US5216580A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optimized integral heat pipe and electronic circuit module arrangement
Assignee: Sun Microsystems Inc
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Filing: 1992-01-14
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Granted: 1993-06-01
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Expires: 2012-01-14
Abstract
Abstract An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.
Inventors
- 👤 Howard L. Davidson
- 👤 Ehsan Ettehadieh
- 👤 John Schulte
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:44
CPC Classifications
F; F28; F28D; F28D15/00; F28D15/02; F28D15/04; F28D15/046; F28D15/0266; F28D15/0275; H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F28D21/00; F28D2021/0019; F28D2021/0028; F28D2021/0031; F28F; F28F13/00; F28F2013/005
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
150 words
An optimized integral heat pipe and electronic circuit assembly comprising: a thermally conductive multichip circuit module having top and bottom surfaces and a periphery, said multichip circuit module including a multiplicity of heat producing electronic circuit elements mounted to said bottom surface; heat pipe means hermetically coupled to and enclosing the top surface of said multichip circuit module, said heat pipe means enclosing a working fluid for generating an evaporated working fluid vapor when said heat pipe means receives heat produced by said heat producing electronic circuit elements; a layer of titanium adhered to and extending substantially over the top surface of said multichip module; a layer of high-purity copper adhered to and extending substantially over said layer of titanium; a thermal wick adhered to and extending substantially over said layer of high-purity copper, said thermal wick drawing said working fluid to a heated region of said multichip circuit module.
Claim 2
Dependent Claim
150 words
An optimized integral heat pipe and electronic circuit assembly comprising: a thermally conductive multichip circuit module having top and bottom surfaces and a periphery, said multichip circuit module including a multiplicity of heat producing electronic circuit elements mounted to said bottom surface; heat pipe means hermetically coupled to and enclosing the top surface of said multichip circuit module, said heat pipe means enclosing a working fluid for generating an evaporated working fluid vapor when said heat pipe means receives heat produced by said heat producing electronic circuit elements; a layer of titanium adhered to and extending substantially over the top surface of said multichip module; a layer of high-purity copper adhered to and extending substantially over said layer of titanium; a thermal wick adhered to and extending substantially over said layer of high-purity copper, said thermal wick drawing said working fluid to a heated region of said multichip circuit module.
Claim 3
Dependent Claim
15 words
The assembly as set forth in claim 1, wherein said thermal wick comprises sintered copper.
Claim 4
Dependent Claim
17 words
The assembly as set forth in claim 1, wherein said thermally conductive multichip module comprises aluminum oxide.
Claim 5
Dependent Claim
17 words
The assembly as set forth in claim 1, wherein said thermally conductive multichip module comprises aluminum nitride.
Claim 6
Dependent Claim
144 words
An optimized integral heat pipe and electronic circuit assembly comprising: a thermally conductive multichip circuit module having top and bottom surfaces and a periphery, said multichip circuit module including a multiplicity of heat producing electronic circuit elements mounted to said bottom surface, said multichip module comprising diamond; heat pipe means hermetically coupled to and enclosing the top surface of said multichip circuit module, said heat pipe means enclosing a working fluid for generating an evaporated working fluid vapor when said heat pipe means receives heat produced by said heat producing electronic circuit elements; a primer layer adhered to and extending substantially over the top surface of said multichip module; a thermal wick adhered to and extending substantially over said primer layer, said thermal wick drawing said working fluid to a heated region of said multichip circuit module; wherein said thermal wick comprises sintered copper.
Claim 7
Dependent Claim
144 words
An optimized integral heat pipe and electronic circuit assembly comprising: a thermally conductive multichip circuit module having top and bottom surfaces and a periphery, said multichip circuit module including a multiplicity of heat producing electronic circuit elements mounted to said bottom surface, said multichip module comprising diamond; heat pipe means hermetically coupled to and enclosing the top surface of said multichip circuit module, said heat pipe means enclosing a working fluid for generating an evaporated working fluid vapor when said heat pipe means receives heat produced by said heat producing electronic circuit elements; a primer layer adhered to and extending substantially over the top surface of said multichip module; a thermal wick adhered to and extending substantially over said primer layer, said thermal wick drawing said working fluid to a heated region of said multichip circuit module; wherein said thermal wick comprises sintered copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-31 | 1996-11-30 | 1997-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-31 | 2000-11-30 | 2001-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-31 | 2004-11-30 | 2005-06-01 | $7700.00 | Window Closed / Lapsed |