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US5213249A Expired / Lapsed US ⏱️ 0.0 years remaining

Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means

Assignee: International Business Machines Corp
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Filing: 1992-05-29
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Granted: 1993-05-25
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Expires: 2012-05-29
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Abstract

Abstract An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said power determining means for monitoring the instantaneous power supplied to said ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.

Inventors

  • 👤 David C. Long
  • 👤 Krishna Seshan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 08:46
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/06; H10P72/0604; B; B23; B23K; B23K20/00; B23K20/10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 129 words
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates. b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said instantaneous power determining means for monitoring the instantaneous power supplied to said ultrasonic source, wherein said monitor means comprises circuit means for detecting the power supplied to said ultrasonic source and process control means responsive to said power detecting means for gradually varying the power of said ultrasonic source.
Claim 2
Dependent Claim 129 words
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates. b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said instantaneous power determining means for monitoring the instantaneous power supplied to said ultrasonic source, wherein said monitor means comprises circuit means for detecting the power supplied to said ultrasonic source and process control means responsive to said power detecting means for gradually varying the power of said ultrasonic source.
Claim 3
Dependent Claim 25 words
The apparatus of claim 1 wherein the first substrate is a wire and said apparatus monitors the bonding of said wire to the second substrate.
Claim 4
Dependent Claim 41 words
The apparatus of claim 1 wherein the first substrate is a chip, chip resistor, chip transistor or surface mount component, and said apparatus monitors the removal of said chip, chip resistor, chip transistor or surface mount component, from the second substrate.
Claim 5
Dependent Claim 30 words
The apparatus of claim 1 wherein the first substrate is a pin or a wire and said apparatus monitors the removal of said pin or wire from the second substrate.
Claim 6
Independent Claim 125 words
A method for monitoring the adhesion/dehesion between first and second substrates in an ultrasonic adhesion/dehesion monitoring apparatus comprising an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates, the method comprising the steps of: a. measuring the instantaneous AC current and instantaneous AC voltage supplied to the ultrasonic source; b. multiplying the instantaneous AC voltage times the instantaneous AC current to determine the instantaneous power supplied to the ultrasonic source; c. monitoring the instantaneous power supplied to the ultrasonic source; d. detecting the power supplied to the ultrasonic source; and e. regulating the power of the ultrasonic source in response to the power detected in step d, wherein the step of regulating comprises gradually varying the power of the ultrasonic source.
Claim 7
Independent Claim 125 words
A method for monitoring the adhesion/dehesion between first and second substrates in an ultrasonic adhesion/dehesion monitoring apparatus comprising an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates, the method comprising the steps of: a. measuring the instantaneous AC current and instantaneous AC voltage supplied to the ultrasonic source; b. multiplying the instantaneous AC voltage times the instantaneous AC current to determine the instantaneous power supplied to the ultrasonic source; c. monitoring the instantaneous power supplied to the ultrasonic source; d. detecting the power supplied to the ultrasonic source; and e. regulating the power of the ultrasonic source in response to the power detected in step d, wherein the step of regulating comprises gradually varying the power of the ultrasonic source.

References Cited (Backward Citations)

SU660799A1 Cited
US4341574A Cited
US4606490A Cited
US4746051A Cited
US4815001A Cited
US5046654A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-05-24 1996-11-23 1997-05-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-05-24 2000-11-23 2001-05-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-05-24 2004-11-23 2005-05-25 $7700.00 Window Closed / Lapsed

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