Process for producing a printed wiring board

Claim 1

A process for producing a printed wiring board, comprising the steps of: preparing a copper-clad laminate comprising a substrate having two main surfaces and copper-clad foils on the surfaces of the insulating board, the copper-clad laminate having a through-hole; forming a first resist pattern on the surfaces of the copper-clad laminate, the first resist pattern including an area of the through-hole and an area where a conductor pattern is to be formed; etching the copper-clad composite with the first resist pattern as a resist to remove the copper-clad foils in an area not covered by the first resist pattern; removing the first resist pattern from the copper-clad composite; conducting an electroless plating to form an electroless plating copper layer on the surfaces of the copper-clad composite including the internal surface of the through-hole; forming a second resist pattern on the surfaces of the copper-clad composite such that only an area of the through-hole, an area of a land portion and an area of a foot print portion for a surface mounting part, of the copper-clad composite, are not covered by the second resist pattern; conducting an electroplating to form an electroplating copper layer on the surfaces of the copper-clad composite on areas not covered by the second resist pattern; conducting an electroplating to form a metallic resist plating layer on the electroplating copper layer; removing the second resist pattern from the copper-clad composite; and removing the exposed electroless plating copper layer from the copper-clad composite.