Packaged semiconductor device having tab tape and particular power distribution lead structure

Claim 1

A packaged semiconductor device comprising: a semiconductor chip having at least one main surface; a first group of bonding pads including a plurality of bonding pads arranged in a row along a central portion of said main surface of said semiconductor chip; a second group of bonding pads disposed on the main surface and including a plurality of signal pads arranged in two rows on opposite sides of said first group of bonding pads; two spaced apart insulating thin films covering respective portions of the main surface with said second group of bonding pads therebetween; a TAB tape including at least one shared lead having two ends, extending along and directly electrically connected to the row of said first group of bonding pads and including outside terminal portions at both ends, a plurality of signal leads, each having an outside terminal portion and an inside terminal portion, said inside terminal portion being directly electrically connected to a corresponding signal pad of said second group of bonding pads, and an insulating tape on which said shared lead and said signal leads are mounted at predetermined positions; and a sealing resin encapsulating said semiconductor chip, said first and second groups of bonding pads, and said TAB tape except said outside terminal portions of said shared lead and said signal leads.