Patent US3376478A successfully refreshed from Google Patents.
Patent US5285571A successfully refreshed from Google Patents.
US5285571A
Expired / Lapsed
US
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Method for extending an electrical conductor over an edge of an HDI substrate
Assignee: Lockheed Martin Corp
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Filing: 1992-10-13
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Granted: 1994-02-15
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Expires: 2012-10-13
Abstract
Abstract A process and configuration are described which enable the I/O metal fingers of any high density interconnect (HDI) module to be extended over the edge of a substrate at the end of circuit fabrication, thus enabling fabrication of circuits for arrangement in three-dimensional stacks. The module includes a first dielectric layer covering one or more electrical conductors on a substrate. The first dielectric layer is ablated to expose a portion of at least one electrical conductor and a second dielectric layer is then applied over the first dielectric layer and the exposed portion of the electrical conductor except for an extremity of the conductor. A second electrical conductor is subsequently applied and patterned to cover a portion of the second dielectric layer, the extremity of the conductor, and at least a portion of one edge of the substrate.
Inventors
- 👤 Thomas B. Gorczyca
- 👤 Paul A. McConnelee
- 👤 Richard J. Saia
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 23:00
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W70/611; H10W70/614; H10W90/00; H10W72/00; H10W72/834; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49155; Y10T29/49158
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
182 words
A method for extending an electrical conductor over an edge of a substrate, the conductor being situated within a first dielectric layer previously fabricated on a surface of the substrate and being conductively coupled to an integrated circuit situated on one portion of the substrate surface, comprising the steps of: ablating a part of the existing first dielectric layer on a second portion of the substrate, devoid of any integrated circuit, to expose a portion of the electrical conductor situated in the second substrate portion; applying a second dielectric layer over at least a part of the first dielectric layer and over the second substrate portion and including the exposed electrical conductor portion, with the second dielectric layer not being applied to a region extending from an edge of the substrate onto an adjacent electrical conductor extremity portion, said edge disposed at an angle to the substrate surface; and applying an electric-conducting extension means patterned to cover a portion of the second dielectric layer, a part of the electrical conductor extremity portion, and at least a portion of the angularly-disposed substrate edge.
Claim 2
Independent Claim
182 words
A method for extending an electrical conductor over an edge of a substrate, the conductor being situated within a first dielectric layer previously fabricated on a surface of the substrate and being conductively coupled to an integrated circuit situated on one portion of the substrate surface, comprising the steps of: ablating a part of the existing first dielectric layer on a second portion of the substrate, devoid of any integrated circuit, to expose a portion of the electrical conductor situated in the second substrate portion; applying a second dielectric layer over at least a part of the first dielectric layer and over the second substrate portion and including the exposed electrical conductor portion, with the second dielectric layer not being applied to a region extending from an edge of the substrate onto an adjacent electrical conductor extremity portion, said edge disposed at an angle to the substrate surface; and applying an electric-conducting extension means patterned to cover a portion of the second dielectric layer, a part of the electrical conductor extremity portion, and at least a portion of the angularly-disposed substrate edge.
Claim 3
Dependent Claim
18 words
The method of claim 1, wherein the second dielectric layer is applied by the SPI/epoxy-Kapton polyimide multi-lamination process.
Claim 4
Dependent Claim
14 words
The method of claim 1, further including the step of tapering the substrate edge.
Claim 5
Dependent Claim
52 words
The method of claim 1, further including the steps of: removing the electrical-conducting extension means in order to allow for rework; and reapplying a desired electrical-conducting extension means patterned to cover, after rework, a portion of the second dielectric layer, the electrically-conducting extremity, and at least a portion of the substrate edge.
Claim 6
Independent Claim
137 words
A method for extending an electrical conductor over an edge of a substrate, the conductor being situated within a first dielectric layer previously fabricated on a surface of the substrate and being conductively coupled to an integrated circuit situated on one portion of the substrate surface, comprising the steps of: ablating a part of the existing first dielectric layer on a second portion of the substrate, devoid of any integrated circuit and adjacent to the substrate edge, to expose an extremity portion of the electrical conductor adjacent to an edge of the substrate, said edge disposed at an angle to the substrate surface; and applying an electric-conducting extension means patterned to cover a portion of the first dielectric layer, a part of the electrical conductor extremity portion, and at least a portion of the angularly-disposed substrate edge.
Claim 7
Independent Claim
137 words
A method for extending an electrical conductor over an edge of a substrate, the conductor being situated within a first dielectric layer previously fabricated on a surface of the substrate and being conductively coupled to an integrated circuit situated on one portion of the substrate surface, comprising the steps of: ablating a part of the existing first dielectric layer on a second portion of the substrate, devoid of any integrated circuit and adjacent to the substrate edge, to expose an extremity portion of the electrical conductor adjacent to an edge of the substrate, said edge disposed at an angle to the substrate surface; and applying an electric-conducting extension means patterned to cover a portion of the first dielectric layer, a part of the electrical conductor extremity portion, and at least a portion of the angularly-disposed substrate edge.
Claim 8
Dependent Claim
34 words
The method of claim 5, wherein the step of ablating is performed so as to taper part of the first dielectric layer between an outermost surface of the fist dielectric layer and the substrate.
Claim 9
Dependent Claim
52 words
The method of claim 5, further including the steps of: removing the electrically-conducting extension means in order to allow for rework; and reapplying a desired electrical-conducting extension means patterned to cover, after rework, a portion of the first dielectric layer, the electrically-conducting extremity, and at least a portion of the substrate edge.
Claim 10
Dependent Claim
16 words
The method of claim 5, further including the step of tapering the edge of the substrate.
Claim 11
Independent Claim
181 words
A method for extending an electrical conductor over an edge of an HDI ceramic substrate, the conductor being situated within a first dielectric layer previously fabricated on a surface of the substrate and being conductively coupled to an HDI circuit situated on one portion of the substrate surface, comprising the steps of: ablating a part of the existing first dielectric layer on a second portion of the substrate, devoid of any integrated circuit, to expose a portion of the electrical conductor situated in the second substrate portion; applying a second dielectric layer over at least a part of the first dielectric layer and over the second substrate portion and including the exposed electrical conductor portion, with the second dielectric layer not being applied to a region extending from an edge of the substrate onto an adjacent electrical conductor extremity portion; and applying and electric-conducting extension means patterned to cover a portion of the second dielectric layer, a part of the electrical conductor extremity portion, and at least a portion of the substrate edge disposed at an angle to the substrate surface.
Claim 12
Independent Claim
181 words
A method for extending an electrical conductor over an edge of an HDI ceramic substrate, the conductor being situated within a first dielectric layer previously fabricated on a surface of the substrate and being conductively coupled to an HDI circuit situated on one portion of the substrate surface, comprising the steps of: ablating a part of the existing first dielectric layer on a second portion of the substrate, devoid of any integrated circuit, to expose a portion of the electrical conductor situated in the second substrate portion; applying a second dielectric layer over at least a part of the first dielectric layer and over the second substrate portion and including the exposed electrical conductor portion, with the second dielectric layer not being applied to a region extending from an edge of the substrate onto an adjacent electrical conductor extremity portion; and applying and electric-conducting extension means patterned to cover a portion of the second dielectric layer, a part of the electrical conductor extremity portion, and at least a portion of the substrate edge disposed at an angle to the substrate surface.
Claim 13
Dependent Claim
18 words
The method of claim 9, wherein the second dielectric layer is applied by the SPI/epoxy-Kapton polyimide multi-lamination process.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-14 | 1997-08-16 | 1998-02-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-14 | 2001-08-16 | 2002-02-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-14 | 2005-08-16 | 2006-02-15 | $7700.00 | Window Closed / Lapsed |