US5264710A
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Amorphous semiconductor, amorphous semiconductor device using hydrogen radicals
Assignee: Kanegafuchi Chemical Industry Co Ltd
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Filing: 1992-04-07
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Granted: 1993-11-23
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Expires: 2012-04-07
Abstract
Abstract Amorphous semiconductor thin film is exposed to an atmosphere of hydrogen radical during or after the formation of thin film, or is subject to light irradiation having a density of not less than 10 W/cm 2 at a wavelength of 300 to 700 nm during the formation of the thin film. The obtained thin film has improved, i.e. small, photo deterioration. The semiconductor device using the above thin film is preferably applied to solar cells or thin film transistors.
Inventors
- 👤 Hideo Yamagishi
- 👤 Akihiko Hiroe
- 👤 Hitoshi Nishio
- 👤 Keiko Miki
- 👤 Kazunori Tsuge
- 👤 Yoshihisa Tawada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:43
CPC Classifications
H; H10; H10F; H10F71/00; H10F71/10; H10F71/103; H10F71/1035; H10F71/134; H10P; H10P14/00; H10P14/20; H10P14/24; H10P14/29; H10P14/2901; H10P14/2902; H10P14/2905; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3408; H10P14/3411; H10P14/3451; H10P14/3452; H10P14/3454; H10P95/00; H10P95/94; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
97 words
An amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by the decomposition of one of a silane family gas and a mixed gas of silane family gases by at least one of the methods selected from a group consisting of plasma, heat, light, sputtering and reactive sputtering using at least one of silicon and silicone compounds as a target, wherein deposition of the thin film is interrupted periodically and the deposited thin film is exposed to an atmosphere of hydrogen radicals prior to resumption of the deposition of the film.
Claim 2
Dependent Claim
97 words
An amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by the decomposition of one of a silane family gas and a mixed gas of silane family gases by at least one of the methods selected from a group consisting of plasma, heat, light, sputtering and reactive sputtering using at least one of silicon and silicone compounds as a target, wherein deposition of the thin film is interrupted periodically and the deposited thin film is exposed to an atmosphere of hydrogen radicals prior to resumption of the deposition of the film.
Claim 3
Dependent Claim
82 words
An amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by the decomposition of one of silane family gases and a mixed gas of silane family gases using a method selected from a group consisting of plasma, heat and light, sputtering and reactive sputtering using at least one of silicon and silicone compounds a target, wherein, after the thin film of amorphous semiconductor has been formed, the film is exposed to an atmosphere containing hydrogen radicals.
Claim 4
Dependent Claim
82 words
An amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by the decomposition of one of silane family gases and a mixed gas of silane family gases using a method selected from a group consisting of plasma, heat and light, sputtering and reactive sputtering using at least one of silicon and silicone compounds a target, wherein, after the thin film of amorphous semiconductor has been formed, the film is exposed to an atmosphere containing hydrogen radicals.
Claim 5
Dependent Claim
53 words
The semiconductor of claim 1, wherein the amorphous semiconductor is at least one of a-Si 1-x-y Ge x C y : H (wherein x and y satisfy the relationship of 0≦x, y≦1) and a-Si 1-x-y Ge x C y : H : F (wherein x and y satisfy the relationship of 0≦x, y≦1).
Claim 6
Dependent Claim
53 words
The semiconductor of claim 2, wherein the amorphous semiconductor is at least one of a-Si 1-x-y Ge x C y : H (wherein x and y satisfy the relationship of 0≦x, y≦1) and a-Si 1-x-y Ge x C y : H : F (wherein x and y satisfy the relationship of 0≦x, y≦1).
Claim 7
Dependent Claim
85 words
A semiconductor device comprising an amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by decomposition of one of silane family gases and a mixed gas of silane family gases using a method selected from a group consisting of plasma, heat, light, sputtering and reactive sputtering using at least one of silicon and silicone compounds as a target, wherein, after the thin film of amorphous semiconductor has been formed, the film is exposed to an atmosphere containing hydrogen radicals.
Claim 8
Dependent Claim
85 words
A semiconductor device comprising an amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by decomposition of one of silane family gases and a mixed gas of silane family gases using a method selected from a group consisting of plasma, heat, light, sputtering and reactive sputtering using at least one of silicon and silicone compounds as a target, wherein, after the thin film of amorphous semiconductor has been formed, the film is exposed to an atmosphere containing hydrogen radicals.
Claim 9
Dependent Claim
12 words
The device of claim 5, wherein the device has a pin structure.
Claim 10
Dependent Claim
12 words
The device of claim 5, wherein the device has a Schottky structure.
Claim 11
Dependent Claim
53 words
The semiconductor of claim 1, wherein the amorphous semiconductor is at least one of a-Si 1-x-y Ge x C y : H (wherein x and y satisfy the relationship of 0≦x, y≦1) and a-Si 1-x-y Ge x C y : H : F (wherein x and y satisfy the relationship of 0≦x, y≦1).
Claim 12
Dependent Claim
99 words
A semiconductor device comprising an amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by decomposition of one of a silane family gas and a mixed gas of silane family gases by at least one of methods selected from a group consisting of plasma, heat, light, sputtering and reactive sputtering using at least one of silicon and silicone compounds as a target, wherein deposition of the thin film is interrupted periodically and the deposited thin film is exposed to an atmosphere of hydrogen radicals prior to resumption of the deposition of the film.
Claim 13
Dependent Claim
99 words
A semiconductor device comprising an amorphous semiconductor produced by forming on a substrate a thin film of amorphous silicon semiconductor by decomposition of one of a silane family gas and a mixed gas of silane family gases by at least one of methods selected from a group consisting of plasma, heat, light, sputtering and reactive sputtering using at least one of silicon and silicone compounds as a target, wherein deposition of the thin film is interrupted periodically and the deposited thin film is exposed to an atmosphere of hydrogen radicals prior to resumption of the deposition of the film.
Claim 14
Dependent Claim
12 words
The device of claim 9, wherein the device has a pin structure.
Claim 15
Dependent Claim
12 words
The device of claim 9, wherein the device has a Schottky structure.
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