US5007478A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microencapsulated phase change material slurry heat sinks
Assignee: MIAMI THE, University of
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Filing: 1989-05-26
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Granted: 1991-04-16
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Expires: 2009-05-26
Abstract
Abstract A slurry of micro-encapsulated phase change materials is provided in accordance with the present invention as a heat sink for, for example, the thermal management of electronic components. The slurry of micro-encapsulated phase change material may be provided within an open container and the electronic component immersed therein. In the alternative, the slurry of micro-encapsulated phase change material can be provided within a container of either flexible bag-like design or a relatively rigid preformed structure to be mounted adjacent the article to be thermally controlled.
Inventors
- 👤 Subrata Sengupta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 05:09
CPC Classifications
F; F28; F28D; F28D20/00; F28D20/02; F28D20/023; H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W40/735; Y; Y02; Y02E; Y02E60/00; Y02E60/14; Y10; Y10S; Y10S165/00; Y10S165/902
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
32 words
A heat sink device comprising: a sealed container; and a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container.
Claim 2
Dependent Claim
32 words
A heat sink device comprising: a sealed container; and a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container.
Claim 3
Dependent Claim
15 words
A heat sink device as in claim 1, wherein said container is a flexible bag.
Claim 4
Dependent Claim
24 words
A heat sink device as in claim 1, wherein said container has walls of predetermined configuration so that said container has a predetermined shape.
Claim 5
Dependent Claim
28 words
A heat sink device as in claim 1, wherein said phase change material is a phase change material selected from n-octadecane, neicosane, myristic acid, stearic acid and acetamide.
Claim 6
Dependent Claim
30 words
A heat sink device as in claim 4, wherein said phase change material is encapsulated in a material that has a higher melting point than the encapsulated phase change material.
Claim 7
Dependent Claim
17 words
A heat sink device as in claim 5, wherein said phase change material is encapsulated in metal.
Claim 8
Dependent Claim
20 words
A heat sink device as in claim 5, wherein said phase change material is encapsulated in polystyrene or polyvinyl alcohol.
Claim 9
Dependent Claim
30 words
A heat sink device as in claim 1, wherein said phase change material is encapsulated in a material that has a higher melting point than the encapsulated phase change material.
Claim 10
Dependent Claim
17 words
A heat sink device as in claim 8, wherein said phase change material is encapsulated in metal.
Claim 11
Dependent Claim
17 words
A heat sink device as in claim 8, wherein said phase change material is encapsulated in polystyrene.
Claim 12
Dependent Claim
25 words
A heat sink device as in claim 1, wherein said liquid in which said microencapsulated phase change material is suspended is a non-reactive cooling fluid.
Claim 13
Independent Claim
40 words
A method of maintaining the temperature of an electronic component comprising: providing a slurry of a liquid and microencapsulated phase change material; placing said slurry in an open container; and immersing the electronic component in said slurry within said container.
Claim 14
Independent Claim
40 words
A method of maintaining the temperature of an electronic component comprising: providing a slurry of a liquid and microencapsulated phase change material; placing said slurry in an open container; and immersing the electronic component in said slurry within said container.
Claim 15
Dependent Claim
26 words
A method as in claim 12, wherein said step of providing a slurry comprises providing a slurry of non-reactive cooling fluid and microencapsulated phase change material.
Claim 16
Dependent Claim
30 words
A method as in claim 12, wherein said step of providing a slurry includes providing a microencapsulated phase change material selected from n-octadecane, n-eicosane, myristic acid, stearic acid and acetamide.
Claim 17
Independent Claim
45 words
A method of maintaining the temperature of an electronic component comprising: providing a slurry of a liquid and microencapsulated phase change material; providing a container; disposing said slurry in said container; sealing said container; and placing said sealed container in contact with an electronic component.
Claim 18
Independent Claim
45 words
A method of maintaining the temperature of an electronic component comprising: providing a slurry of a liquid and microencapsulated phase change material; providing a container; disposing said slurry in said container; sealing said container; and placing said sealed container in contact with an electronic component.
Claim 19
Dependent Claim
26 words
A method as in claim 15, wherein said step of providing a slurry comprises providing a slurry of non-reactive cooling fluid and microencapsulated phase change material.
Claim 20
Dependent Claim
30 words
A method as in claim 15, wherein said step of providing a slurry includes providing a microencapsulated phase change material selected from n-octadecane, n-eicosane, myristic acid, stearic acid and acetamide.
Claim 21
Dependent Claim
18 words
A method as in claim 15, wherein said step of providing a container comprises providing a flexible bag.
Claim 22
Dependent Claim
30 words
A method as in claim 15, wherein said step of providing a container comprises providing a container having walls of predetermined configuration so that said container has a predetermined shape.
Claim 23
Dependent Claim
35 words
A method as in claim 15, wherein said step of providing a slurry includes providing a phase change material encapsulated in a material that has a higher melting point than the encapsulated phase change material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-15 | 1994-10-15 | 1995-04-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-15 | 1998-10-15 | 1999-04-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-15 | 2002-10-15 | 2003-04-16 | $7700.00 | Window Closed / Lapsed |