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US5283454A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device including very low sheet resistivity buried layer

Assignee: Apple Inc
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Filing: 1992-09-11
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Granted: 1994-02-01
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Expires: 2012-09-11
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Abstract

Abstract A metal or silicide buried layer in MOS semiconductor devices provides a drain contact on the upper surface of the device with a greatly reduced resistance. The methods of manufacture include depositing the buried layer, rather than diffusing, so that interference with other components is greatly reduced and spacing between components is reduced to reduce the over-all size of the device.

Inventors

  • 👤 Bertrand Cambou

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 19:59
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/028; H10D30/0291; H10D30/60; H10D30/64; H10D30/66; H10D30/663; H10D64/00; H10D64/20; H10D64/23; H10D64/251; H10D64/252; H10D64/2527; H10W; H10W15/00; H10W15/01; H10D62/00; H10D62/10; H10D62/17; H10D62/351; H10D62/357; H10D62/364; H10D64/256

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 94 words
A semiconductor device with a very low sheet resistivity buried layer comprising: a substrate; a semiconductor device formed in the substrate and having a plurality of electrodes; a very low sheet resistivity buried layer positioned in the substrate below the semiconductor device and in connection with one of the plurality of electrodes of the semiconductor device, the buried layer including a refractory metal; and a conductive area formed in the substrate and connected to the buried layer so as to provide an external connection to the buried layer adjacent the surface of the substrate.
Claim 2
Dependent Claim 94 words
A semiconductor device with a very low sheet resistivity buried layer comprising: a substrate; a semiconductor device formed in the substrate and having a plurality of electrodes; a very low sheet resistivity buried layer positioned in the substrate below the semiconductor device and in connection with one of the plurality of electrodes of the semiconductor device, the buried layer including a refractory metal; and a conductive area formed in the substrate and connected to the buried layer so as to provide an external connection to the buried layer adjacent the surface of the substrate.
Claim 3
Dependent Claim 92 words
A semiconductor device with a very low sheet resistivity buried layer comprising: a substrate; a semiconductor device formed in the substrate and having a plurality of electrodes; a very low sheet resistivity buried layer positioned in the substrate below the semiconductor device and in connection with one of the plurality of electrodes of the semiconductor device, the buried layer including silicide; and a conductive area formed in the substrate and connected to the buried layer so as to provide an external connection to the buried layer adjacent the surface of the substrate.
Claim 4
Dependent Claim 92 words
A semiconductor device with a very low sheet resistivity buried layer comprising: a substrate; a semiconductor device formed in the substrate and having a plurality of electrodes; a very low sheet resistivity buried layer positioned in the substrate below the semiconductor device and in connection with one of the plurality of electrodes of the semiconductor device, the buried layer including silicide; and a conductive area formed in the substrate and connected to the buried layer so as to provide an external connection to the buried layer adjacent the surface of the substrate.

References Cited (Backward Citations)

JPS6317555A Cited
US4972239A Cited
US4890142A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-01-31 1997-08-02 1998-02-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-01-31 2001-08-02 2002-02-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-01-31 2005-08-02 2006-02-01 $7700.00 Window Closed / Lapsed

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