Patent US5277787A successfully refreshed from Google Patents.
US5277787A
Expired / Lapsed
US
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Method of manufacturing printed wiring board
Assignee: Nippon CMK Corp
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Filing: 1992-10-28
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Granted: 1994-01-11
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Expires: 2012-10-28
Abstract
Abstract A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
Inventors
- 👤 Yasuaki Otani
- 👤 Fusao Birukawa
- 👤 Tatero Takai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:12
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0355; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/4007; H05K3/46; H05K3/4611; H05K3/4623
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
101 words
A method of manufacturing printed wiring board comprising steps of: providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
Claim 2
Independent Claim
101 words
A method of manufacturing printed wiring board comprising steps of: providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
Claim 3
Dependent Claim
21 words
A method of manufacturing printed wiring board as claimed in claim 1, wherein the material removing treatment is an etching treatment.
References Cited (Backward Citations)
US4808273A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-10 | 1997-07-12 | 1998-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-10 | 2001-07-12 | 2002-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-10 | 2005-07-12 | 2006-01-11 | $7700.00 | Window Closed / Lapsed |