US5256903A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic encapsulated semiconductor device
Assignee: Hitachi Ltd
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Filing: 1991-11-26
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Granted: 1993-10-26
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Expires: 2011-11-26
Abstract
Abstract A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore, an interface separation does not easily occur between the side surfaces of the insulating films and the encapsulating resin. If such an interface separation should occur, it cannot develop easily. Thus, it is possible to obtain a plastic encapsulated semiconductor device of a high level of reliability even when the largest possible semiconductor element is mounted therein within limited outside dimensions.
Inventors
- 👤 Maya Obata
- 👤 Asao Nishimura
- 👤 Makoto Kitano
- 👤 Akihiro Yaguchi
- 👤 Ryuji Kohno
- 👤 Nae Yoneda
- 👤 Ichiro Anjoh
- 👤 Gen Murakami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:36
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/413; H10W70/415; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/127; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
97 words
A plastic encapsulated semiconductor device comprising: a semiconductor element; a plurality of leads electrically connected with said semiconductor element; one or more of insulating members respectively provided, in an overlapping manner, between said semiconductor element and said plurality of leads and are extended to cover only a limited portion of a main surface area of said semiconductor element; and an encapsulating resin covering a part of said plurality of leads, said insulating members and said semiconductor element, wherein at least a part of peripheral edge surfaces of at least one of said insulating members includes uneven surfaces.
Claim 2
Dependent Claim
97 words
A plastic encapsulated semiconductor device comprising: a semiconductor element; a plurality of leads electrically connected with said semiconductor element; one or more of insulating members respectively provided, in an overlapping manner, between said semiconductor element and said plurality of leads and are extended to cover only a limited portion of a main surface area of said semiconductor element; and an encapsulating resin covering a part of said plurality of leads, said insulating members and said semiconductor element, wherein at least a part of peripheral edge surfaces of at least one of said insulating members includes uneven surfaces.
Claim 3
Dependent Claim
160 words
A plastic encapsulated semiconductor device comprising: a semiconductor element including a circuit forming main surface; at least two insulating members glued to the circuit forming main surface of said semiconductor element and extended to cover only a limited portion of the main surface; at least two first leads for electrical connection with said semiconductor element respectively including inner lead portions having main parts arranged on said insulating members so as to extend in a direction parallel to the peripheral edge surfaces of said insulating members and so as to be opposed to each other; a plurality of second leads arranged on said insulating members at positions spaced away from said first leads; and an encapsulating resin encasing a part of said first and second leads respectively corresponding to inner lead portions thereof, said semiconductor element and said insulating members, wherein at least a part of the peripheral edge surfaces of at least one of said insulating members includes uneven surfaces.
Claim 4
Dependent Claim
160 words
A plastic encapsulated semiconductor device comprising: a semiconductor element including a circuit forming main surface; at least two insulating members glued to the circuit forming main surface of said semiconductor element and extended to cover only a limited portion of the main surface; at least two first leads for electrical connection with said semiconductor element respectively including inner lead portions having main parts arranged on said insulating members so as to extend in a direction parallel to the peripheral edge surfaces of said insulating members and so as to be opposed to each other; a plurality of second leads arranged on said insulating members at positions spaced away from said first leads; and an encapsulating resin encasing a part of said first and second leads respectively corresponding to inner lead portions thereof, said semiconductor element and said insulating members, wherein at least a part of the peripheral edge surfaces of at least one of said insulating members includes uneven surfaces.
Claim 5
Dependent Claim
64 words
A plastic encapsulated semiconductor device according to claim 2, wherein said uneven surfaces include recesses provided at least on a part of a peripheral edge surface of one of said at least two insulating members, said peripheral edge surface which has recesses on at least a part thereof is disposed near one of said first leads and positionally opposed to the other first lead.
Claim 6
Dependent Claim
102 words
A plastic encapsulated semiconductor device comprising: a semiconductor element having a front facing main surface and a rear facing surface; one or more of insulating members fixedly disposed in an overlapping manner, over a limited portion of said semiconductor element, between the rear facing surface of said semiconductor element and a plurality of leads, said plurality of leads being electrically connected with said semiconductor element; and an encapsulating resin encasing a part of said leads, said insulating members and said semiconductor element, wherein at least a part of peripheral edge surfaces of at least one of said insulating members includes uneven surfaces.
Claim 7
Dependent Claim
102 words
A plastic encapsulated semiconductor device comprising: a semiconductor element having a front facing main surface and a rear facing surface; one or more of insulating members fixedly disposed in an overlapping manner, over a limited portion of said semiconductor element, between the rear facing surface of said semiconductor element and a plurality of leads, said plurality of leads being electrically connected with said semiconductor element; and an encapsulating resin encasing a part of said leads, said insulating members and said semiconductor element, wherein at least a part of peripheral edge surfaces of at least one of said insulating members includes uneven surfaces.
Claim 8
Dependent Claim
45 words
A plastic encapsulated semiconductor device according to one of claims 2, 3 and 4 wherein said uneven surfaces are comprised of recesses each of which is dimensioned to have an outer opening width smaller than that of a maximum width of an inner portion thereof.
Claim 9
Dependent Claim
26 words
A plastic encapsulated semiconductor device according to one of claims 2, 3 and 5 wherein said uneven surfaces are comprised of indentations on a roughened surface.
Claim 10
Dependent Claim
25 words
A plastic encapsulated semiconductor device according to one of claims 2, 3 and 5 wherein said uneven surfaces include recesses each having a rounded portion.
Claim 11
Dependent Claim
16 words
A plastic encapsulated semiconductor device according to claim 5, wherein each recess includes a rounded portion.
Claim 12
Dependent Claim
39 words
A plastic encapsulated semiconductor device according to one of claims 2, 3 and 5, wherein said uneven surfaces are comprised of recesses which are respectively extended to include an entire surface width, corresponding to thickness of said insulating member.
Claim 13
Dependent Claim
27 words
A plastic encapsulated semiconductor device according to claim 9, wherein said recesses are provided throughout each of the peripheral edges of each one of said insulating members.
Claim 14
Dependent Claim
36 words
A plastic encapsulated semiconductor device according to one of claims 3 and 5, wherein said semiconductor element is a rectangular-shaped semiconductor chip, and wherein said insulating members are rectangular-shaped and each is of a predetermined thickness.
Claim 15
Dependent Claim
31 words
A plastic encapsulated semiconductor device according to claim 11, wherein said uneven surfaces are comprised of recesses provided throughout each of the peripheral edges of each one of said insulating members.
Claim 16
Dependent Claim
32 words
A plastic encapsulated semiconductor device according to claim 1, wherein said semiconductor element is a rectangular-shaped semiconductor chip, and wherein said insulating members are rectangular-shaped and each is of a predetermined thickness.
Claim 17
Dependent Claim
31 words
A plastic encapsulated semiconductor device according to claim 13, wherein said uneven surfaces are comprised of recesses provided throughout each of the peripheral edges of each one of said insulating members.
Claim 18
Dependent Claim
41 words
A plastic encapsulated semiconductor device according to claim 3, wherein said recesses are respectively extended to include an entire surface width, corresponding to thickness of said insulating member, of that part of each peripheral edge surface corresponding to said uneven surfaces.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-25 | 1997-04-26 | 1997-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-25 | 2001-04-26 | 2001-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-25 | 2005-04-26 | 2005-10-26 | $7700.00 | Window Closed / Lapsed |