Patent US1299419A successfully refreshed from Google Patents.
Patent US5210379A successfully refreshed from Google Patents.
US5210379A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed wiring board with electromagnetic wave shielding layer
Assignee: Nippon CMK Corp
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Filing: 1992-02-24
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Granted: 1993-05-11
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Expires: 2012-02-24
Abstract
Abstract A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.
Inventors
- 👤 Hirotaka Okonogi
- 👤 Katsutomo Nikaido
- 👤 Junichi Ichikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:56
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K2201/00; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K3/00; H05K3/46; H05K3/4644; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
123 words
A printed wiring board comprising: an electromagnetic wave shielding layer formed on a printed circuit on at least one surface of a substrate over a plurality of successively formed insulative layers having increasingly larger apertures defining a bowl-shaped opening, the bowl-shaped opening having a bottom defined by the printed circuit and sides inwardly sloping towards the bottom; and a grounding circuit electrically connected to said electromagnetic wave shielding layer and printed circuit by a bowl-shaped connecting region formed in the bowl-shaped opening by filling a conductive paste comprising the electromagnetic wave shielding layer into the bowl-shaped opening; whereby the inwardly sloping sides are effective to facilitate entry of the conductive past into the bowl-shaped opening during the formation of the bowl-shaped connecting region.
Claim 2
Dependent Claim
123 words
A printed wiring board comprising: an electromagnetic wave shielding layer formed on a printed circuit on at least one surface of a substrate over a plurality of successively formed insulative layers having increasingly larger apertures defining a bowl-shaped opening, the bowl-shaped opening having a bottom defined by the printed circuit and sides inwardly sloping towards the bottom; and a grounding circuit electrically connected to said electromagnetic wave shielding layer and printed circuit by a bowl-shaped connecting region formed in the bowl-shaped opening by filling a conductive paste comprising the electromagnetic wave shielding layer into the bowl-shaped opening; whereby the inwardly sloping sides are effective to facilitate entry of the conductive past into the bowl-shaped opening during the formation of the bowl-shaped connecting region.
Claim 3
Dependent Claim
20 words
A printed wiring board according to claim 1, wherein said insulating layers are composed of at least three insulative layers.
Claim 4
Dependent Claim
23 words
A printed wiring board according to claim 1, wherein diameters of apertures of respective insulating layers differ from each other by 0.2 millimeter.
Claim 5
Dependent Claim
133 words
A printed wiring board comprising: a substrate; a printed circuit layer formed on at least one surface of the substrate; a series of insulative layers formed successively one over the other on the printed circuit layer with increasingly larger apertures defining at least one bowl-shaped connecting region, each bowl-shaped connecting region having a bottom defined by the printed circuit layer and sides inwardly sloping towards the bottom whereby the inwardly sloping sides are effective to facilitate entry of conductive paste into the bowl-shaped connecting region during formation of bowl-shaped terminal portions; and an electromagnetic wave shielding layer formed on the insulative layers and having bowl-shaped terminal portions formed by filling a conductive paste which comprises the electromagnetic wave shielding layer into each bowl-shaped connecting region so as to form the bowl-shaped terminal portions.
Claim 6
Dependent Claim
133 words
A printed wiring board comprising: a substrate; a printed circuit layer formed on at least one surface of the substrate; a series of insulative layers formed successively one over the other on the printed circuit layer with increasingly larger apertures defining at least one bowl-shaped connecting region, each bowl-shaped connecting region having a bottom defined by the printed circuit layer and sides inwardly sloping towards the bottom whereby the inwardly sloping sides are effective to facilitate entry of conductive paste into the bowl-shaped connecting region during formation of bowl-shaped terminal portions; and an electromagnetic wave shielding layer formed on the insulative layers and having bowl-shaped terminal portions formed by filling a conductive paste which comprises the electromagnetic wave shielding layer into each bowl-shaped connecting region so as to form the bowl-shaped terminal portions.
Claim 7
Dependent Claim
20 words
A printed wiring board according to claim 4; wherein the series comprises at least two successively formed individual insulating layers.
Claim 8
Dependent Claim
45 words
A printed wiring board according to claim 5; wherein each successively formed individual insulating layer defines an aperture having a diameter larger than a diameter of an aperture defined by a next previously formed individual insulating layer, and said apertures define the bowl-shaped connecting region.
Claim 9
Dependent Claim
23 words
A printed wiring board according to claim 6; wherein each aperture has a diameter 0.2 millimeters larger than a next previously defined aperture.
Claim 10
Independent Claim
152 words
A method of manufacturing a printed wiring board comprising the steps of: providing a substrate; forming a printed circuit layer on at least one surface of the substrate; successively forming a series of insulative layers on the printed circuit layer with the successive layers having increasingly larger apertures which jointly define at least one bowl-shaped connecting region, each bowl-shaped connecting region having a bottom defined by the printed circuit layer and sides inwardly sloping towards the bottom whereby the inwardly sloping sides are effective to facilitate entry of conductive paste into the bowl-shaped connecting region during subsequent formation of a bowl-shaped terminal portion; and forming an electromagnetic wave shielding layer on the electromagnetic wave shielding layer having a bowl-shaped terminal portion formed in the bowl-shaped connecting region by filling a conductive paste which comprises the electromagnetic wave shielding layer into the bowl-shaped connecting region so as to form the bowl-shaped terminal portion.
Claim 11
Independent Claim
152 words
A method of manufacturing a printed wiring board comprising the steps of: providing a substrate; forming a printed circuit layer on at least one surface of the substrate; successively forming a series of insulative layers on the printed circuit layer with the successive layers having increasingly larger apertures which jointly define at least one bowl-shaped connecting region, each bowl-shaped connecting region having a bottom defined by the printed circuit layer and sides inwardly sloping towards the bottom whereby the inwardly sloping sides are effective to facilitate entry of conductive paste into the bowl-shaped connecting region during subsequent formation of a bowl-shaped terminal portion; and forming an electromagnetic wave shielding layer on the electromagnetic wave shielding layer having a bowl-shaped terminal portion formed in the bowl-shaped connecting region by filling a conductive paste which comprises the electromagnetic wave shielding layer into the bowl-shaped connecting region so as to form the bowl-shaped terminal portion.
Claim 12
Dependent Claim
33 words
A method of manufacturing a printed wiring board according to claim 8; wherein the step of successively forming the series of insulative layers comprises forming at least two successively formed individual insulating layers.
Claim 13
Dependent Claim
48 words
A method of manufacturing a printed wiring board according to claim 9; wherein each successively formed individual insulating layer defines an aperture having a diameter larger than a diameter of an aperture defined by the next previously formed insulating layer, and said apertures define the bowl-shaped connecting region.
Claim 14
Dependent Claim
27 words
A method of manufacturing a printed wiring board according to claim 10; wherein each aperture has a diameter 0.2 millimeters larger than the next previously defined aperture.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-10 | 1996-11-09 | 1997-05-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-10 | 2000-11-09 | 2001-05-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-10 | 2004-11-09 | 2005-05-11 | $7700.00 | Window Closed / Lapsed |