Gull wing IC carrier/socket system

Claim 1

A system for handling and protecting a gull-wing leaded IC device comprising: (a) carrier means having a top surface, an underside and grooves is designed and constructed wherein a gull-wing IC having leads is secured within the carrier means, (b) means defining a mating surface mount socket wherein the carrier may be removably mounted into said surface mount socket, and (c) means for making electrical connections in said surface mount socket to each said IC gull-wing leads, wherein each said electrical connection means terminates in a contact suitable for soldering onto receiving pads on a PC board forming a plurality of soldered contact termination joints, and wherein the pattern of the contacts corresponds directly to the pattern of the IC gull-wing leads, so that either the socket or the IC may be soldered to the receiving pads, wherein said surface mount socket is constructed and arranged with no separators or slots or other impediments between or around said contacts such that each of said soldered contact termination joints to said receiving pads is viewable and accessible, (d) means defining a mating test/programming socket which can removably accommodate said carrier means, (e) means defining a floating, hinged structure wherein said hinged structure conforms with the carrier top surface thereby distributing the force on the carrier substantially evenly, (f) means for making electrical connections in said test socket to each said IC gull-wing leads, and (g) removable clip means which extend on the underside of the IC for securing the IC within the carrier means, said clip means having extensions which mate with grooves on the carrier means.

Claim 2

A system for handling and protecting a gull-wing leaded IC device comprising: (a) carrier means having a top surface, an underside and grooves is designed and constructed wherein a gull-wing IC having leads is secured within the carrier means, (b) means defining a mating surface mount socket wherein the carrier may be removably mounted into said surface mount socket, and (c) means for making electrical connections in said surface mount socket to each said IC gull-wing leads, wherein each said electrical connection means terminates in a contact suitable for soldering onto receiving pads on a PC board forming a plurality of soldered contact termination joints, and wherein the pattern of the contacts corresponds directly to the pattern of the IC gull-wing leads, so that either the socket or the IC may be soldered to the receiving pads, wherein said surface mount socket is constructed and arranged with no separators or slots or other impediments between or around said contacts such that each of said soldered contact termination joints to said receiving pads is viewable and accessible, (d) means defining a mating test/programming socket which can removably accommodate said carrier means, (e) means defining a floating, hinged structure wherein said hinged structure conforms with the carrier top surface thereby distributing the force on the carrier substantially evenly, (f) means for making electrical connections in said test socket to each said IC gull-wing leads, and (g) removable clip means which extend on the underside of the IC for securing the IC within the carrier means, said clip means having extensions which mate with grooves on the carrier means.