US5233426A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reduced diameter camera head for solid-state image pickup device and method of producing same
Assignee: Panasonic Holdings Corp
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Filing: 1991-12-12
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Granted: 1993-08-03
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Expires: 2011-12-12
Abstract
Abstract The present invention provides a compact camera head for a solid-state image pickup device, a dimension of which is not so limited by a package for a solid-state image pickup element. Outer-leads are connected via inner-leads respectively to electrodes of a solid-state image pickup chip to constitute the solid-state image pickup element. An optical glass plate is attached to a light-receiving surface of the solid-state image pickup chip. The outer-leads are connected to side electrodes of a circuit module constituted by a chip-connecting board, a circuit board and a connector board, to thereby provide an image pickup unit. The image pickup unit is inserted into a chassis, and the opposite open ends of the chassis are sealed by an optical filter and a seal plate.
Inventors
- 👤 Takahisa Suzuki
- 👤 Tatsuki Tsukada
- 👤 Kenzo Hatada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 17:41
CPC Classifications
H; H04; H04N; H04N23/00; H04N23/50; H04N23/54
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
145 words
A camera head for a solid-state image pickup device comprising: a chassis which has opposite open ends; and an image pickup unit housed in said chassis, said image pickup unit including: a solid state image pickup chip constituted by a solid-state image pickup semiconductor device, chip-connecting board disposed adjacent to said solid-state image pickup chip and having an electric circuit mounted thereon, a connector board having external lead pins, leads connecting electrodes provided at an outer peripheral edge of at least one of said chip-connecting board and said connector board to electrodes of said solid-state image pickup chip, said leads being integrated with said electrodes of at least one of said chip-connecting board and said connector board, and, a protective member sealing a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter.
Claim 2
Dependent Claim
145 words
A camera head for a solid-state image pickup device comprising: a chassis which has opposite open ends; and an image pickup unit housed in said chassis, said image pickup unit including: a solid state image pickup chip constituted by a solid-state image pickup semiconductor device, chip-connecting board disposed adjacent to said solid-state image pickup chip and having an electric circuit mounted thereon, a connector board having external lead pins, leads connecting electrodes provided at an outer peripheral edge of at least one of said chip-connecting board and said connector board to electrodes of said solid-state image pickup chip, said leads being integrated with said electrodes of at least one of said chip-connecting board and said connector board, and, a protective member sealing a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter.
Claim 3
Dependent Claim
177 words
A camera head for a solid state image pickup device comprising: an image pickup unit including; a solid-state image pickup chip constituted by a solid-state image pickup semiconductor device, chip-connecting board disposed adjacent to said solid-state image pickup chip and having an electric circuit mounted thereon, a connector board having external lead pins, leads connecting electrodes provided at an outer peripheral edge of at least one of said chip-connecting board and connector board to electrodes of said solid-state image pickup chip, said leads being integrated with said electrodes of at least one of said chip-connecting board and connector board, and a protective member sealing a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter, a chassis which has opposite open ends and houses therein said image pickup unit; a first seal member for sealing one end of said chassis, which is one of an optical glass plate and an optical filter; and a second seal member for sealing the other end of said chassis.
Claim 4
Dependent Claim
177 words
A camera head for a solid state image pickup device comprising: an image pickup unit including; a solid-state image pickup chip constituted by a solid-state image pickup semiconductor device, chip-connecting board disposed adjacent to said solid-state image pickup chip and having an electric circuit mounted thereon, a connector board having external lead pins, leads connecting electrodes provided at an outer peripheral edge of at least one of said chip-connecting board and connector board to electrodes of said solid-state image pickup chip, said leads being integrated with said electrodes of at least one of said chip-connecting board and connector board, and a protective member sealing a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter, a chassis which has opposite open ends and houses therein said image pickup unit; a first seal member for sealing one end of said chassis, which is one of an optical glass plate and an optical filter; and a second seal member for sealing the other end of said chassis.
Claim 5
Dependent Claim
19 words
A camera head according to claim 2, wherein said second seal member is in the form of a plate.
Claim 6
Dependent Claim
15 words
A camera head according to claim 2, wherein said second seal member is an adhesive.
Claim 7
Independent Claim
229 words
A method of producing a camera head for a solid-state image pickup device, comprising the steps of: connecting outer-leads respectively to electrodes of a solid-state image pickup chip via inner-leads, which chip is constituted by a solid-state image pickup semiconductor device; bonding a protective member to a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter; arranging a chip-connecting board and a connector board in an aligned manner at a side of said solid-state image pickup chip opposite to said light-receiving surface thereof, and connecting said chip-connecting board and said connector board together, said chip-connecting board having electric circuit parts mounted thereon, and said connector board having external lead pins; bending said outer-leads to be brought into contact with electrodes provided respectively at outer peripheral edges of said chip-connecting board and said connector board, and connecting said outer-leads to said electrodes of said two boards to form an image pickup unit; inserting said image pickup unit into a chassis having opposite open ends; and sealing one open end of said chassis adjacent to said light-receiving surface of said solid-state image pickup chip by a first seal member, said first seal member being one of an optical glass plate and an optical filter, and sealing the other open end of said chassis by a second seal member.
Claim 8
Independent Claim
229 words
A method of producing a camera head for a solid-state image pickup device, comprising the steps of: connecting outer-leads respectively to electrodes of a solid-state image pickup chip via inner-leads, which chip is constituted by a solid-state image pickup semiconductor device; bonding a protective member to a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter; arranging a chip-connecting board and a connector board in an aligned manner at a side of said solid-state image pickup chip opposite to said light-receiving surface thereof, and connecting said chip-connecting board and said connector board together, said chip-connecting board having electric circuit parts mounted thereon, and said connector board having external lead pins; bending said outer-leads to be brought into contact with electrodes provided respectively at outer peripheral edges of said chip-connecting board and said connector board, and connecting said outer-leads to said electrodes of said two boards to form an image pickup unit; inserting said image pickup unit into a chassis having opposite open ends; and sealing one open end of said chassis adjacent to said light-receiving surface of said solid-state image pickup chip by a first seal member, said first seal member being one of an optical glass plate and an optical filter, and sealing the other open end of said chassis by a second seal member.
References Cited (Backward Citations)
GB2156179A
Cited
JPS6159975A
Cited
US4918521A
Cited
US4896217A
Cited
JPH01175372A
Cited
US4890159A
Cited
US5040069A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-02 | 1997-02-01 | 1997-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-02 | 2001-02-01 | 2001-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-02 | 2005-02-01 | 2005-08-03 | $7700.00 | Window Closed / Lapsed |