Alumina package for hermetically containing an electronic device therein
Abstract
Abstract In a borosilicate glass plate containing Li 2 O, Na 2 O and K 2 O and for use as a window plate in an alumina package for containing a semiconductor device, Li + and Na + ions are partially ion-exchanged by K + ions in a surface of the glass plate to form a surface layer having a compressive stress of 200 Kg.f/cm 2 or more, in order to make a thin window glass plate for the package having a thickness of 0.7 mm or less and a sufficient mechanical strength. The glass also has a thermal expansion coefficient of 50-75×10 -7 /° C. over a temperature range of 30°-380° C. so as to be thermally compatible with the alumina package. The glass consists essentially of SiO 2 55-64%, Al 2 O 3 7-20%, B 2 O 3 11-19%, Li 2 O 0-8%, Na 2 O 7-20%, K 2 O 0-4%, and RO 0.5-7% on the base of weight percent, where R is at least one of Mg, Ca, Sr, and Ba. In order to insure the ion exchange, amounts of Li 2 O, Na 2 O and K 2 O are adjusted so that (Li 2 O+Na 2 O/(Li 2 O+Na 2 O+K 2 O) is 0.7 or more.
Inventors
- 👤 Hiroki Nagai
- 👤 Shigeru Yamamoto
Bibliographic Details
Claims Analysis
Total Claims: 3References Cited (Backward Citations)
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