US4995451A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Evaporator having etched fiber nucleation sites and method of fabricating same
Assignee: Hewlett Packard Development Co LP
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Filing: 1989-12-29
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Granted: 1991-02-26
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Expires: 2009-12-29
Abstract
Abstract An evaporator comprising a graphite-Cu composite formed into a plurality of pin fins. The plurality of pin fins serve to increase the surface area of the evaporator. The evaporator surface area is processed to have a plurality of nucleation sites thereon. The evaporator may be connected directly to a integrated circuit package.
Inventors
- 👤 William R. Hamburgen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 23:41
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F; F28; F28D; F28D15/00; F28D15/02; F28F; F28F13/00; F28F13/18; F28F13/185; F28F13/187; F28F21/00; F28F21/02; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; Y; Y10; Y10S; Y10S165/00; Y10S165/905
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
31 words
An evaporator apparatus, comprising a reservoir containing a fluid and a plurality of graphite-metal composite pin fins in said reservoir, said pin fins each having a plurality of nucleation sites thereon.
Claim 2
Dependent Claim
31 words
An evaporator apparatus, comprising a reservoir containing a fluid and a plurality of graphite-metal composite pin fins in said reservoir, said pin fins each having a plurality of nucleation sites thereon.
Claim 3
Dependent Claim
35 words
The evaporator apparatus of claim 1 wherein said evaporator apparatus is contained within a heatpipe and said heatpipe and said evaporator apparatus are connected directly to an integrated circuit package without an intermediary thermal spreader.
Claim 4
Dependent Claim
36 words
An evaporator apparatus for use in a heatpipe for cooling an integrated circuit, comprising: a stack comprised of graphite and metal from the class containing Cu and Al; and said stack having an enhanced surface area.
Claim 5
Dependent Claim
36 words
An evaporator apparatus for use in a heatpipe for cooling an integrated circuit, comprising: a stack comprised of graphite and metal from the class containing Cu and Al; and said stack having an enhanced surface area.
Claim 6
Dependent Claim
22 words
The apparatus of claim 3 wherein said stack includes: a plurality of pin fins to increase the surface area of said evaporator.
Claim 7
Dependent Claim
16 words
The apparatus of claim 2 wherein said stack surface has a large number of nucleation sites.
Claim 8
Dependent Claim
29 words
The apparatus of claim 3 wherein said integrated circuit is contained in a package and said heatpipe is connected directly to said integrated circuit without an intermediary thermal spreader.
Claim 9
Dependent Claim
39 words
The evaporator apparatus of claim 3 wherein said evaporator apparatus is contained within said heatpipe and said heatpipe and said evaporator apparatus are connected directly to a package containing said integrated circuit without utilization of an intermediary thermal spreader.
Claim 10
Dependent Claim
51 words
An evaporator apparatus being fabricated primarily of a composite including graphite and a metal from the class consisting of Al and Cu, said evaporator apparatus having a plurality of pin fins for maximizing the surface area of said evaporator apparatus, said surface area having a multitude of nucleation sites created therein.
Claim 11
Dependent Claim
51 words
An evaporator apparatus being fabricated primarily of a composite including graphite and a metal from the class consisting of Al and Cu, said evaporator apparatus having a plurality of pin fins for maximizing the surface area of said evaporator apparatus, said surface area having a multitude of nucleation sites created therein.
Claim 12
Dependent Claim
18 words
The apparatus of claim 8, further comprising a base, said plurality of pins fins extending from said base.
Claim 13
Dependent Claim
34 words
The evaporator apparatus of claim 8 wherein said evaporator apparatus is contained within a heatpipe and said heatpipe and evaporator apparatus are connected directly to an integrated circuit package without an intermediary thermal spreader.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-02-25 | 1994-08-27 | 1995-02-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-02-25 | 1998-08-27 | 1999-02-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-02-25 | 2002-08-27 | 2003-02-26 | $7700.00 | Window Closed / Lapsed |