US5252255A
Expired / Lapsed
US
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Conductive metal-filled substrates via developing agents
Assignee: Akzo America Inc
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Filing: 1990-06-11
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Granted: 1993-10-12
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Expires: 2010-06-11
Abstract
Abstract A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
Inventors
- 👤 Paul Y. Y. Moy
- 👤 William J. E. Parr
- 👤 Dieter Frank
- 👤 Ronald E. Hutton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:30
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0083; C; C08; C08K; C08K3/00; C08K3/02; C08K3/08; H01; H01B; H01B1/00; H01B1/20; H01B1/22
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
107 words
A conductive metal-filled substrate produced by the method comprising: a. an intermingling step of intermingling metal particles in a deformable substrate, wherein the metal particles are selected from the group consisting of copper, nickel, and combinations thereof, and are intermingled in a quantity sufficient to achieve a conductive three-dimensional substrate; b. a contacting step of contacting the metal particles with a developing agent comprising a long-chain aliphatic tertiary amine; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for a duration sufficient to improve the conductivity of the metal-filled substrate.
Claim 2
Dependent Claim
107 words
A conductive metal-filled substrate produced by the method comprising: a. an intermingling step of intermingling metal particles in a deformable substrate, wherein the metal particles are selected from the group consisting of copper, nickel, and combinations thereof, and are intermingled in a quantity sufficient to achieve a conductive three-dimensional substrate; b. a contacting step of contacting the metal particles with a developing agent comprising a long-chain aliphatic tertiary amine; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for a duration sufficient to improve the conductivity of the metal-filled substrate.
Claim 3
Dependent Claim
20 words
The conductive metal-filled substrate of claim 1 wherein said intermingling step comprises melt blending the metal particles into the substrate.
Claim 4
Dependent Claim
23 words
The conductive metal-filled substrate of claim 1 wherein said intermingling step comprises blending the metal particles into an uncured resin at ambient temperature.
Claim 5
Dependent Claim
24 words
The conductive metal-filled substrate of claim 1 wherein the copper or nickel contains less than about 40 weight % of nonconductive substrate forming metals.
Claim 6
Dependent Claim
24 words
The conductive metal-filled substrate of claim 1 wherein the copper or nickel contains less than about 20 weight % of nonconductive substrate forming metals.
Claim 7
Dependent Claim
23 words
The conductive metal-filled substrate of claim 1 wherein the metal particles have a number average particle size of less than about 30 um.
Claim 8
Dependent Claim
30 words
The conductive metal-filled substrate of claim 1 wherein the metals are present in the form of a mixture containing less than about 25 weight % of other nonconductive-substrate forming metals.
Claim 9
Dependent Claim
24 words
The conductive metal-filled substrate of claim 1 wherein said heating step takes place at temperature below the melting point of any substantially present metal.
Claim 10
Dependent Claim
22 words
The conductive metal-filled substrate of claim 1 wherein said heating step takes place at or above the softening point of the substrate.
Claim 11
Dependent Claim
14 words
The conductive metal-filled substrate of claim 1 wherein the substrate is a synthetic resin.
Claim 12
Dependent Claim
14 words
The conductive metal-filled substrate of claim 10 wherein the substrate is a thermoplastic resin.
Claim 13
Dependent Claim
28 words
The conductive metal-filled substrate of claim 1 wherein said contacting step comprises contacting the developing agent in liquid form with the metal particles prior to said intermingling step.
Claim 14
Dependent Claim
22 words
The conductive metal-filled substrate of claim 1 wherein said contacting step and said heating step take place prior to said intermingling step.
Claim 15
Dependent Claim
24 words
The conductive metal-filled substrate of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate prior to said intermingling step.
Claim 16
Dependent Claim
24 words
The conductive metal-filled substrate of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate simultaneous with said intermingling step.
Claim 17
Dependent Claim
24 words
The conductive metal-filled substrate of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate subsequent to said intermingling step.
Claim 18
Dependent Claim
22 words
The conductive metal-filled substrate of claim 1 wherein the tertiary amine has at least one C 8 to C 20 alkyl group.
Claim 19
Dependent Claim
26 words
The conductive metal-filled substrate of claim 17 wherein at least one C 8 to C 20 alkyl group is a coco, tallow, or hydrogenated tallow group.
Claim 20
Dependent Claim
16 words
The conductive metal-filled substrate of claim 18 wherein the tertiary amine also contains a hydroxyalkyl group.
Claim 21
Dependent Claim
16 words
The conductive metal-filled substrate of claim 19 wherein the tertiary amine is N,N-bis(2-hydroxyethyl)cocoamine or N,N-bis(2-hydroxyethyl)tallow amine.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-11 | 1997-04-12 | 1997-10-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-11 | 2001-04-12 | 2001-10-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-11 | 2005-04-12 | 2005-10-12 | $7700.00 | Window Closed / Lapsed |