US5219377A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High temperature co-fired ceramic integrated phased array package
Assignee: Texas Instruments Inc
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Filing: 1992-08-10
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Granted: 1993-06-15
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Expires: 2012-08-10
Abstract
Abstract A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art.
Inventors
- 👤 Frank J. Poradish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:20
CPC Classifications
H; H01; H01Q; H01Q23/00; H01Q21/00; H01Q21/0087; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
175 words
A method of making an integrated package which comprises the steps of: (a) providing a plurality of stacked layers, each layer comprising uniformly mixed fine particulate ceramic material and a binder in intimate relation with each other, including top and bottom layers and at least one intermediate layer therebetween, each of said layers having a pair of opposing major surfaces; (b) disposing a radiating antenna element on a major surface of said at least one intermediate layer; (c) providing at least one cavity, having a semiconductor chip therein, in one of said top, bottom, and intermediate layers; (d) disposing metallization on a major surface of said at least one intermediate layer coupling said chip and said antenna element; (e) providing vias extending through the major surfaces of said at least one intermediate layer having electrically conductive material therein for interconnection with a layer intimate with said intermediate layer; and (f) cofiring said layers at a temperature of from about 1500° C. to about 1800° C. to remove said binder and cause sintering of said layers.
Claim 2
Independent Claim
175 words
A method of making an integrated package which comprises the steps of: (a) providing a plurality of stacked layers, each layer comprising uniformly mixed fine particulate ceramic material and a binder in intimate relation with each other, including top and bottom layers and at least one intermediate layer therebetween, each of said layers having a pair of opposing major surfaces; (b) disposing a radiating antenna element on a major surface of said at least one intermediate layer; (c) providing at least one cavity, having a semiconductor chip therein, in one of said top, bottom, and intermediate layers; (d) disposing metallization on a major surface of said at least one intermediate layer coupling said chip and said antenna element; (e) providing vias extending through the major surfaces of said at least one intermediate layer having electrically conductive material therein for interconnection with a layer intimate with said intermediate layer; and (f) cofiring said layers at a temperature of from about 1500° C. to about 1800° C. to remove said binder and cause sintering of said layers.
Claim 3
Dependent Claim
20 words
The method of claim 1 further including the step of forming metallized grooves in the side walls of said layers.
Claim 4
Dependent Claim
23 words
The method of claim 1 further including disposing metallization on a major surface of at least one of said top and bottom layers.
Claim 5
Dependent Claim
23 words
The method of claim 2 further including disposing metallization on a major surface of at least one of said top and bottom layers.
Claim 6
Dependent Claim
22 words
The method of claim 1 further including forming an interconnect at an edge portion of said intermediate layer coupled to said metallization.
Claim 7
Dependent Claim
22 words
The method of claim 2 further including forming an interconnect at an edge portion of said intermediate layer coupled to said metallization.
Claim 8
Dependent Claim
24 words
The method of claim 3 further including forming an interconnect at an edge portion of said intermediate layer coupled to said metallization disposed thereon.
Claim 9
Dependent Claim
22 words
The method of claim 4 further including forming an interconnect at an edge portion of said intermediate layer coupled to said metallization.
Claim 10
Independent Claim
177 words
A method of making an integrated package which comprises the steps of: (a) providing a plurality of stacked layers, each layer comprising uniformly mixed fine particulate ceramic material and a binder in intimate relation with each other, including top and bottom layers and at least one intermediate layer therebetween, each of said layers having a pair of opposing major surfaces; (b) disposing a radiating antenna element on a major surface of said at least one intermediate layer; (c) providing at least one cavity in one of said layers; (d) disposing a semiconductor chip in said at least one cavity; (e) disposing metallization on a major surface of said at least one intermediate layer coupling said chip and said antenna element; (f) providing vias extending through the major surfaces of said at least one intermediate layer having electrically conductive material therein for interconnection with a layer intimate with said intermdiate layer; and (g) cofiring said layers at a temperature of from about 1500° C. to about 1800° C. to remove said binder and cause sintering of said layers.
Claim 11
Independent Claim
177 words
A method of making an integrated package which comprises the steps of: (a) providing a plurality of stacked layers, each layer comprising uniformly mixed fine particulate ceramic material and a binder in intimate relation with each other, including top and bottom layers and at least one intermediate layer therebetween, each of said layers having a pair of opposing major surfaces; (b) disposing a radiating antenna element on a major surface of said at least one intermediate layer; (c) providing at least one cavity in one of said layers; (d) disposing a semiconductor chip in said at least one cavity; (e) disposing metallization on a major surface of said at least one intermediate layer coupling said chip and said antenna element; (f) providing vias extending through the major surfaces of said at least one intermediate layer having electrically conductive material therein for interconnection with a layer intimate with said intermdiate layer; and (g) cofiring said layers at a temperature of from about 1500° C. to about 1800° C. to remove said binder and cause sintering of said layers.
References Cited (Backward Citations)
US4771294A
Cited
US4899118A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-14 | 1996-12-14 | 1997-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-14 | 2000-12-14 | 2001-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-14 | 2004-12-14 | 2005-06-15 | $7700.00 | Window Closed / Lapsed |