Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates

Claim 2

A process for producing metrological structures on a single substrate for analyzing an accuracy of an instrument used to measure alignment of structures on a processed substrate, comprising the steps of: defining first and second regions on the single substrate; defining, in the first region, at least one well in the substrate; disposing, in the at least one well in the first region, an insulated portion comprising a radiation-sensitive material; and disposing, in the second region, a first layer of a first material on the substrate, a second layer of a second material on the first layer of the first material, and an insulated portion including a third layer of a radiation-sensitive material on predetermined portions of the second layer of the second material.

Claim 3

The process of claim 1, wherein the steps of disposing a radiation-sensitive material in the first region and disposing a radiation-sensitive material in the second region comprise disposing the radiation-sensitive material in the first and second regions in a statistical distribution suitable for measurement and comparison to each other.

Claim 4

The process of claim 2, further comprising the steps of defining a plurality of first and second regions on the substrate and arranging the first and second regions in an alternating pattern on the substrate.

Claim 5

A process for producing methological structures on a single substrate for analyzing an accuracy of an instrument used to measure alignment of structures on a processed substrate, comprising the steps of: depositing a first layer of a first material on the single substrate; defining first and second regions of the substrate by depositing a first layer of radiation-sensitive material on the first layer and masking and developing the first layer of radiation-sensitive material; etching the first and second regions of the substrate to expose the substrate and to remove the first layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises the first material and the substrate; depositing a second layer of radiation-sensitive material on the first and second regions and masking and developing the second layer of radiation-sensitive material to define predetermined insulated regions of the first layer of the first material in the second region and predetermined insulated regions of the substrate in the first region; etching the predetermined insulated regions to define wells in the substrate in the first region and to partially etch the predetermined insulated regions of the first layer of the first material in the second region; depositing a third layer of radiation-sensitive material on the predetermined insulated regions and masking and developing the third layer of radiation-sensitive material to expose the predetermined insulated regions of the first layer of the first material in the second region; etching the predetermined insulated regions of the first layer of the first material in the second region to define wells in the first layer of the first material; depositing a second layer of a second material on the first and second regions; depositing a fourth layer of radiation-sensitive material on the second layer of the second material and masking and developing the fourth layer of radiation-sensitive material to expose the second layer of the second material in the first region; etching the first and second regions to expose the substrate and to remove the fourth layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises the second material, the first material, and the substrate; and depositing a fifth layer of radiation-sensitive material on the second layer of the second material and the substrate and masking and developing the fifth layer of radiation-sensitive material to expose predetermined portions of the second layer of the second material in the second region and to provide insulated portions of radiation-sensitive material in the wells in the substrate in the first region.

Claim 6

A process for producing methological structures on a single substrate for analyzing an accuracy of an instrument used to measure alignment of structures on a processed substrate, comprising the steps of: depositing a first layer of a first material on the single substrate; defining first and second regions of the substrate by depositing a first layer of radiation-sensitive material on the first layer and masking and developing the first layer of radiation-sensitive material; etching the first and second regions of the substrate to expose the substrate and to remove the first layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises the first material and the substrate; depositing a second layer of radiation-sensitive material on the first and second regions and masking and developing the second layer of radiation-sensitive material to define predetermined insulated regions of the first layer of the first material in the second region and predetermined insulated regions of the substrate in the first region; etching the predetermined insulated regions to define wells in the substrate in the first region and to partially etch the predetermined insulated regions of the first layer of the first material in the second region; depositing a third layer of radiation-sensitive material on the predetermined insulated regions and masking and developing the third layer of radiation-sensitive material to expose the predetermined insulated regions of the first layer of the first material in the second region; etching the predetermined insulated regions of the first layer of the first material in the second region to define wells in the first layer of the first material; depositing a second layer of a second material on the first and second regions; depositing a fourth layer of radiation-sensitive material on the second layer of the second material and masking and developing the fourth layer of radiation-sensitive material to expose the second layer of the second material in the first region; etching the first and second regions to expose the substrate and to remove the fourth layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises the second material, the first material, and the substrate; and depositing a fifth layer of radiation-sensitive material on the second layer of the second material and the substrate and masking and developing the fifth layer of radiation-sensitive material to expose predetermined portions of the second layer of the second material in the second region and to provide insulated portions of radiation-sensitive material in the wells in the substrate in the first region.

Claim 7

The process of claim 4, wherein the step of depositing, masking, and developing the fifth layer of radiation-sensitive material includes masking and developing the fifth layer of radiation-sensitive material so that the layer of radiation-sensitive material in the first and second regions has a statistical distribution suitable for measurement and comparison to each other.

Claim 8

The process of claim 5, further comprising the steps of defining a plurality of first and second regions on the substrate and arranging the first and second regions in an alternating pattern on the substrate.

Claim 9

The process of claim 5, wherein the step of depositing the first layer of the first material comprises depositing polysilicon.

Claim 10

The process of claim 5, wherein the step of depositing the first layer of the first material comprises depositing a contact dielectric.

Claim 11

The process of claim 5, wherein the step of depositing the first layer of the first material comprises depositing a first metalization.

Claim 12

The process of claim 5, wherein the step of depositing the first layer of the first material comprises forming vias.

Claim 13

The process of claim 5, wherein the step of depositing the second layer of the second material comprises forming a layer of contacts.

Claim 14

The process of claim 5, wherein the step of depositing the second layer of the second material comprises depositing a first metalization.

Claim 15

The process of claim 5, wherein the step of depositing the second layer of the second material comprises depositing a second metalization.

Claim 16

The process of claim 5, wherein the step of depositing the second layer of the second material comprises forming vias.

Claim 17

The process of claim 5, further comprising the step of carrying out the process using a substrate comprising a silicon wafer.

Claim 18

A process for producing metrological structures on a single substrate for analyzing an accuracy of an instrument used to measure alignment of structures on a processed substrate, comprising the steps of: depositing a first layer of a first material on the single substrate; defining first and second regions of the substrate by depositing a first layer of radiation-sensitive material on the first layer and masking and developing the first layer of radiation-sensitive material; etching the first and second regions of the substrate to expose the substrate and to remove the first layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises the first material and the substrate; depositing a second layer of radiation-sensitive material on the first and second regions and masking and developing the second layer of radiation-sensitive material to define predetermined insulated regions of the first layer of the first material in the second region and predetermined insulated regions of the substrate in the first region; etching the substrate to define wells in the substrate in the first region and to partially etch the predetermined insulated regions of the first layer of the first material in the second region; depositing a third layer of radiation-sensitive material on the first and second regions to cover the wells in the first region and the first layer of the first material in the second region; etching the third layer of radiation-sensitive material in the first and second regions the second region to expose the substrate and to remove the third layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises portions including the substrate and the first material and portions including the substrate only; growing a second layer of a second material on the substrate in the first and second regions; etching the first and second regions to remove the first material; depositing a fourth layer of radiation-sensitive material on the first and second regions and masking and developing the fourth layer of radiation-sensitive material to expose predetermined portions of the second layer in the first and second regions; etching the first and second regions of the substrate to expose the wells in the substrate in the first region and to remove the fourth layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises portions including the substrate and the first material and portions including the substrate only; depositing a third layer of a third material covering the first and second regions; depositing a fifth layer of radiation-sensitive material covering the third layer of the third material and masking and developing the fifth layer of radiation-sensitive material; etching the first and second regions of the substrate to expose the wells in the substrate in the first region and to remove the fifth layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises portions including the substrate, the first material, and the second material and portions including the substrate only; and depositing a fifth layer of radiation-sensitive material on the second layer of the second material and the substrate and masking and developing the fifth layer of radiation-sensitive material to expose predetermined portions of the second layer of the second material in the second region and to provide insulated portions of radiation-sensitive material in the wells in the substrate in the first region.

Claim 19

A process for producing metrological structures on a single substrate for analyzing an accuracy of an instrument used to measure alignment of structures on a processed substrate, comprising the steps of: depositing a first layer of a first material on the single substrate; defining first and second regions of the substrate by depositing a first layer of radiation-sensitive material on the first layer and masking and developing the first layer of radiation-sensitive material; etching the first and second regions of the substrate to expose the substrate and to remove the first layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises the first material and the substrate; depositing a second layer of radiation-sensitive material on the first and second regions and masking and developing the second layer of radiation-sensitive material to define predetermined insulated regions of the first layer of the first material in the second region and predetermined insulated regions of the substrate in the first region; etching the substrate to define wells in the substrate in the first region and to partially etch the predetermined insulated regions of the first layer of the first material in the second region; depositing a third layer of radiation-sensitive material on the first and second regions to cover the wells in the first region and the first layer of the first material in the second region; etching the third layer of radiation-sensitive material in the first and second regions the second region to expose the substrate and to remove the third layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises portions including the substrate and the first material and portions including the substrate only; growing a second layer of a second material on the substrate in the first and second regions; etching the first and second regions to remove the first material; depositing a fourth layer of radiation-sensitive material on the first and second regions and masking and developing the fourth layer of radiation-sensitive material to expose predetermined portions of the second layer in the first and second regions; etching the first and second regions of the substrate to expose the wells in the substrate in the first region and to remove the fourth layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises portions including the substrate and the first material and portions including the substrate only; depositing a third layer of a third material covering the first and second regions; depositing a fifth layer of radiation-sensitive material covering the third layer of the third material and masking and developing the fifth layer of radiation-sensitive material; etching the first and second regions of the substrate to expose the wells in the substrate in the first region and to remove the fifth layer of radiation-sensitive material so that the first region comprises only the substrate and the second region comprises portions including the substrate, the first material, and the second material and portions including the substrate only; and depositing a fifth layer of radiation-sensitive material on the second layer of the second material and the substrate and masking and developing the fifth layer of radiation-sensitive material to expose predetermined portions of the second layer of the second material in the second region and to provide insulated portions of radiation-sensitive material in the wells in the substrate in the first region.

Claim 20

The process of claim 16, wherein the step of depositing, masking and developing the fifth layer of radiation-sensitive material includes masking and developing the fifth layer of radiation-sensitive material so that the layer of radiation sensitive material in the first and second regions has a statistical distribution suitable for measurement and comparison to each other

Claim 21

The process of claim 17, further comprising the steps of defining a plurality of first and second regions on the substrate and arranging the first and second regions in an alternating pattern on the substrate.

Claim 22

The process of claim 17, wherein the step of depositing the first layer of the first material comprises depositing silicon nitride.

Claim 23

The process of claim 17, wherein the step of growing the second layer of the second material comprises growing a field oxide.

Claim 24

The process of claim 17, wherein the step of depositing the third layer of the third material comprises depositing polysilicon.

Claim 27

The apparatus of claim 22, further comprising a plurality of first and second regions on the substrate and arranging the first and second regions in an alternating pattern on the substrate.