Patent US5828963A successfully refreshed from Google Patents.
Patent US5244840A successfully refreshed from Google Patents.
US5244840A
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US
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Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
Assignee: Mitsubishi Electric Corp
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Filing: 1992-10-20
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Granted: 1993-09-14
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Expires: 2012-10-20
Abstract
Abstract A method for manufacturing an integrated circuit card by providing a circuit board having electronic components mounted thereon intermediate the thickness of a molded frame and filling the frame with resin in a mold so that the resin passes through an opening in the circuit board and seals both sides of the board to a thickness no greater than the frame thickness.
Inventors
- 👤 Shojiro Kodai
- 👤 Katsunori Ochi
- 👤 Fumiaki Baba
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:33
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07724; G06K19/07743; G06K19/07745; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
136 words
A method of manufacturing an IC card comprising: injecting a synthetic resin into a mold so that a frame is formed, said frame integrally comprising a periphery having a thickness corresponding to the thickness of said IC card and a circuit board disposed intermediate the thickness of said frame and having opposed first and second surfaces and an opening penetrating from said first surface to said second surface; forming a circuit, electronic parts, and an I/O portion on at least one of said first and second surfaces of said circuit board; and filling said frame with synthetic resin in a mold passing through said opening to said first and second surfaces of said circuit board to hermetically seal said circuit, electronic parts, and I/O portion with a thickness no greater than the thickness of said frame;
Claim 2
Independent Claim
136 words
A method of manufacturing an IC card comprising: injecting a synthetic resin into a mold so that a frame is formed, said frame integrally comprising a periphery having a thickness corresponding to the thickness of said IC card and a circuit board disposed intermediate the thickness of said frame and having opposed first and second surfaces and an opening penetrating from said first surface to said second surface; forming a circuit, electronic parts, and an I/O portion on at least one of said first and second surfaces of said circuit board; and filling said frame with synthetic resin in a mold passing through said opening to said first and second surfaces of said circuit board to hermetically seal said circuit, electronic parts, and I/O portion with a thickness no greater than the thickness of said frame;
Claim 3
Independent Claim
129 words
A method of manufacturing an IC card comprising: injecting a synthetic resin into a mold so that a frame is formed, said frame integrally comprising a periphery having a thickness corresponding to the thickness of said IC card and a circuit board supporting portion disposed intermediate the thickness of said periphery within said frame; forming a circuit, electronic parts, and an I/O portion on at least one of opposed first and second surfaces of said circuit board and an opening which penetrates from the first surface to the second surface; and filling said frame with synthetic resin in a mold with said synthetic resin passing through said opening to hermetically seal said circuit, electronic parts, and I/O portion with a thickness no greater than the thickness of said frame.
Claim 4
Independent Claim
129 words
A method of manufacturing an IC card comprising: injecting a synthetic resin into a mold so that a frame is formed, said frame integrally comprising a periphery having a thickness corresponding to the thickness of said IC card and a circuit board supporting portion disposed intermediate the thickness of said periphery within said frame; forming a circuit, electronic parts, and an I/O portion on at least one of opposed first and second surfaces of said circuit board and an opening which penetrates from the first surface to the second surface; and filling said frame with synthetic resin in a mold with said synthetic resin passing through said opening to hermetically seal said circuit, electronic parts, and I/O portion with a thickness no greater than the thickness of said frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-13 | 1997-03-15 | 1997-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-13 | 2001-03-15 | 2001-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-13 | 2005-03-15 | 2005-09-14 | $7700.00 | Window Closed / Lapsed |