Integrated circuit die-to-leadframe interconnect assembly system

Claim 1

An integrated circuit die-to-lead frame interconnect assembly having four sides, comprising: a semiconductor die; a unitary lead frame having a plurality of electrically conductive leads extending outwardly from all four sides of the assembly, said leads arranged in four arrays, one array on each side of the assembly, said leads having inner end portions extending inwardly towards the die on said four sides, said end portions separated from the die by gaps; an insulating bridging and support member supporting the die, said member having electrically conductive traces on said four sides for bridging the gaps; and means for electrically connecting the traces to the die; wherein said member has a plurality of edges, one of said edges corresponding to each array of leads, said inner end portions of the leads in each array extending over or under the corresponding edge of the member over staggered distances forming a staggered arrangement, said member further comprising a plurality of connecting structures, said structures located adjacent to and at different distances from said edges forming staggered arrangements so that each structure matches in position and is attached to an inner lead end portion in the staggered arrangements of the inner lead portions, each structure also electrically connected to a trace and electrically connected to and attached to a corresponding lead so that the die and the member are supported by the lead frame, and so that the die is electrically connected to the leads, each structure formed with sides for locating transverse protrusions at the inner end portion of the lead of each array to which it is attached.

Claim 21

A method for interconnecting an integrated circuit die to a lead frame, comprising: forming a unitary lead frame having four sides with four arrays of leads extending outwardly from said four sides, each array located on a corresponding side, said leads having inner end portions that are bent, said leads in an array extending inwardly towards a central location for the die from the corresponding side over staggered distances between adjacent leads so that the bent ends form a staggered arrangement; providing a member with edges, electrically conductive traces and a plurality of connecting structures, each structure electrically connected to a trace, wherein for at least one edge, the structures are located adjacent to said one edge at different distances from said one edge forming a staggered arrangement that is substantially the same as the staggered arrangement of the bent ends, each structure formed with sides for locating transverse protrusions at an inner end portion of a lead of each array; aligning the lead frame and the member so that each structure matches in location a corresponding bent end; moving the lead frame or the member so that each structure is in contact with its corresponding bent lead end; attaching and electrically connecting each lead end to its corresponding structure; attaching the die onto the member; and electrically connecting the die to the traces on the member.

Claim 22

A method for interconnecting an integrated circuit die to a lead frame, comprising: forming a unitary lead frame having four sides with four arrays of leads extending outwardly from said four sides, each array located on a corresponding side, said leads having inner end portions that are bent, said leads in an array extending inwardly towards a central location for the die from the corresponding side over staggered distances between adjacent leads so that the bent ends form a staggered arrangement; providing a member with edges, electrically conductive traces and a plurality of connecting structures, each structure electrically connected to a trace, wherein for at least one edge, the structures are located adjacent to said one edge at different distances from said one edge forming a staggered arrangement that is substantially the same as the staggered arrangement of the bent ends, each structure formed with sides for locating transverse protrusions at an inner end portion of a lead of each array; aligning the lead frame and the member so that each structure matches in location a corresponding bent end; moving the lead frame or the member so that each structure is in contact with its corresponding bent lead end; attaching and electrically connecting each lead end to its corresponding structure; attaching the die onto the member; and electrically connecting the die to the traces on the member.