US4918521A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solid state imaging apparatus
Assignee: Olympus Corp
•
Filing: 1988-01-14
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Granted: 1990-04-17
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Expires: 2008-01-14
Abstract
Abstract This solid state imaging apparatus is provided within the tip part of an insertable part of an endoscope and is provided with an image forming optical system for forming images. This image forming optical system forms an optical image on the imaging surface of a solid state imaging chip provided in the rear of this image forming optical system. This solid state imaging chip is affixed to a circuit substrate extending substantially at right angles with the imaging surface and electrically connected with the solid state imaging chip. This circuit substrate is connected with a signal cable transmitting input and output signals of the solid state imaging chip.
Inventors
- 👤 Hisao Yabe
- 👤 Hisao Ogiu
- 👤 Toshiyuki Takara
- 👤 Koji Takamura
- 👤 Masaaki Nakazawa
- 👤 Akinobu Uchikubo
- 👤 Tomoaki Sato
- 👤 Atsushi Miyazaki
- 👤 Akibumi Ishikawa
- 👤 Takeaki Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 00:25
CPC Classifications
A; A61; A61B; A61B1/00; A61B1/00163; A61B1/00174; A61B1/00179; A61B1/00064; A61B1/0011; A61B1/00177; A61B1/04; A61B1/05; A61B1/051; H; H04; H04N; H04N23/00; H04N23/50; H04N23/54; H04N23/555
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
95 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed substantially at right angles, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.
Claim 2
Dependent Claim
95 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed substantially at right angles, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.
Claim 3
Dependent Claim
40 words
A solid state imaging apparatus according to claim 1 wherein said sealing member seals the peripheries of said lens frame, solid state imaging chip and circuit substrate and the tip of said signal cable and is formed to be columnar.
Claim 4
Dependent Claim
107 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame: a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said solid state imaging chip being die-bonded to a die-bonding pad member made of a metal.
Claim 5
Dependent Claim
107 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame: a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said solid state imaging chip being die-bonded to a die-bonding pad member made of a metal.
Claim 6
Dependent Claim
107 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed substantially at right angle, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip; and an electronic part as a peripheral circuit arranged on said circuit substrate.
Claim 7
Dependent Claim
107 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed substantially at right angle, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip; and an electronic part as a peripheral circuit arranged on said circuit substrate.
Claim 8
Dependent Claim
25 words
A solid state imaging apparatus according to claim 4 wherein said solid state imaging chip is connected with said circuit substrate by a bonding wire.
Claim 9
Dependent Claim
47 words
A solid state imaging apparatus according to claim 4 wherein said sealing member seals the peripheries of said lens frame, image forming optical system, solid state imaging chip, electronic part and circuit substrate and the tip part of said signal cable and is formed to be columnar.
Claim 10
Dependent Claim
32 words
A solid state imaging apparatus according to claim 4 wherein said electronic part is at least one of an amplifying circuit, solid state imaging chip driving circuit, matching circuit and cooling element.
Claim 11
Dependent Claim
107 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame: a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said solid state imaging chip being die-bonded to a die-bonding pad member made of a metal.
Claim 12
Dependent Claim
107 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame: a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said solid state imaging chip being die-bonded to a die-bonding pad member made of a metal.
Claim 13
Dependent Claim
91 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.
Claim 14
Dependent Claim
91 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.
Claim 15
Dependent Claim
90 words
An endoscope insertable part comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.
Claim 16
Dependent Claim
90 words
An endoscope insertable part comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is directly mechanically affixed, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.
Claim 17
Dependent Claim
114 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame: a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said sealing member being a filling member filling said solid state imaging chip and forming the outside diameter of the endoscope insertable part.
Claim 18
Dependent Claim
114 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame: a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said sealing member being a filling member filling said solid state imaging chip and forming the outside diameter of the endoscope insertable part.
Claim 19
Dependent Claim
131 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said sealing member being a filling member filling said solid state imaging chip and forming the outside diameter of the endoscope insertable part; said solid state imaging chip being die-bonded on at least a part of the surface to a conductive die-bonding pad member.
Claim 20
Dependent Claim
131 words
A solid state imaging apparatus comprising: an image forming optical system fitted within a lens frame; a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system; a circuit substrate to which said solid state imaging chip is mechanically fitted and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and a sealing member sealing at least a part of the periphery of said solid state imaging chip; said sealing member being a filling member filling said solid state imaging chip and forming the outside diameter of the endoscope insertable part; said solid state imaging chip being die-bonded on at least a part of the surface to a conductive die-bonding pad member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-16 | 1993-10-16 | 1994-04-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-16 | 1997-10-16 | 1998-04-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-16 | 2001-10-16 | 2002-04-17 | $7700.00 | Window Closed / Lapsed |