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US5266739A Expired / Lapsed US ⏱️ 0.0 years remaining

Chip electronic device with a resin housing and manufacturing process thereof

Assignee: Murata Manufacturing Co Ltd
•
Filing: 1992-02-25
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Granted: 1993-11-30
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Expires: 2012-02-25
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Abstract

Abstract A chip electronic device wherein an electronic element such as an inductor and capacitor, and terminals are covered with a resin housing. Plated lower surfaces and edges of the terminals show on a bottom and sides of a housing respectively. The lower surfaces of the terminals are soldered onto conductive patterns of a printed wiring board, and fillets of solder are formed at the edges of the terminals.

Inventors

  • 👤 Keishiro Yamauchi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 21:18
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/228; H01C; H01C1/00; H01C1/14; H01F; H01F27/00; H01F27/28; H01F27/29; H01F27/292; H01F41/00; H01F41/02; H01F41/04; H01F41/041

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 80 words
A chip electronic device with a resin housing comprising: an electronic element; a terminal which is formed by punching a strip into a specified shape having at least one protruded edge and plated, the terminal being electrically connected with an electrode of the electronic element; and a resin housing which houses the electronic element and the terminal such that a plated lower surface and a plated edge of the terminal show on a bottom and a side of the housing.
Claim 2
Dependent Claim 80 words
A chip electronic device with a resin housing comprising: an electronic element; a terminal which is formed by punching a strip into a specified shape having at least one protruded edge and plated, the terminal being electrically connected with an electrode of the electronic element; and a resin housing which houses the electronic element and the terminal such that a plated lower surface and a plated edge of the terminal show on a bottom and a side of the housing.
Claim 3
Dependent Claim 31 words
A chip electronic device according to claim 1, wherein said at least one protruded edge extends outward from the terminal and is flush with an exterior surface of said resin housing.
Claim 4
Dependent Claim 84 words
A manufacturing process of a chip electronic device with a resin housing comprising: forming a terminal by punching a strip into a specified shape which has a protruded edge; plating the formed terminal; mounting an electronic element onto the terminal; molding a resin into a housing which houses the electronic element and the terminal such that a plated lower surface and a plated edge of the terminal show on a bottom and a side of the housing; and separating the terminal from the strip.
Claim 5
Dependent Claim 84 words
A manufacturing process of a chip electronic device with a resin housing comprising: forming a terminal by punching a strip into a specified shape which has a protruded edge; plating the formed terminal; mounting an electronic element onto the terminal; molding a resin into a housing which houses the electronic element and the terminal such that a plated lower surface and a plated edge of the terminal show on a bottom and a side of the housing; and separating the terminal from the strip.
Claim 6
Dependent Claim 31 words
A process according to claim 3, wherein said step of molding further includes a step of: forming said side of the resin housing flush with said plated edge of the terminal.

References Cited (Backward Citations)

US3550228A Cited
US4064472A Cited
US4365284A Cited
US4498067A Cited
US4490706A Cited
US4571662A Cited
US4879804A Cited
US4939494A Cited
US5034854A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-11-29 1997-05-31 1997-11-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-11-29 2001-05-31 2001-11-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-11-29 2005-05-31 2005-11-30 $7700.00 Window Closed / Lapsed

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