US5212880A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for packaging a semiconductor device
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1991-06-18
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Granted: 1993-05-25
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Expires: 2011-06-18
Abstract
Abstract This invention is directed to an apparatus for packaging a semiconductor flip chip on a substrate by face-down bonding in which coherent light is used to irradiate a bonding head and the substrate, and the light reflected by the bonding head and the substrate form interference patterns. Adjustment of the inclination of the bonding head against the substrate is performed by observation of the interference fringes caused by the interference between the light reflected by the bonding head and the light reflected by the substrate.
Inventors
- 👤 Masanori Nishiguchi
- 👤 Atsushi Miki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 06:46
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10P72/50; H10P72/53; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/0711; H10W72/07173; H10W72/07178; H10W72/07221; H10W72/07223; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49131; Y10T29/53; Y10T29/53087; Y10T29/53091; Y10T29/5313; Y10T29/53174; Y10T29/53191
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
228 words
An apparatus for packaging a semiconductor device comprising: a bonding head; a holding plane on said bonding head, said holding plane being adapted to hold a semiconductor device by sucking a rear surface thereof; a semiconductor device having a bump electrode formed on a front surface thereof, said semiconductor device being held on said holding plane of said bonding head; a light reflective plane disposed around the holding plane; a stage opposed to said holding plane adapted to hold a substrate on which the semiconductor device is to be bonded in a face-down manner; a substrate held on said stage; irradiation means for irradiating the light reflective plane and said stage with coherent light; observing means for causing light irradiating the light reflective plane and reflected by the light reflective plane to interfere with light irradiating the substrate held by said stage and reflected by the substrate held by said stage to observe an interference state therebetween; detection means for detecting an inclination between the semiconductor device and the substrate; and adjusting means for adjusting an inclination of said bonding head relative to said stage and for moving the bonding head relative to said stage to adjust said inclination between a plane on which the bump electrode of the semiconductor device is disposed and a plane of the substrate to which the semiconductor device is to be bonded.
Claim 2
Independent Claim
228 words
An apparatus for packaging a semiconductor device comprising: a bonding head; a holding plane on said bonding head, said holding plane being adapted to hold a semiconductor device by sucking a rear surface thereof; a semiconductor device having a bump electrode formed on a front surface thereof, said semiconductor device being held on said holding plane of said bonding head; a light reflective plane disposed around the holding plane; a stage opposed to said holding plane adapted to hold a substrate on which the semiconductor device is to be bonded in a face-down manner; a substrate held on said stage; irradiation means for irradiating the light reflective plane and said stage with coherent light; observing means for causing light irradiating the light reflective plane and reflected by the light reflective plane to interfere with light irradiating the substrate held by said stage and reflected by the substrate held by said stage to observe an interference state therebetween; detection means for detecting an inclination between the semiconductor device and the substrate; and adjusting means for adjusting an inclination of said bonding head relative to said stage and for moving the bonding head relative to said stage to adjust said inclination between a plane on which the bump electrode of the semiconductor device is disposed and a plane of the substrate to which the semiconductor device is to be bonded.
Claim 3
Dependent Claim
42 words
An apparatus according to claim 1, wherein said irradiation means is disposed on a side of said stage opposite said bonding head and said stage has a through-hole disposed so that said irradiation means irradiates said light reflective plane through said through-hole.
Claim 4
Dependent Claim
113 words
An apparatus according to claim 2, wherein said irradiation means comprises: a half-mirror inclined at an angle of 45° with respect to said stage; and a light source for generating the coherent light; wherein said half-mirror and said light source are disposed so that a portion of the coherent light from said light source passes through said half-mirror to said light reflective plane, a portion of the coherent light from said light source passes through said half-mirror to said substrate, light reflected by said light reflective plane and light reflected by said substrate interfere with each other to form an interference pattern, and said half-mirror reflects said interference pattern to said observing means.
Claim 5
Dependent Claim
33 words
An apparatus according to claim 1, wherein said irradiation means is disposed on a same side of said bonding head as said stage and is disposed to irradiate the substrate from said side.
Claim 6
Dependent Claim
128 words
An apparatus according to claim 4, wherein said irradiation means comprises: two half-mirrors, each of said half-mirrors having reflective planes disposed to have an angle of 90° therebetween; and a light source for generating the coherent light; wherein said light source and said two half-mirrors are disposed so that a portion of said light from said light source is reflected to said light reflection plane by said half-mirrors, a portion of said light from said light source is reflected to said substrate by said half-mirrors, light irradiating said light reflective plane and reflected by said light reflective plane and light irradiating said substrate and reflected by the substrate interfere with each other to form an interference pattern, and said half-mirrors reflect said interference pattern to said observing means.
References Cited (Backward Citations)
US3923584A
Cited
US3735911A
Cited
US4671446A
Cited
US4677473A
Cited
US4896206A
Cited
US4899921A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-24 | 1996-11-23 | 1997-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-24 | 2000-11-23 | 2001-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-24 | 2004-11-23 | 2005-05-25 | $7700.00 | Window Closed / Lapsed |