Silicone resin electronic device encapsulant

Claim 1

A method for encapsulating an electronic device comprising the steps of: making a mixture consisting essentially of sixteen to twenty-three weight percent of an uncured silicone resin, forty-six to seventy-three weight percent of silicon dioxide, four to fifteen weight percent of silicon hydride and six to twenty-five weight percent of xylene; the silicon resin being selected from the group consisting of polydimethylsiloxane, polymethylphenylsiloxane, and a mixture of polydimethylsiloxane and polymethylphenylsiloxane; the silicone resin containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components; depositing the mixture over an electronic device; and curing the mixture by heating it at an elevated temperature for a sufficient time to harden the mixture.

Claim 2

A method for encapsulating an electronic device comprising the steps of: making a mixture consisting essentially of sixteen to twenty-three weight percent of an uncured silicone resin, forty-six to seventy-three weight percent of silicon dioxide, four to fifteen weight percent of silicon hydride and six to twenty-five weight percent of xylene; the silicon resin being selected from the group consisting of polydimethylsiloxane, polymethylphenylsiloxane, and a mixture of polydimethylsiloxane and polymethylphenylsiloxane; the silicone resin containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components; depositing the mixture over an electronic device; and curing the mixture by heating it at an elevated temperature for a sufficient time to harden the mixture.