Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
64 words
A pattern forming method, comprising the steps of: coating a hydrophobic resist film on a substrate; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; selectively extracting and depositing a silicon oxide film from a silica liquid solution on the hydrophilic region of the substrate; and etching the resist film using the silicon oxide film as a mask.
Claim 2
Dependent Claim
64 words
A pattern forming method, comprising the steps of: coating a hydrophobic resist film on a substrate; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; selectively extracting and depositing a silicon oxide film from a silica liquid solution on the hydrophilic region of the substrate; and etching the resist film using the silicon oxide film as a mask.
Claim 3
Dependent Claim
17 words
The pattern forming method of claim 1, wherein the liquid solution is a supersaturated solution containing silica.
Claim 4
Dependent Claim
22 words
The pattern forming method of claim 1, wherein the exposure is carried out by using ultraviolet rays, X rays or electron beam.
Claim 5
Dependent Claim
18 words
The pattern forming method of claim 1, wherein the resist film includes a resin with acid anhydride structure.
Claim 6
Dependent Claim
22 words
The pattern forming method of claim 1, wherein the resist film includes a methacrylic acid anhydride resin or acrylic acid anhydride resin.
Claim 7
Dependent Claim
16 words
The pattern forming method of claim 1, wherein the resist film includes a novolac series resin.
Claim 8
Dependent Claim
78 words
A pattern forming method, comprising the steps of: coating a hydrophobic resist film on a substrate; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; silylizing the exposed region by a silicon compound gas and promoting a hydrophilic implementation; selectively extracting and depositing a silicon oxide film from a silica liquid solution on the hydrophilic region of the substrate; and etching the resist film using the silicon oxide film as a mask.
Claim 9
Dependent Claim
78 words
A pattern forming method, comprising the steps of: coating a hydrophobic resist film on a substrate; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; silylizing the exposed region by a silicon compound gas and promoting a hydrophilic implementation; selectively extracting and depositing a silicon oxide film from a silica liquid solution on the hydrophilic region of the substrate; and etching the resist film using the silicon oxide film as a mask.
Claim 10
Dependent Claim
16 words
The pattern forming method of claim 7, wherein the solution is a supersaturated solution containing silica.
Claim 11
Dependent Claim
22 words
The pattern forming method of claim 7, wherein the exposure is carried out by using ultraviolet rays, X rays or electron beam.
Claim 12
Dependent Claim
18 words
The pattern forming method of claim 7, wherein the resist film includes a resin with acid anhydride structure.
Claim 13
Dependent Claim
23 words
The pattern forming method of claim 7, wherein the resist film includes a methacrylic acid anhydride resin or an acrylic acid anhydride resin.
Claim 14
Dependent Claim
16 words
The pattern forming method of claim 7, wherein the resist film includes a novolac series resin.
Claim 15
Dependent Claim
58 words
A pattern forming method, comprising: coating a hydrophobic resist film on a substrate; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; baking the substrate; selectively extracting and depositing an oxide film from a silica solution on the hydrophilic region of the substrate; and etching the resist film using the oxide film.
Claim 16
Dependent Claim
58 words
A pattern forming method, comprising: coating a hydrophobic resist film on a substrate; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; baking the substrate; selectively extracting and depositing an oxide film from a silica solution on the hydrophilic region of the substrate; and etching the resist film using the oxide film.
Claim 17
Dependent Claim
16 words
The pattern forming method of claim 13, wherein the solution is a supersaturated solution containing silica.
Claim 18
Dependent Claim
22 words
The pattern forming method of claim 13, wherein the exposure is carried out by using ultraviolet rays, X rays or electron beam.
Claim 19
Dependent Claim
18 words
The pattern forming method of claim 13, wherein the resist film includes a resin with acid anhydride structure.
Claim 20
Dependent Claim
22 words
The pattern forming method of claim 13, wherein the resist film includes a methacrylic acid anhydride resin or acrylic acid anhydride resin.
Claim 21
Dependent Claim
16 words
The pattern forming method of claim 13, wherein the resist film includes a novolac series resin.
Claim 22
Dependent Claim
111 words
A pattern forming method, comprising: coating a hydrophobic resist film on a substrate having a silicon layer thereon; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; selectively extracting and depositing a first mask material from a liquid solution on the hydrophilic region of the substrate; etching the resist film using the first mask material and exposing a part of the silicon layer on the surface of the substrate; selectively extracting and depositing from the solution a second mask material on the exposed silicon layer; and selectively removing the resist film by a lift-off process and patterning the silicon layer using the second mask material.
Claim 23
Dependent Claim
111 words
A pattern forming method, comprising: coating a hydrophobic resist film on a substrate having a silicon layer thereon; exposing the resist film to a prescribed pattern causing an exposed region to become hydrophilic; selectively extracting and depositing a first mask material from a liquid solution on the hydrophilic region of the substrate; etching the resist film using the first mask material and exposing a part of the silicon layer on the surface of the substrate; selectively extracting and depositing from the solution a second mask material on the exposed silicon layer; and selectively removing the resist film by a lift-off process and patterning the silicon layer using the second mask material.
Claim 24
Dependent Claim
16 words
The pattern forming method of claim 19, wherein the solution is a supersaturated solution containing silica.
Claim 25
Dependent Claim
23 words
The pattern forming method of claim 19, wherein the resist film includes a methacrylic acid anhydride resin and an acrylic acid anhydride resin.
Claim 26
Dependent Claim
16 words
The pattern forming method of claim 19, wherein the resist film includes a novolac series resin.