US5224356A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of using thermal energy absorbing and conducting potting materials
Assignee: Delta Thermal Systems Inc
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Filing: 1991-09-30
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Granted: 1993-07-06
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Expires: 2011-09-30
Abstract
Abstract A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.
Inventors
- 👤 David P. Colvin
- 👤 Yvonne G. Bryant
- 👤 James C. Mulligan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:57
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W40/20; H10W40/25; H10W40/254; H10W40/257
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
102 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled, a base material and a plurality of microcapsules integral with and dispersed throughout the base material, the microcapsules containing a thermal energy absorbing material and wherein the base material is in energy absorbing contacting relation with the electronic component to be cooled, whereby the electronic component is cooled as the thermal energy generated thereby is absorbed by the thermal energy absorbing material.
Claim 2
Independent Claim
102 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled, a base material and a plurality of microcapsules integral with and dispersed throughout the base material, the microcapsules containing a thermal energy absorbing material and wherein the base material is in energy absorbing contacting relation with the electronic component to be cooled, whereby the electronic component is cooled as the thermal energy generated thereby is absorbed by the thermal energy absorbing material.
Claim 3
Dependent Claim
12 words
The method according to claim 1 wherein the base material is hardenable.
Claim 4
Dependent Claim
17 words
The method according to claim 1 wherein the thermal energy absorbing material is a phase change material.
Claim 5
Dependent Claim
19 words
The method according to claim 3 wherein the phase change material is selected from the group of paraffinic hydrocarbons.
Claim 6
Dependent Claim
15 words
The method according to claim 1 wherein the thermal energy absorbing material is plastic crystals.
Claim 7
Dependent Claim
14 words
The method according to claim 2 wherein the base material is an epoxy resin.
Claim 8
Independent Claim
117 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled, a base material and a plurality of microcapsules integral with and dispersed throughout the base material, and wherein a predetermined portion of the microcapsules contain a thermal energy absorbing material and wherein a predetermined portion of the microcapsules contain a thermal energy conducting material, the base material being in energy absorbing contacting relation with the electronic component, whereby the electronic component is cooled as the thermal energy is conducted away therefrom and is absorbed by the microcapsules.
Claim 9
Independent Claim
117 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled, a base material and a plurality of microcapsules integral with and dispersed throughout the base material, and wherein a predetermined portion of the microcapsules contain a thermal energy absorbing material and wherein a predetermined portion of the microcapsules contain a thermal energy conducting material, the base material being in energy absorbing contacting relation with the electronic component, whereby the electronic component is cooled as the thermal energy is conducted away therefrom and is absorbed by the microcapsules.
Claim 10
Dependent Claim
12 words
The method according to claim 7 wherein the base material is hardenable.
Claim 11
Dependent Claim
14 words
The method according to claim 8 wherein the base material is an epoxy resin.
Claim 12
Dependent Claim
20 words
The method according to claim 8 wherein the microcapsules range in diameter from about 1.0 micron to about 100 microns.
Claim 13
Dependent Claim
24 words
The method according to claim 8 wherein the thermal energy absorbing material is selected from the group of phase change materials and plastic crystals.
Claim 14
Dependent Claim
15 words
The method according to claim 8 wherein the thermal energy conducting material is a metal.
Claim 15
Independent Claim
94 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled, a plurality of microcapsules having an electrically insulating shell and containing a thermal energy absorbing material, the microcapsules being adapted to be placed in energy absorbing contacting relation with the electronic component to be cooled, whereby the object is cooled as the thermal energy generated thereby is absorbed by the thermal energy absorbing material.
Claim 16
Independent Claim
94 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled, a plurality of microcapsules having an electrically insulating shell and containing a thermal energy absorbing material, the microcapsules being adapted to be placed in energy absorbing contacting relation with the electronic component to be cooled, whereby the object is cooled as the thermal energy generated thereby is absorbed by the thermal energy absorbing material.
Claim 17
Dependent Claim
22 words
The method according to claim 13 further including a plurality of microcapsules having a shell and containing a thermal energy conducting material.
Claim 18
Dependent Claim
15 words
The method according to claim 14 wherein the thermal energy conducting material is a metal.
Claim 19
Dependent Claim
20 words
The method according to claim 15 wherein the microcapsules range in diameter from about 1.0 microns to about 100 microns.
Claim 20
Independent Claim
77 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation comprising the steps of: placing in contacting relation with the electronic component to be cooled, a plurality of microcapsules having an insulating shell and containing a thermal energy conducting material, whereby the electronic component is cooled as the thermal energy generated thereby is absorbed and is conducted away by the thermal conducting material.
Claim 21
Independent Claim
77 words
A method of cooling an electronic component emitting thermal impulse energy by proximately absorbing and storing the impulse energy for subsequent removal by radiation comprising the steps of: placing in contacting relation with the electronic component to be cooled, a plurality of microcapsules having an insulating shell and containing a thermal energy conducting material, whereby the electronic component is cooled as the thermal energy generated thereby is absorbed and is conducted away by the thermal conducting material.
Claim 22
Dependent Claim
15 words
The method according to claim 17 wherein the thermal energy conducting material is a metal.
Claim 23
Dependent Claim
20 words
The method according to claim 18 wherein the microcapsules range in diameter from about 1.0 microns to about 100 microns.
Claim 24
Dependent Claim
16 words
The method according to claim 19 wherein the microcapsules are embedded in a hardenable base material.
Claim 25
Dependent Claim
15 words
The method according to claim 17 wherein the thermal conducting material is a eutectic metal.
Claim 26
Independent Claim
90 words
A method of cooling an electronic component emitting thermal impulse energy by proximately storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled diamond dust, said diamond dust being mixed with and being dispersed throughout a plurality of microcapsules, said microcapsules containing a thermal energy absorbing and storing material, whereby the electronic component is cooled as the thermal energy generated thereby is absorbed by the diamond dust and the thermal energy absorbing and storing material.
Claim 27
Independent Claim
90 words
A method of cooling an electronic component emitting thermal impulse energy by proximately storing the impulse energy for subsequent removal by radiation and comprising the steps of: placing in contacting relation with the electronic component to be cooled diamond dust, said diamond dust being mixed with and being dispersed throughout a plurality of microcapsules, said microcapsules containing a thermal energy absorbing and storing material, whereby the electronic component is cooled as the thermal energy generated thereby is absorbed by the diamond dust and the thermal energy absorbing and storing material.
Claim 28
Dependent Claim
20 words
A method according to claim 22 wherein the diamond dust is mixed with an dispersed throughout a hardenable base material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-05 | 1997-01-04 | 1997-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-05 | 2001-01-04 | 2001-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-05 | 2005-01-04 | 2005-07-06 | $7700.00 | Window Closed / Lapsed |