Patent US5261155A successfully refreshed from Google Patents.
US5261155A
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Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
Assignee: International Business Machines Corp
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Filing: 1993-02-05
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Granted: 1993-11-16
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Expires: 2013-02-05
Abstract
Abstract A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.
Inventors
- 👤 Christopher G. Angulas
- 👤 Patrick T. Flynn
- 👤 Joseph Funari
- 👤 Thomas E. Kindl
- 👤 Randy L. Orr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:04
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2201/10681; H05K2201/10734; H05K2201/10954; H05K2201/10984; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/0415; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
239 words
A method of bonding first and second circuitized substrates to provide electrical interconnection therebetween, said method comprising: providing at least one conductive pad on a first circuitized substrate comprised of an organic dielectric material; providing a quantity of organic dewetting material of a predetermined configuration substantially adjacent said conductive pad; applying a quantity of solder paste having a first melting point over said conductive pad and also over at least part of said organic dewetting material; providing a second circuitized substrate including a dielectric material having an aperture therein and at least one conductive layer including at least one conductor as part thereof, said conductor located within and/or bridging said aperture, said second circuitized substrate being flexible in nature; securing a solder member having a second melting point greater than said first melting point of said solder paste to said conductor; aligning said second circuitized substrate having said solder member secured to said conductor relative to said first circuitized substrate such that said solder member engages said solder paste; heating said first and second circuitized substrates to a temperature substantially equal to or above said first melting point but less than said second melting point of said solder member sufficient to cause said solder paste to dewet from said organic dewetting material and form substantially about said solder member; and thereafter cooling said formed solder to form an electrical interconnection and bond between said first and second circuitized substrates.
Claim 2
Independent Claim
239 words
A method of bonding first and second circuitized substrates to provide electrical interconnection therebetween, said method comprising: providing at least one conductive pad on a first circuitized substrate comprised of an organic dielectric material; providing a quantity of organic dewetting material of a predetermined configuration substantially adjacent said conductive pad; applying a quantity of solder paste having a first melting point over said conductive pad and also over at least part of said organic dewetting material; providing a second circuitized substrate including a dielectric material having an aperture therein and at least one conductive layer including at least one conductor as part thereof, said conductor located within and/or bridging said aperture, said second circuitized substrate being flexible in nature; securing a solder member having a second melting point greater than said first melting point of said solder paste to said conductor; aligning said second circuitized substrate having said solder member secured to said conductor relative to said first circuitized substrate such that said solder member engages said solder paste; heating said first and second circuitized substrates to a temperature substantially equal to or above said first melting point but less than said second melting point of said solder member sufficient to cause said solder paste to dewet from said organic dewetting material and form substantially about said solder member; and thereafter cooling said formed solder to form an electrical interconnection and bond between said first and second circuitized substrates.
Claim 3
Dependent Claim
27 words
The method according to claim 1 wherein said solder paste is applied over said conductive pad and part of said organic dewetting material using a screening process.
Claim 4
Dependent Claim
45 words
The method according to claim 1 further including the step of positioning said solder member within a container prior to securing said member to said conductor and thereafter aligning said solder member relative to said conductor to cause said solder member to engage said conductor.
Claim 5
Dependent Claim
26 words
The method according to claim 3 further including the step of heating said solder member to a predetermined temperature to effect said securement to said conductor.
Claim 6
Dependent Claim
25 words
The method according to claim 4 wherein said predetermined temperature is within the range of from about 300 degrees C. to about 350 degrees C.
Claim 7
Dependent Claim
45 words
The method according to claim 1 wherein said first and second substrates are heated to a temperature within the range of from about 170 degrees C. to about 225 degrees C. to cause said solder paste to dewet and form substantially about said solder member.
Claim 8
Dependent Claim
26 words
The method according to claim 6 wherein said substrates are heated to said temperature for a period of from about 1.5 minutes to about 5 minutes.
Claim 9
Dependent Claim
26 words
The method according to claim 6 further including the step of placing said first and second substrates within an oven, said heating occurring within said oven.
References Cited (Backward Citations)
DE258314C
Cited
JPH0243748A
Cited
WO1990007792A1
Cited
US5024372A
Cited
US5048747A
Cited
JPH0371649A
Cited
US4972989A
Cited
US5056216A
Cited
US5007163A
Cited
US5060844A
Cited
US5011066A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-15 | 1997-05-17 | 1997-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-15 | 2001-05-17 | 2001-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-15 | 2005-05-17 | 2005-11-16 | $7700.00 | Window Closed / Lapsed |