Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
154 words
An apparatus for optically interconnecting a first layer and a second layer of photonic circuits positioned within a three-dimensional topographical arrangement, comprising: an interconnection panel mounted within said three-dimensional topographical arrangement, and positioned intermediate said first layer and said second layer of photonic circuits, said interconnection panel having a first exposed surface and a second exposed surface; a plurality of optical couplers mounted upon said interconnection panel adapted to facilitate the mating of a first optical fiber linked to a circuit within said first layer and a second optical fiber linked to a circuit within said second layer, each of said plurality of optical couplers being mounted upon said interconnection panel so that the coupler adapted to mate with said first optical fiber projects from said first exposed surface of said interconnection panel, and the coupler adapted to mate with said second optical fiber projects from said second exposed surface of said interconnection panel.
Claim 2
Independent Claim
154 words
An apparatus for optically interconnecting a first layer and a second layer of photonic circuits positioned within a three-dimensional topographical arrangement, comprising: an interconnection panel mounted within said three-dimensional topographical arrangement, and positioned intermediate said first layer and said second layer of photonic circuits, said interconnection panel having a first exposed surface and a second exposed surface; a plurality of optical couplers mounted upon said interconnection panel adapted to facilitate the mating of a first optical fiber linked to a circuit within said first layer and a second optical fiber linked to a circuit within said second layer, each of said plurality of optical couplers being mounted upon said interconnection panel so that the coupler adapted to mate with said first optical fiber projects from said first exposed surface of said interconnection panel, and the coupler adapted to mate with said second optical fiber projects from said second exposed surface of said interconnection panel.
Claim 3
Dependent Claim
45 words
The apparatus of claim 1 wherein said interconnection panel is positioned so that the plane of said first exposed surface and the plane of said second exposed surface are situated diagonally with respect to the plane of the circuits within said first and second layers.
Claim 4
Independent Claim
155 words
An apparatus for optically interconnecting a first layer and a second layer of photonic circuits positioned within a three-dimensional topographical arrangement, wherein the plane of the circuits of said first layer are orthogonally oriented with respect to the plane of the circuits of said second layer, comprising: a planar interconnection panel having a first exposed surface and a second exposed surface, said planar interconnection panel being mounted within said three-dimensional topographical arrangement, and positioned intermediate said first layer and said second layer of photonic circuits so that the plane of said interconnection panel is situated diagonally with respect to the plane of the circuits within said first and second layers; a plurality of optical couplers mounted upon said first and said second exposed surfaces adapted to facilitate the mating of a first optical fiber linked to a circuit within said first layer and a second optical fiber linked to a circuit within said second layer.
Claim 5
Independent Claim
155 words
An apparatus for optically interconnecting a first layer and a second layer of photonic circuits positioned within a three-dimensional topographical arrangement, wherein the plane of the circuits of said first layer are orthogonally oriented with respect to the plane of the circuits of said second layer, comprising: a planar interconnection panel having a first exposed surface and a second exposed surface, said planar interconnection panel being mounted within said three-dimensional topographical arrangement, and positioned intermediate said first layer and said second layer of photonic circuits so that the plane of said interconnection panel is situated diagonally with respect to the plane of the circuits within said first and second layers; a plurality of optical couplers mounted upon said first and said second exposed surfaces adapted to facilitate the mating of a first optical fiber linked to a circuit within said first layer and a second optical fiber linked to a circuit within said second layer.
Claim 6
Dependent Claim
39 words
The apparatus of claim 3 wherein said interconnection panel is positioned so that the plane of said interconnection panel is situated at a 45° angle with respect to the plane of the circuits within said first and second layers.
Claim 7
Independent Claim
202 words
An apparatus for optically interconnecting a first layer and a second layer of photonic circuits positioned within a three-dimensional topographical arrangement, wherein the plane of the circuits of said first layer are orthogonally oriented with respect to the plane of the circuits of second layer, comprising: a planar interconnection panel having a first exposed surface and a second exposed surface, said planar interconnection panel being mounted within said three-dimensional topographical arrangement intermediate said first layer and said second layer of photonic circuits so that the plane of said interconnection panel is situated diagonally with respect to the plane of the circuits within said first and second layers; a plurality of optical couplers mounted upon said interconnection panel adapted to facilitate the mating of a first optical fiber linked to a circuit within said first layer and a second optical fiber linked to a circuit within said second layer, each of said plurality of optical couplers being mounted upon said interconnection panel so that the coupler adapted to mate with said first optical fiber projects from said first surface of said interconnection panel, and the coupler adapted to mate with said second optical fiber projects from said second surface of said interconnection panel.
Claim 8
Independent Claim
202 words
An apparatus for optically interconnecting a first layer and a second layer of photonic circuits positioned within a three-dimensional topographical arrangement, wherein the plane of the circuits of said first layer are orthogonally oriented with respect to the plane of the circuits of second layer, comprising: a planar interconnection panel having a first exposed surface and a second exposed surface, said planar interconnection panel being mounted within said three-dimensional topographical arrangement intermediate said first layer and said second layer of photonic circuits so that the plane of said interconnection panel is situated diagonally with respect to the plane of the circuits within said first and second layers; a plurality of optical couplers mounted upon said interconnection panel adapted to facilitate the mating of a first optical fiber linked to a circuit within said first layer and a second optical fiber linked to a circuit within said second layer, each of said plurality of optical couplers being mounted upon said interconnection panel so that the coupler adapted to mate with said first optical fiber projects from said first surface of said interconnection panel, and the coupler adapted to mate with said second optical fiber projects from said second surface of said interconnection panel.
Claim 9
Dependent Claim
39 words
The apparatus of claim 5 wherein said interconnection panel is positioned so that the plane of said interconnection panel is situated at a 45° angle with respect to the plane of the circuits within said first and second layers.