US5237205A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ground plane for plastic encapsulated integrated circuit die packages
Assignee: Advanced Micro Devices Inc
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Filing: 1991-06-05
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Granted: 1993-08-17
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Expires: 2011-06-05
Abstract
Abstract A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed by bonding together a copper sheet and a thermally conductive polyimide material insulating layer to which is also bonded a layer of a b-stage epoxy resin. The ground plane assembly is then bonded to the lead frame by placing the b-stage epoxy layer of the ground plane assembly against the lead frame and heating the ground plane assembly and lead frame to a temperature of from about 120° C. to just under 200° C. for a time period not exceeding about 10 seconds to bond the b-stage epoxy resin to the lead frame without oxidizing it. An integrated circuit die is then attached to the composite assembly with an epoxy adhesive and the die attached assembly is then cured in a nonoxidizing atmosphere in an oven at approximately 150° C. for about 90 minutes to cure the adhesive and the b-stage epoxy layer. The die is then electrically connected to the lead frame. The bonded together ground plane/lead frame/die composite assembly is then placed in a mold and encapsulated in plastic.
Inventors
- 👤 Robert A. Newman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:54
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W40/00; H10W40/01; H10W40/03; H10W40/037; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/464; H10W70/467; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W72/381; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
116 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising: a) a 1.5 to 20 mil copper metal ground plane layer; b) a polyimide insulating layer bonded to said copper metal ground plane layer with a high temperature-resistant adhesive capable of withstanding temperatures as high as 300° C.; and c) a b-stage epoxy layer bonded to an opposite surface of said insulating layer using said high temperature-resistant adhesive to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 2
Dependent Claim
116 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising: a) a 1.5 to 20 mil copper metal ground plane layer; b) a polyimide insulating layer bonded to said copper metal ground plane layer with a high temperature-resistant adhesive capable of withstanding temperatures as high as 300° C.; and c) a b-stage epoxy layer bonded to an opposite surface of said insulating layer using said high temperature-resistant adhesive to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 3
Dependent Claim
19 words
The multilayer ground plane assembly of claim 1 wherein said polyimide insulating layer comprises a thermally conductive polyimide material.
Claim 4
Dependent Claim
26 words
The multilayer ground plane assembly of claim 1 wherein said b-stage epoxy layer of said assembly ranges in thickness from about 1 to about 3 mils.
Claim 5
Dependent Claim
55 words
The multilayer ground plane assembly of claim 1 wherein said b-stage epoxy layer of said assembly is capable of being bonded to said lead frame by heating said assembly and said lead frame to a temperature of from about 120° C. to just under 200° C. for a time period not exceeding about 10 seconds.
Claim 6
Dependent Claim
41 words
The multilayer ground plane assembly of claim 1 wherein said copper ground plane member is provided with one or more tabs to permit said copper ground plane member to be electrically connected to one or more leads on said lead frame.
Claim 7
Dependent Claim
28 words
The multilayer ground plane assembly of claim 5 wherein said tabs on said copper ground plane member are capable of being welded to leads on said lead frame.
Claim 8
Dependent Claim
31 words
The multilayer ground plane assembly of claim 1 wherein said copper ground plane member is capable of being electrically and thermally connected to one or more leads on said lead frame.
Claim 9
Dependent Claim
39 words
The multilayer ground plane assembly of claim 7 wherein said copper ground plane member is further capable of being electrically and thermally connected to said one or more leads on said lead frame using an electrically conductive epoxy material.
Claim 10
Dependent Claim
174 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising: a) a 1.5 to 20 mil copper metal ground plane layer provided with one or more tabs to permit said copper ground plane member to be electrically connected to one or more leads on a lead frame; b) a polyimide insulating layer bonded to said copper metal ground plane layer with a high temperature-resistant adhesive capable of withstanding temperatures as high as 300° C.; and c) a 1-3 mil b-stage epoxy layer bonded to an opposite surface of said insulating layer using said high temperature-resistant adhesive to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to said metal lead frame by heating said assembly and said lead frame to a temperature of from about 120° C. to just under 200° C. for a time period not exceeding about 10 seconds.
Claim 11
Dependent Claim
174 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising: a) a 1.5 to 20 mil copper metal ground plane layer provided with one or more tabs to permit said copper ground plane member to be electrically connected to one or more leads on a lead frame; b) a polyimide insulating layer bonded to said copper metal ground plane layer with a high temperature-resistant adhesive capable of withstanding temperatures as high as 300° C.; and c) a 1-3 mil b-stage epoxy layer bonded to an opposite surface of said insulating layer using said high temperature-resistant adhesive to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to said metal lead frame by heating said assembly and said lead frame to a temperature of from about 120° C. to just under 200° C. for a time period not exceeding about 10 seconds.
Claim 12
Dependent Claim
91 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising: a) a 1.5 to 20 mil metal ground plane layer; b) an insulating layer bonded to said metal ground plane layer; c) a b-stage epoxy layer bonded to an opposite surface of said insulating layer whereby said ground plane assembly may be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 13
Dependent Claim
91 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising: a) a 1.5 to 20 mil metal ground plane layer; b) an insulating layer bonded to said metal ground plane layer; c) a b-stage epoxy layer bonded to an opposite surface of said insulating layer whereby said ground plane assembly may be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 14
Dependent Claim
96 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising a) a 1.5 to 20 mil copper metal ground plane layer; b) an insulating layer bonded to said copper metal ground plane layer; and c) a b-stage epoxy layer bonded to an opposite surface of said insulating layer to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 15
Dependent Claim
96 words
A multilayer ground plane assembly capable of bonding to a lead frame and an integrated circuit die to form a composite assembly which may be encapsulated in plastic to form a plastic encapsulated integrated circuit package comprising a) a 1.5 to 20 mil copper metal ground plane layer; b) an insulating layer bonded to said copper metal ground plane layer; and c) a b-stage epoxy layer bonded to an opposite surface of said insulating layer to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 16
Dependent Claim
17 words
The multilayer ground plane assembly of claim 11 wherein said insulating layer comprises a polyimide insulating layer.
Claim 17
Dependent Claim
84 words
A multilayer ground plane assembly suitable for use in forming a plastic encapsulated integrated circuit package comprising: a) a copper metal ground plane layer; p1 b) a b-stage epoxy layer; and c) an insulating layer bonded to said copper metal ground plane layer and to said b-stage epoxy layer using a high temperature-resistant adhesive capable of withstanding temperatures as high as 300° C. to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 18
Dependent Claim
84 words
A multilayer ground plane assembly suitable for use in forming a plastic encapsulated integrated circuit package comprising: a) a copper metal ground plane layer; p1 b) a b-stage epoxy layer; and c) an insulating layer bonded to said copper metal ground plane layer and to said b-stage epoxy layer using a high temperature-resistant adhesive capable of withstanding temperatures as high as 300° C. to thereby permit said ground plane assembly to be subsequently heated to bond said b-stage layer to a metal lead frame.
Claim 19
Dependent Claim
58 words
A multilayer ground plane assembly suitable for use in forming a plastic encapsulated integrated circuit package comprising: a) a metal ground plane layer; b) an insulating layer bonded to said metal ground plane layer; and c) b-stage epoxy layer bonded to said insulating layer, said b-stage epoxy layer ranging in thickness from about 1 to about 3 mils.
Claim 20
Dependent Claim
58 words
A multilayer ground plane assembly suitable for use in forming a plastic encapsulated integrated circuit package comprising: a) a metal ground plane layer; b) an insulating layer bonded to said metal ground plane layer; and c) b-stage epoxy layer bonded to said insulating layer, said b-stage epoxy layer ranging in thickness from about 1 to about 3 mils.
Claim 21
Dependent Claim
25 words
The multilayer ground plane assembly of claim 14 wherein said metal ground plane layer has a thickness ranging from about 1.5 to about 20 mils.
Claim 22
Dependent Claim
34 words
The multilayer ground plane assembly of claim 14 wherein said ground plane member is provided with one or more tabs capable of being electrically connected to one or more leads on a lead frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-16 | 1997-02-15 | 1997-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-16 | 2001-02-15 | 2001-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-16 | 2005-02-15 | 2005-08-17 | $7700.00 | Window Closed / Lapsed |