Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
145 words
A method of detecting an endpoint of polishing in a process of polishing overlying layers atop a surface of a semiconductor wafer, comprising: forming a contact structure on a semiconductor wafer at a selected level atop a top surface of the semiconductor wafer, the level being selected as a level whereat it is desired to terminate polishing of at least one layer disposed on the surface of the wafer; forming the at least one layer overlying the top surface of the wafer, such that the contact structure is embedded within the at least one overlying layer; polishing the at least one overlying layer with a slurry having sufficient conductivity to be electrically measurable; and during polishing, measuring an electrical characteristic between the contact structure and the slurry, and observing a noticeable change in the electrical characteristic when the contact structure becomes exposed to the slurry.
Claim 2
Independent Claim
145 words
A method of detecting an endpoint of polishing in a process of polishing overlying layers atop a surface of a semiconductor wafer, comprising: forming a contact structure on a semiconductor wafer at a selected level atop a top surface of the semiconductor wafer, the level being selected as a level whereat it is desired to terminate polishing of at least one layer disposed on the surface of the wafer; forming the at least one layer overlying the top surface of the wafer, such that the contact structure is embedded within the at least one overlying layer; polishing the at least one overlying layer with a slurry having sufficient conductivity to be electrically measurable; and during polishing, measuring an electrical characteristic between the contact structure and the slurry, and observing a noticeable change in the electrical characteristic when the contact structure becomes exposed to the slurry.
Claim 3
Dependent Claim
26 words
Method, according to claim 1, further comprising: stopping polishing upon occurrence of the noticeable change in the electrical characteristic between the contact structure and the slurry.
Claim 4
Dependent Claim
88 words
A method, according to claim 1, further comprising: forming at least two contact structures at the selected level; forming vias through the semiconductor wafer, said vias extending completely through the wafer from the top surface of the wafer to an opposite bottom surface of the wafer, the vias being in electrical contact with respective contact structures; filling the vias with a conductive material; during polishing, urging electrical-characteristic-measuring probes against the conductive material from the bottom surface of the wafer to determine the electrical characteristic and the noticeable change.
Claim 5
Dependent Claim
49 words
Method, according to claim 1, further comprising: forming at least one contact structure on a semiconductor wafer; disposing a first probe in the slurry; connecting a second probe to an opposite bottom surface of the wafer; during polishing, measuring the electrical characteristic between the first and the second probes.
Claim 6
Dependent Claim
19 words
Method, according to claim 1, wherein: the electrical characteristic is electrical resistance between the contact structure and the slurry.
Claim 7
Dependent Claim
19 words
Method, according to claim 1, wherein: the electrical characteristic is electrical impedance between the contact structure and the slurry.
Claim 8
Dependent Claim
14 words
Method, according to claim 1, wherein: the polishing step is a chemical-mechanical polishing process.