Position detecting method

Claim 2

A position detecting method, wherein a radiation beam is projected to a grating pattern on a substrate, a diffraction beam from the pattern and a reflectively scattered beam from an edge of a peripheral portion of the pattern advancing in substantially the same direction as the diffraction beam from the pattern are received by a sensor array and the position of the substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the substrate on the basis of the extracted signal.

Claim 3

A method according to claim 1, wherein the grating pattern has an optical power, such that the position of incidence of the diffraction beam upon the sensor array changes with the position of the substrate.

Claim 4

A method according to claim 2, wherein the grating pattern comprises a zone plate.

Claim 5

A position detecting method, wherein a radiation beam is projected to a first substrate by which a diffraction beam is produced through a grating pattern on the first substrate and a grating mark on a second substrate, the produced diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of the grating pattern advancing in substantially the same direction as the produced diffraction beam are received by a sensor array and the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 6

A position detecting method, wherein a radiation beam is projected to a first substrate by which a diffraction beam is produced through a grating pattern on the first substrate and a grating mark on a second substrate, the produced diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of the grating pattern advancing in substantially the same direction as the produced diffraction beam are received by a sensor array and the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 7

A method according to claim 4, wherein each of the grating pattern and the grating mark has an optical power, such that the position of incidence of the diffraction beam upon the sensor array changes with the position of the second substrate relative to the first substrate.

Claim 8

A method according to claim 5, wherein each of the grating pattern and the grating mark comprises a zone plate.

Claim 9

A method according to claim 4, further comprising determining the position of the second substrate relative to the first substrate on the basis of the intensity of the extracted signal.

Claim 10

A position detecting method, wherein a radiation beam is projected to a linear zone plate on a first substrate by which a linear beam is produced, the produced linear beam is projected to a linear grating mark on a second substrate, a diffraction beam emanating from the grating mark in a predetermined direction and a reflectively scattered beam from an edge of a peripheral portion of the zone plate are received by a sensor array, the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array and the intensity of the diffraction beam changes with the position of the linear grating mark relative to the linear beam, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 11

A position detecting method, wherein a radiation beam is projected to a linear zone plate on a first substrate by which a linear beam is produced, the produced linear beam is projected to a linear grating mark on a second substrate, a diffraction beam emanating from the grating mark in a predetermined direction and a reflectively scattered beam from an edge of a peripheral portion of the zone plate are received by a sensor array, the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array and the intensity of the diffraction beam changes with the position of the linear grating mark relative to the linear beam, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 12

A position detecting method, wherein a radiation beam is projected to a first zone plate on a first substrate, a diffraction beam from the first zone plate is projected to a second zone plate on a second substrate, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of the first zone plate advancing in substantially the same direction as the diffraction beam from the first zone plate are received by a sensor array, the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array, and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 13

A position detecting method, wherein a radiation beam is projected to a first zone plate on a first substrate, a diffraction beam from the first zone plate is projected to a second zone plate on a second substrate, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of the first zone plate advancing in substantially the same direction as the diffraction beam from the first zone plate are received by a sensor array, the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array, and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 14

A semiconductor device manufacturing method, wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of the grating pattern advancing in substantially the same direction as the diffraction beam are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, a circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 15

A semiconductor device manufacturing method, wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of the grating pattern advancing in substantially the same direction as the diffraction beam are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, a circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 16

A semiconductor device manufacturing method, wherein a radiation beam is projected to a linear zone plate on a mask by which a linear beam is produced, the produced linear beam is projected to a linear grating mark on a wafer, a diffraction beam emanating from the grating mark in a predetermined direction and a reflectively scattered beam from an edge of a peripheral portion of the zone plate advancing in substantially the same direction as the diffraction beam are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, wherein, after alignment of the mask and the wafer based on the determination, the wafer is exposed to a circuit pattern of the mask whereby the latter is printed on the former, and the intensity of the diffraction beam changes with the position of the linear grating mark relative to the linear beam, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 17

A semiconductor device manufacturing method, wherein a radiation beam is projected to a linear zone plate on a mask by which a linear beam is produced, the produced linear beam is projected to a linear grating mark on a wafer, a diffraction beam emanating from the grating mark in a predetermined direction and a reflectively scattered beam from an edge of a peripheral portion of the zone plate advancing in substantially the same direction as the diffraction beam are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, wherein, after alignment of the mask and the wafer based on the determination, the wafer is exposed to a circuit pattern of the mask whereby the latter is printed on the former, and the intensity of the diffraction beam changes with the position of the linear grating mark relative to the linear beam, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 18

A semiconductor device manufacturing method, wherein a radiation beam is projected to a first zone plate on a mask, a diffraction beam from the first zone plate is projected to a second zone plate on a wafer, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of the first zone plate advancing in substantially the same direction as the diffraction beam from the first zone plate are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, wherein, after alignment of the mask and the wafer based on the determination, the wafer is exposed to a circuit pattern of the mask whereby the latter is printed on the former, and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 19

A semiconductor device manufacturing method, wherein a radiation beam is projected to a first zone plate on a mask, a diffraction beam from the first zone plate is projected to a second zone plate on a wafer, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of the first zone plate advancing in substantially the same direction as the diffraction beam from the first zone plate are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, wherein, after alignment of the mask and the wafer based on the determination, the wafer is exposed to a circuit pattern of the mask whereby the latter is printed on the former, and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 20

An alignment and exposure apparatus for aligning a mask and a wafer by using a zone plate on the mask and a linear grating mark on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the zone plate and the grating mark are so arranged that an intensity of a diffraction beam which is produced by projecting a linear beam, formed by the zone plate, to the linear grating mark and which emanates from the grating mark along a predetermined direction, changes with the position of the grating mark relative to the linear beam, said apparatus comprising: means for projecting a radiation beam to the mask to produce the linear beam and a reflectively scattered beam; a linear receiving optical system comprising a sensor array for receiving the diffraction beam, wherein said light receiving optical system is correlated with the zone plate so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the zone plate advancing in substantially the same direction as the diffraction beam are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 21

An alignment and exposure apparatus for aligning a mask and a wafer by using a zone plate on the mask and a linear grating mark on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the zone plate and the grating mark are so arranged that an intensity of a diffraction beam which is produced by projecting a linear beam, formed by the zone plate, to the linear grating mark and which emanates from the grating mark along a predetermined direction, changes with the position of the grating mark relative to the linear beam, said apparatus comprising: means for projecting a radiation beam to the mask to produce the linear beam and a reflectively scattered beam; a linear receiving optical system comprising a sensor array for receiving the diffraction beam, wherein said light receiving optical system is correlated with the zone plate so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the zone plate advancing in substantially the same direction as the diffraction beam are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 22

An alignment and exposure apparatus for aligning a mask and a wafer by using a first zone plate on the mask and a second zone plate on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the first and second zone plates are so arranged that a position on a predetermined plane of a diffraction beam diffracted by the first and second zone plates, respectively, changes with the position of the second zone plate relative to the first zone plate, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array provided on the predetermined plate, for receiving the diffraction beam, wherein said light receiving optical system is correlated with the first zone plate so that the diffraction beam and a relatively scattered beam produced by an edge of a peripheral portion of the first zone plate advancing in substantially the same direction as the diffraction beam are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 23

An alignment and exposure apparatus for aligning a mask and a wafer by using a first zone plate on the mask and a second zone plate on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the first and second zone plates are so arranged that a position on a predetermined plane of a diffraction beam diffracted by the first and second zone plates, respectively, changes with the position of the second zone plate relative to the first zone plate, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array provided on the predetermined plate, for receiving the diffraction beam, wherein said light receiving optical system is correlated with the first zone plate so that the diffraction beam and a relatively scattered beam produced by an edge of a peripheral portion of the first zone plate advancing in substantially the same direction as the diffraction beam are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 24

An alignment and exposure apparatus for aligning a mask and a wafer by using a grating pattern on the mask and a grating mark on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the grating pattern and the grating mark are so arranged that a diffraction beam produced through the grating pattern and the grating mark bears information representing the position of the grating mark relative to the grating pattern, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array for receiving the diffraction beam, wherein said light receiving optical system is correlated with the grating pattern so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the grating pattern advancing in substantially the same direction as the diffraction beam are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 25

An alignment and exposure apparatus for aligning a mask and a wafer by using a grating pattern on the mask and a grating mark on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the grating pattern and the grating mark are so arranged that a diffraction beam produced through the grating pattern and the grating mark bears information representing the position of the grating mark relative to the grating pattern, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array for receiving the diffraction beam, wherein said light receiving optical system is correlated with the grating pattern so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the grating pattern advancing in substantially the same direction as the diffraction beam are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 26

A position detecting method, wherein a radiation beam is projected to a grating pattern on a substrate, a diffraction beam from the pattern and a reflectively scattered beam from an edge of a peripheral portion of another pattern, adjacent to the grating position are received by a sensor array, and the position of the substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the substrate on the basis of the extracted signal.

Claim 27

A position detecting method, wherein a radiation beam is projected to a grating pattern on a substrate, a diffraction beam from the pattern and a reflectively scattered beam from an edge of a peripheral portion of another pattern, adjacent to the grating position are received by a sensor array, and the position of the substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the substrate on the basis of the extracted signal.

Claim 28

A method according to claim 16, wherein the grating pattern has an optical power, such that the position of incidence of the diffraction beam upon the sensor array changes with the position of the substrate.

Claim 29

A method according to claim 17, wherein the grating pattern comprises a zone plate.

Claim 30

A position detecting method, wherein a radiation beam is projected to a first substrate by which a diffraction beam is produced through a grating pattern on the first substrate and a grating mark on a second substrate, the produced diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of another pattern, adjacent to the grating pattern, are received by a sensor array and the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 31

A position detecting method, wherein a radiation beam is projected to a first substrate by which a diffraction beam is produced through a grating pattern on the first substrate and a grating mark on a second substrate, the produced diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of another pattern, adjacent to the grating pattern, are received by a sensor array and the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 32

A method according to claim 19, wherein each of the grating pattern and the grating mark has an optical power, such that the position of incidence of the diffraction beam upon the sensor array changes with the position of the second substrate relative to the first substrate.

Claim 33

A method according to claim 19, wherein each of the grating pattern and the grating mark comprises a zone plate.

Claim 34

A method according to claim 19, further comprising determining the position on the basis of the intensity of the extracted signal.

Claim 35

A position detecting method, wherein a radiation beam is projected to a first zone plate on a first substrate, a diffraction beam from the first zone plate is projected to a second zone plate on a second substrate, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of a pattern, adjacent to the first zone plate, are received by a sensor array, the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 36

A position detecting method, wherein a radiation beam is projected to a first zone plate on a first substrate, a diffraction beam from the first zone plate is projected to a second zone plate on a second substrate, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of a pattern, adjacent to the first zone plate, are received by a sensor array, the position of the second substrate relative to the first substrate is determined on the basis of a signal from the sensor array and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the position of the second substrate relative to the first substrate on the basis of the extracted signal.

Claim 37

A semiconductor device manufacturing method, wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of a circuit pattern, adjacent to the grating pattern, are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, a circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 38

A semiconductor device manufacturing method, wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of a circuit pattern, adjacent to the grating pattern, are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, a circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 39

A semiconductor device manufacturing method, wherein a radiation beam is projected to a first zone plate on a mask, a diffraction beam from the first zone plate is projected to a second zone plate on a wafer, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of a circuit pattern, adjacent to the first zone plate, are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, wherein, after alignment of the mask and the wafer based on the determination, the wafer is exposed to a circuit pattern of the mask whereby the latter is printed on the former, and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 40

A semiconductor device manufacturing method, wherein a radiation beam is projected to a first zone plate on a mask, a diffraction beam from the first zone plate is projected to a second zone plate on a wafer, the diffraction beam diffracted again by the second zone plate and a reflectively scattered beam from an edge of a peripheral portion of a circuit pattern, adjacent to the first zone plate, are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, wherein, after alignment of the mask and the wafer based on the determination, the wafer is exposed to a circuit pattern of the mask whereby the latter is printed on the former, and the position of incidence of the diffraction beam upon the sensor array changes with the position of the second zone plate relative to the first zone plate, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 41

An alignment and exposure apparatus for aligning a mask and a wafer by using a first zone plate on the mask and a second zone plate on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the first and second zone plates are so arranged that a position on a predetermined plane of a diffraction beam diffracted by the first and second zone plates, respectively, changes with the position of the second zone plate relative to the first zone plate, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array provided on the predetermined plane, for receiving the diffraction beam, wherein said light receiving optical system is correlated with the first zone plate so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the circuit pattern, adjacent to the first zone plate, are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined position deviation.

Claim 42

An alignment and exposure apparatus for aligning a mask and a wafer by using a first zone plate on the mask and a second zone plate on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the first and second zone plates are so arranged that a position on a predetermined plane of a diffraction beam diffracted by the first and second zone plates, respectively, changes with the position of the second zone plate relative to the first zone plate, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array provided on the predetermined plane, for receiving the diffraction beam, wherein said light receiving optical system is correlated with the first zone plate so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the circuit pattern, adjacent to the first zone plate, are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined position deviation.

Claim 43

An alignment and exposure apparatus for aligning a mask and a wafer by using a grating pattern on the mask and a grating mark on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the grating pattern and the grating mark are so arranged that a diffraction beam produced through the grating pattern and the grating mark bears information representing the position of the grating mark relative to the grating pattern, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array for receiving the diffraction beam, wherein said light receiving optical system is correlated with the grating pattern so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the circuit pattern, adjacent to the grating pattern, are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 44

An alignment and exposure apparatus for aligning a mask and a wafer by using a grating pattern on the mask and a grating mark on the wafer and for exposing the wafer to a circuit pattern of the mask, wherein the grating pattern and the grating mark are so arranged that a diffraction beam produced through the grating pattern and the grating mark bears information representing the position of the grating mark relative to the grating pattern, said apparatus comprising: means for projecting a radiation beam to the mask to produce the diffraction beam and a reflectively scattered beam; a light receiving optical system comprising a sensor array for receiving the diffraction beam, wherein said light receiving optical system is correlated with the grating pattern so that the diffraction beam and a reflectively scattered beam produced by an edge of a peripheral portion of the circuit pattern, adjacent to the grating pattern, are separated from each other upon said sensor array; processing means for processing an output signal produced by said sensor array, said processing means comprising means for extracting a signal, out of the output signal, corresponding to the diffraction beam and for determining any positional deviation of the wafer with respect to the mask on the basis of the extracted signal; and means for changing the position of the wafer relative to the mask to correct the determined positional deviation.

Claim 45

A semiconductor device manufactured by a method wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam which emanates from an edge of a peripheral portion of the grating pattern and which advances substantially in the same direction as the diffraction beam are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, a circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 46

A semiconductor device manufactured by a method wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam which emanates from an edge of a peripheral portion of the grating pattern and which advances substantially in the same direction as the diffraction beam are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, a circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 47

A semiconductor device manufactured by a method wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of a circuit pattern of the mask, adjacent to the grating pattern are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, the circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.

Claim 48

A semiconductor device manufactured by a method wherein a radiation beam is projected to a mask by which a diffraction beam is produced through a grating pattern on the mask and a grating mark on a wafer, the diffraction beam and a reflectively scattered beam from an edge of a peripheral portion of a circuit pattern of the mask, adjacent to the grating pattern are received by a sensor array, any positional deviation of the wafer with respect to the mask is determined on the basis of a signal from the sensor array, and wherein, after the mask and the wafer are aligned with each other on the basis of the determination, the circuit pattern of the mask is printed on the wafer, said method comprising: substantially separating the diffraction beam and the reflectively scattered beam from each other on the sensor array; processing a signal produced by the sensor array to extract a signal corresponding to the diffraction beam; and determining the positional deviation of the wafer with respect to the mask on the basis of the extracted signal.