to form first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type; selectively forming third semiconductor regions of the first conductivity type and fourth semiconductor regions of the second conductivity type in the opposite main surface region of the semiconductor substrate by selectively diffusing impurities of the first and second conductivity types into the substrate through the opposite main surface; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types by thermal diffusion of impurities into the first semiconductor layer; and combining the first and third semiconductor regions by thermal diffusion of an impurity and combining the second and fourth semiconductor regions by thermal diffusion of another impurity.

Claim 4

A method of manufacturing a semiconductor device, comprising the steps of: selectively diffusing an impurity of a first conductivity type and another impurity of a second conductivity type into a main surface region of a semiconductor substrate so as to form first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type; selectively forming third semiconductor regions of the first conductivity type and fourth semiconductor regions of the second conductivity type in the opposite main surface region of the semiconductor substrate by selectively diffusing impurities of the first and second conductivity types into the substrate through the opposite main surface; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types by thermal diffusion of impurities into the first semiconductor layer; and combining the first and third semiconductor regions by thermal diffusion of an impurity and combining the second and fourth semiconductor regions by thermal diffusion of another impurity.

Claim 5

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming by thermal diffusion of an impurity fifth semiconductor regions of a second conductivity type in a main surface region of a semiconductor substrate of a first conductivity type having a high impurity concentration; forming a second semiconductor layer of the first conductivity type or a second conductivity type on the semiconductor substrate, said second semiconductor layer having a low impurity concentration; selectively forming first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type in the second semiconductor layer by selective diffusion of impurities; forming a first semiconductor layer of the second conductivity type on the second semiconductor layer, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types on the first semiconductor layer by thermal diffusion of impurities; applying a heat treatment to combine the first semiconductor regions and the main surface region of a semiconductor substrate, and the second and fifth semiconductor regions by thermal diffusion of an impurity; and polishing the opposite main surface of the semiconductor substrate to expose the semiconductor regions of the first and second conductivity types.

Claim 6

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming by thermal diffusion of an impurity fifth semiconductor regions of a second conductivity type in a main surface region of a semiconductor substrate of a first conductivity type having a high impurity concentration; forming a second semiconductor layer of the first conductivity type or a second conductivity type on the semiconductor substrate, said second semiconductor layer having a low impurity concentration; selectively forming first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type in the second semiconductor layer by selective diffusion of impurities; forming a first semiconductor layer of the second conductivity type on the second semiconductor layer, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types on the first semiconductor layer by thermal diffusion of impurities; applying a heat treatment to combine the first semiconductor regions and the main surface region of a semiconductor substrate, and the second and fifth semiconductor regions by thermal diffusion of an impurity; and polishing the opposite main surface of the semiconductor substrate to expose the semiconductor regions of the first and second conductivity types.

Claim 7

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming sixth semiconductor regions of a first conductivity type in a main surface region of a semiconductor substrate of a second conductivity type having a high impurity concentration; forming a second semiconductor layer of the first or second conductivity type having a low impurity concentration on the semiconductor substrate; selectively forming first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type in the second semiconductor layer by means of a selective impurity diffusion; forming a first semiconductor layer of the second conductivity type on the second semiconductor layer, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types on the first semiconductor layer by means of thermal diffusion of impurities; applying a heat treatment to combine the second semiconductor regions and the main surface of a semiconductor substrate, and the first and sixth semiconductor regions by thermal diffusion of an impurity; and polishing the opposite main surface of the semiconductor substrate to expose the semiconductor regions of the first and second conductivity types.

Claim 8

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming sixth semiconductor regions of a first conductivity type in a main surface region of a semiconductor substrate of a second conductivity type having a high impurity concentration; forming a second semiconductor layer of the first or second conductivity type having a low impurity concentration on the semiconductor substrate; selectively forming first semiconductor regions of the first conductivity type and second semiconductor regions of the second conductivity type in the second semiconductor layer by means of a selective impurity diffusion; forming a first semiconductor layer of the second conductivity type on the second semiconductor layer, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types on the first semiconductor layer by means of thermal diffusion of impurities; applying a heat treatment to combine the second semiconductor regions and the main surface of a semiconductor substrate, and the first and sixth semiconductor regions by thermal diffusion of an impurity; and polishing the opposite main surface of the semiconductor substrate to expose the semiconductor regions of the first and second conductivity types.

Claim 9

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming second semiconductor regions of a second conductivity type in a main surface region of a semiconductor substrate of a first conductivity type by impurity diffusion; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types on the first semiconductor layer by thermal diffusion of impurities; and polishing the opposite main surface of the semiconductor substrate to expose the second semiconductor region of the second conductivity type.

Claim 10

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming second semiconductor regions of a second conductivity type in a main surface region of a semiconductor substrate of a first conductivity type by impurity diffusion; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types on the first semiconductor layer by thermal diffusion of impurities; and polishing the opposite main surface of the semiconductor substrate to expose the second semiconductor region of the second conductivity type.

Claim 11

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming first semiconductor regions of a first conductivity type by impurity diffusion in a main surface region of a semiconductor substrate of a second conductivity type; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types by thermal diffusion of impurities into the first semiconductor layer; and polishing the opposite main surface of the semiconductor substrate to expose the first semiconductor region of the first conductivity type.

Claim 12

A method of manufacturing a semiconductor device, comprising the steps of: selectively forming first semiconductor regions of a first conductivity type by impurity diffusion in a main surface region of a semiconductor substrate of a second conductivity type; forming a first semiconductor layer of the second conductivity type on the semiconductor substrate, said first semiconductor layer being of at least a single layer structure; forming element regions of the first and second conductivity types by thermal diffusion of impurities into the first semiconductor layer; and polishing the opposite main surface of the semiconductor substrate to expose the first semiconductor region of the first conductivity type.

Claim 13

The method of manufacturing a semiconductor device according to any one of claims 1 to 6, wherein said first semiconductor layer is of a laminate structure consisting of a plurality of semiconductor layers differing from each other in the impurity concentration.