Aligner and exposure method for manufacturing semiconductor device

Claim 1

An aligner comprising: an illumination system for illuminating an original plate with exposure light; a projection optical system for projecting a pattern onto a substrate, the pattern being formed on the original plate illuminated with the exposure light from said illumination system; a stage for moving the substrate in two dimensions so as to sequentially project the pattern formed on the original plate onto shot zones on the substrate; a laser interferometer for measuring the change of position said stage is moved; an environment measuring device for measuring at least one of temperature, humidity and atmospheric pressure; a first magnification determining device for determining a change in projection magnification of said projection optical system, the determination being performed using an output of said environment measuring device; a second magnification determining device for determining a change in the projection magnification of said projection optical system, the determination being performed in accordance with an amount of illumination accumulated by detecting the exposure light; a mark detecting device for sequentially detecting marks in a first shot zone and marks in a second shot zone on the substrate, wherein when said mark detecting device sequentially detects the marks in the first and second shot zones, said laser interferometer measures the change of position said stage is moved; an expansion and contraction ratio determining device for determining the ratio at which the substrate expands or contracts, the ratio determination being performed using an output of said mark detecting device; and a magnification adjusting device for adjusting, on the basis of the outputs of said expansion and contraction ratio determining device and said first and second magnification detecting devices, the projection magnification of said projection optical system.