US5226582A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for wire-bonding an integrated circuit
Assignee: Fujitsu Semiconductor Ltd
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Filing: 1992-05-08
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Granted: 1993-07-13
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Expires: 2012-05-08
Abstract
Abstract A wire-bonding method of an IC uses a capillary having a hole for guiding a bonding wire, the capillary moving vertically and horizontally with respect to the IC so as to bridge a loop between a first bonding and a subsequent second bonding of the wire on predetermined places. The method comprises the steps of heating a wire end extruding from a first opening of the hole to form a ball of the wire; performing the first bonding by a nail head bonding method; pulling the wire coming from the second opening. The tension imposed on the wire hardens a portion of the wire having been softened during the heating process, but is adequately low not break the wire; and moving the capillary so as to perform the second bonding. In a wire-bonding apparatus including a spool and a capillary having a hole to guide the wire therethrough, where the capillary does a first bonding by a nail head bonding method and is movable vertically and horizontally so as to bridge a loop between the first bonding and a subsequent second bonding, there is provided a tension bar, located behind the capillary and rectangular to the wire, to hook the wire at a portion between the capillary and the spool located apart from the center line of the hole. The tension bar is movable from the capillary so as to pull the wire via the hole from the first bonding thus completed. Thus imposed tension hardens the portion of the wire soften by the heat process.
Inventors
- 👤 Akihiro Kubota
- 👤 Mitsunada Osawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:56
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H; H10; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07502; H10W72/07511; H10W72/07521; H10W72/07551; H10W72/07555; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
329 words
A method of wire-bonding an integrated circuit utilizing a capillary, having an axial hole therein extending between first and second opposite openings, for guiding a wire received from a supply thereof through the second opening and guiding same through the axial hole therein such that the wire extends from the first opening to a free end of the wire, the capillary being selectively movable, both vertically and horizontally, relatively to the surface of an integrated circuit so as to bridge the distance between first and second wire bonding positions on the surface of the integrated circuit, the method comprising the steps of: advancing the wire from the supply and through the capillary such that the free end of the wire extends from the first capillary opening by a first length; heating the wire at and adjacent the free end thereof to melt and thereby form a ball of the wire end; with the capillary selectively moved for positioning the wire end ball at the first bonding position, bonding the wire end ball at the first bonding position by a nail head bonding method; with the wire end bonded at the first bonding position, imposing tension in the wire by pulling the wire at a position thereof adjacent the second capillary opening, the level of tension being controlled so as not to break the wire but so as to harden the portion of the first length of wire extending from the bonded wire end and which portion was softened by said heating step; and guiding the wire through the capillary such that a second length of wire extends between the first bonding position and the first capillary opening and moving the capillary from the first and to the second bonding position such that the second length of wire extends between the first bonding position and the second bonding position and the wire is positioned, by the capillary, at the second bonding position for the performance of the second bonding operation.
Claim 2
Independent Claim
329 words
A method of wire-bonding an integrated circuit utilizing a capillary, having an axial hole therein extending between first and second opposite openings, for guiding a wire received from a supply thereof through the second opening and guiding same through the axial hole therein such that the wire extends from the first opening to a free end of the wire, the capillary being selectively movable, both vertically and horizontally, relatively to the surface of an integrated circuit so as to bridge the distance between first and second wire bonding positions on the surface of the integrated circuit, the method comprising the steps of: advancing the wire from the supply and through the capillary such that the free end of the wire extends from the first capillary opening by a first length; heating the wire at and adjacent the free end thereof to melt and thereby form a ball of the wire end; with the capillary selectively moved for positioning the wire end ball at the first bonding position, bonding the wire end ball at the first bonding position by a nail head bonding method; with the wire end bonded at the first bonding position, imposing tension in the wire by pulling the wire at a position thereof adjacent the second capillary opening, the level of tension being controlled so as not to break the wire but so as to harden the portion of the first length of wire extending from the bonded wire end and which portion was softened by said heating step; and guiding the wire through the capillary such that a second length of wire extends between the first bonding position and the first capillary opening and moving the capillary from the first and to the second bonding position such that the second length of wire extends between the first bonding position and the second bonding position and the wire is positioned, by the capillary, at the second bonding position for the performance of the second bonding operation.
Claim 3
Dependent Claim
30 words
A method as recited in claim 1, wherein the tension imposing step is performed by pulling substantially vertically on the wire at a position thereon adjacent the second capillary opening.
Claim 4
Dependent Claim
39 words
A method as recited in claim 1, wherein the tension imposing step is performed by engaging the wire with a clamp positioned adjacent the second capillary opening and pulling the wire by the clamp in a substantially vertical direction.
Claim 5
Dependent Claim
69 words
The method as recited in claim 1 wherein the tension imposing step is performed by engaging the wire at a position intermediate a fixed supply reel thereof and the second capillary opening and then moving the tension bar so as to elongate the length of the wire extending between the first bonding position at which the wire end is bonded and the position thereof engaged by the tension bar.
Claim 6
Dependent Claim
14 words
The method as recited in claim 1, wherein the tension bar comprises a rod.
Claim 7
Dependent Claim
13 words
The method recited in claim 5, wherein the tension bar comprises a roller.
Claim 8
Independent Claim
341 words
A method of wire-bonding an integrated circuit utilizing a capillary, having an axial hole therein extending between first and second opposite openings, for guiding a wire received from a supply thereof through the second opening and guiding same through the axial hole therein such that the wire extends from the first opening to a free end of the wire, the capillary being selectively movable, both vertically and horizontally, relatively to the surface of an integrated circuit so as to bridge the distance between first and second wire bonding positions on the surface of the integrated circuit, the method comprising the steps of: advancing the wire from the supply and through the capillary such that the free end of the wire extends from the first capillary opening by a first length; heating the wire at and adjacent the free end thereof to melt and thereby form a ball of the wire end; with the capillary selectively moved for positioning the wire end ball at the first bonding position, bonding the wire end ball at the first bonding position by a nail head bonding method; with the wire end bonded at the first bonding position, firmly clamping the wire with a clamp at a position thereof adjacent the second capillary opening and pulling the wire with the clamp thereby to impose tension in the wire, the level of tension being controlled so as not to break the wire but so as to harden the portion of the first length of wire extending from the bonded wire end and which portion was softened by said heating step; and guiding the wire through the capillary such that a second length of wire extends between the first bonding position and the first capillary opening and moving the capillary from the first and to the second bonding position such that the second length of wire extends between the first bonding position and the second bonding position and the wire is positioned, by the capillary, at the second bonding position for the performance of the second bonding operation.
Claim 9
Independent Claim
341 words
A method of wire-bonding an integrated circuit utilizing a capillary, having an axial hole therein extending between first and second opposite openings, for guiding a wire received from a supply thereof through the second opening and guiding same through the axial hole therein such that the wire extends from the first opening to a free end of the wire, the capillary being selectively movable, both vertically and horizontally, relatively to the surface of an integrated circuit so as to bridge the distance between first and second wire bonding positions on the surface of the integrated circuit, the method comprising the steps of: advancing the wire from the supply and through the capillary such that the free end of the wire extends from the first capillary opening by a first length; heating the wire at and adjacent the free end thereof to melt and thereby form a ball of the wire end; with the capillary selectively moved for positioning the wire end ball at the first bonding position, bonding the wire end ball at the first bonding position by a nail head bonding method; with the wire end bonded at the first bonding position, firmly clamping the wire with a clamp at a position thereof adjacent the second capillary opening and pulling the wire with the clamp thereby to impose tension in the wire, the level of tension being controlled so as not to break the wire but so as to harden the portion of the first length of wire extending from the bonded wire end and which portion was softened by said heating step; and guiding the wire through the capillary such that a second length of wire extends between the first bonding position and the first capillary opening and moving the capillary from the first and to the second bonding position such that the second length of wire extends between the first bonding position and the second bonding position and the wire is positioned, by the capillary, at the second bonding position for the performance of the second bonding operation.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-12 | 1997-01-11 | 1997-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-12 | 2001-01-11 | 2001-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-12 | 2005-01-11 | 2005-07-13 | $7700.00 | Window Closed / Lapsed |