Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To prevent the position deviation of a metal wiring due to the stress of mold resin of a package by providing an element separation insulation film formed on a semiconductor substrate, an interlayer insulation film formed wiht irregularities on its surface on the insulation film, and a metal wiring film formed in such a way as to be mechanically connected with the irregularities on the film. CONSTITUTION:The title device is comprised of a semiconductor substrate 1, an element separation insulation film 2 formed on the semiconductor substrate 1, an interlayer insulation film 4 formed with irregularities on the surface on the film 2, and a metal wiring film 5 formed in such a way as to be mechanically connected with the irregularities on the film 4. Accordingly, the metal wiring film 5 is mechanically, strongly connected to the interlayer insulation film 4 via the irregularities of the film 4. As a result, it does not move laterally due to the stress of a wiring protective film or the like, and therefore it has conspicuous advantages for the improvement of the quality reliability of a semiconductor integrated circuit device.

Inventors

• 👤 Takahiro Hara
• 👤 高弘 原

Bibliographic Details