US5239746A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating electronic circuits
Assignee: Saint Gobain Abrasives Inc
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Filing: 1991-06-07
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Granted: 1993-08-31
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Expires: 2011-06-07
Abstract
Abstract The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the via hole in the diamond material. Cracking of the diamond substrate, and loose or lost via elements, are minimized. A form of the disclosure is directed to a method for producing a circuit board having a multiplicity of conductive vias. A generally planar diamond substrate is provided. A multiplicity of via holes are formed through the substrate. The holes are loaded with a conductive reactive braze material. The braze material and the substrate are heated to a temperature which causes the braze material to melt and to react with the inner surface of the via holes and bond thereto. In an illustrated embodiment, the braze material comprises a conductive matrix component that includes at least one element selected from the group consisting of copper, silver, and gold, and a reactive component that includes at least one element selected from the group consisting of titanium, chromium, vanadium, zirconium, and hafnium. Another form of the disclosure is directed to a circuit board in which conductive vias pass through a diamond substrate and form a compound with the substrate at the inner surface of the via holes to bond to said inner surface of the via holes.
Inventors
- 👤 Paul D. Goldman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 12:00
CPC Classifications
H; H10; H10W; H10W99/00; H10W40/00; H10W40/20; H10W40/25; H10W40/254; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49151; Y10T29/49153; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
72 words
A method for producing a circuit board having a multiplicity of conductive vias, comprising the steps of: providing a diamond substrate; forming a multiplicity of via holes through said substrate; loading said via holes with a conductive reactive braze material; and heating said braze material and said substrate to a temperature which causes said braze material to melt and to react with the inner surface of said via holes and bond thereto.
Claim 2
Independent Claim
72 words
A method for producing a circuit board having a multiplicity of conductive vias, comprising the steps of: providing a diamond substrate; forming a multiplicity of via holes through said substrate; loading said via holes with a conductive reactive braze material; and heating said braze material and said substrate to a temperature which causes said braze material to melt and to react with the inner surface of said via holes and bond thereto.
Claim 3
Dependent Claim
40 words
The method as defined by claim 1, wherein said step of loading said via holes with braze material comprises applying said braze material to at least one surface of said substrate so that said braze material enters said via holes.
Claim 4
Dependent Claim
27 words
The method as defined by claim 2, further comprising the step of removing any braze material present on the surfaces of said substrate after the heating thereof.
Claim 5
Dependent Claim
54 words
The method as defined by claim 1, wherein said braze material comprises a conductive matrix component that includes at least one element selected from the group consisting of copper, silver, and gold, and a reactive component that includes at least one element selected from the group consisting of titanium, chromium, vanadium, zirconium, and hafnium.
Claim 6
Dependent Claim
54 words
The method as defined by claim 3, wherein said braze material comprises a conductive matrix component that includes at least one element selected from the group consisting of copper, silver, and gold, and a reactive component that includes at least one element selected from the group consisting of titanium, chromium, vanadium, zirconium, and hafnium.
Claim 7
Dependent Claim
22 words
The method as defined by claim 4, wherein said conductive matrix component comprises copper and silver and said reactive component comprises titanium.
Claim 8
Dependent Claim
22 words
The method as defined by claim 5, wherein said conductive matrix component comprises copper and silver and said reactive component comprises titanium.
Claim 9
Dependent Claim
25 words
The method as defined by claim 4, wherein said braze material is a paste comprising said elements in powdered form mixed with a carrier liquid.
Claim 10
Dependent Claim
25 words
The method as defined by claim 5, wherein said braze material is a paste comprising said elements in powdered form mixed with a carrier liquid.
Claim 11
Dependent Claim
25 words
The method as defined by claim 6, wherein said braze material is a paste comprising said elements in powdered form mixed with a carrier liquid.
Claim 12
Dependent Claim
37 words
The method as defined by claim 1, wherein said diamond substrate comprises generally planar synthetic diamond, and wherein said step of forming via holes in said substrate comprises laser drilling of said via holes in said substrate.
Claim 13
Dependent Claim
37 words
The method as defined by claim 4, wherein said diamond substrate comprises generally planar synthetic diamond, and wherein said step of forming via holes in said substrate comprises laser drilling of said via holes in said substrate.
Claim 14
Dependent Claim
45 words
The method as defined by claim 1, further comprising mounting electronic circuit elements on at least one surface of said substrate, coupling at least some of said circuit elements with said vias, and forming conductive connections to vias on the opposing surface of said substrate.
Claim 15
Dependent Claim
45 words
The method as defined by claim 4, further comprising mounting electronic circuit elements on at least one surface of said substrate, coupling at least some of said circuit elements with said vias, and forming conductive connections to vias on the opposing surface of said substrate.
Claim 16
Dependent Claim
45 words
The method as defined by claim 6, further comprising mounting electronic circuit elements on at least one surface of said substrate, coupling at least some of said circuit elements with said vias, and forming conductive connections to vias on the opposing surface of said substrate.
Claim 17
Independent Claim
89 words
A method for producing an electronic circuit, comprising the steps of: providing a diamond substrate; forming a via hole in said substrate; loading said via hole with a conductive reactive braze material; heating said braze material and said substrate to a temperature which causes said braze material to melt and to react with the inner surface of said via hole and bond thereto, said braze material then cooling and hardening to form a conductive via through said via hole; and coupling an electronic circuit element with said conductive via.
Claim 18
Independent Claim
89 words
A method for producing an electronic circuit, comprising the steps of: providing a diamond substrate; forming a via hole in said substrate; loading said via hole with a conductive reactive braze material; heating said braze material and said substrate to a temperature which causes said braze material to melt and to react with the inner surface of said via hole and bond thereto, said braze material then cooling and hardening to form a conductive via through said via hole; and coupling an electronic circuit element with said conductive via.
Claim 19
Dependent Claim
17 words
The method as defined by claim 16, further comprising mounting said electronic circuit element on said substrate.
Claim 20
Dependent Claim
54 words
The method as defined by claim 16, wherein said braze material comprises a conductive matrix component that includes at least one element selected from the group consisting of copper, silver, and gold, and a reactive component that includes at least one element selected from the group consisting of titanium, chromium, vanadium, zirconium, and hafnium.
Claim 21
Dependent Claim
22 words
The method as defined by claim 18, wherein said conductive matrix component comprises copper and silver and said reactive component comprises titanium.
Claim 22
Dependent Claim
25 words
The method as defined by claim 18, wherein said braze material is a paste comprising said elements in powdered form mixed with a carrier liquid.
Claim 23
Dependent Claim
25 words
The method as defined by claim 19, wherein said braze material is a paste comprising said elements in powdered form mixed with a carrier liquid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-30 | 1997-03-01 | 1997-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-30 | 2001-03-01 | 2001-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-30 | 2005-03-01 | 2005-08-31 | $7700.00 | Window Closed / Lapsed |