Integrated circuit chip repair tool

Claim 2

Apparatus for controlling the application of heat to achieve solder reflow between a first element and a second element with a solder material comprising: heating means for applying heat to the first element; temperature sensing means for sensing the temperature of the first element; control means responsive to said temperature sensing means for discontinuing application of heat to the first element when a specified temperature above the melting temperature of the solder material is sensed, whereby solder reflow is achieved between the first and second element; and first element removal means responsive to said control means for removing the first element from the vicinity of the second element after solder reflow has occurred.

Claim 3

The apparatus of claim 1 wherein the first element is an integrated circuit chip and the second element is a substrate.

Claim 4

The apparatus of claim 1 wherein said heating means is a flame.

Claim 5

The apparatus of claim 3 wherein said flame is produced from a stoichiometric mixture of hydrogen and oxygen saturated with an organic liquid.

Claim 6

The apparatus of claim 4 wherein said organic liquid is acetone.

Claim 7

The apparatus of claim 1 wherein said temperature sensing means is an infrared detector.

Claim 8

The apparatus of claim 1 wherein said specified temperature is less than 100* C above the melting temperature of the solder material.

Claim 9

In an integrated circuit chip repair tool for removing solder bonded chips from a substrate, including substrate positioning means, chip pickup means, and a controllable heat source for applying heat to chips to be removed, the improvement comprising: temperature sensing means for sensing the temperature of a chip to be removed; control means responsive to said temperature sensing means for discontinuing application of heat to a chip at a predetermined temperature above the melt temperature of the solder and said control means further controlling the chip pickup means to initiate the removal of the chip from the surface of the substrate.

Claim 10

In an integrated circuit chip repair tool for removing solder bonded chips from a substrate, including substrate positioning means, chip pickup means, and a controllable heat source for applying heat to chips to be removed, the improvement comprising: temperature sensing means for sensing the temperature of a chip to be removed; control means responsive to said temperature sensing means for discontinuing application of heat to a chip at a predetermined temperature above the melt temperature of the solder and said control means further controlling the chip pickup means to initiate the removal of the chip from the surface of the substrate.

Claim 11

An integrated circuit chip repair tool for repairing multi-chip substrates having a plurality of chips solder bonded thereon adjacent to a chip position to be repaired, comprising: substrate alignment means for supporting substrates to be repaired; chip pickup means capable of supporting chips in fixed spaced relation to substrates aligned by said substrate alignment means, said pickup means also capable of moving chips toward and away from said substrate alignment means; chip heating means for heating chips to a temperature in excess of the melting temperature of the solder bonding material; extinguishing means for discontinuing the heating of chips by said chip heating means; temperature detecting means for detecting the temperature of heated chips; and control means responsive to said temperature detecting means for causing said extinguishing means to operate at a first predetermined temperature above the melting temperature of the solder bonding material; said control means additionally enabling said chip pickup means to support chips in fixed spaced relation to a substrate at a second predetermined temperature above the melting temperature of the solder and lower than said first predetermined temperature, whereby a heated chip will be removed from a substrate prior to the time said first predetermined temperature is reached and before the solder bonding adjacent chips to the substrate reaches the melting temperature.

Claim 12

An integrated circuit chip repair tool for repairing multi-chip substrates having a plurality of chips solder bonded thereon adjacent to a chip position to be repaired, comprising: substrate alignment means for supporting substrates to be repaired; chip pickup means capable of supporting chips in fixed spaced relation to substrates aligned by said substrate alignment means, said pickup means also capable of moving chips toward and away from said substrate alignment means; chip heating means for heating chips to a temperature in excess of the melting temperature of the solder bonding material; extinguishing means for discontinuing the heating of chips by said chip heating means; temperature detecting means for detecting the temperature of heated chips; and control means responsive to said temperature detecting means for causing said extinguishing means to operate at a first predetermined temperature above the melting temperature of the solder bonding material; said control means additionally enabling said chip pickup means to support chips in fixed spaced relation to a substrate at a second predetermined temperature above the melting temperature of the solder and lower than said first predetermined temperature, whereby a heated chip will be removed from a substrate prior to the time said first predetermined temperature is reached and before the solder bonding adjacent chips to the substrate reaches the melting temperature.

Claim 13

The apparatus of claim 9 wherein said chip heating means is a flame and said extinguishing means includes means to provide a puff of air to extinguish said flame.