Semiconductor integrated circuit provided with contact for inter-layer connection and method of inter-layer connection therefor

Claim 2

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulating layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern, each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of said each first pattern, said first and second patterns being connected.

Claim 3

The semiconductor integrated circuit as set forth in claim 1, wherein the widthwise dimension W1 of said each first pattern and the widthwise dimension W2 of said each second pattern satisfy the relationship of the following expressions, when W1>2 μm, W2≈0.8 W1 when 1≦W1≦2 μm, W2≈0.7 W1 when W1<1 μm, W2≈0.5 W1

Claim 4

The semiconductor integrated circuit as set forth in claim 2, wherein said at least one first pattern and said at least one second pattern are alternately arranged.

Claim 5

The semiconductor integrated circuit as set forth in claim 3, wherein said each first pattern is a substantially square form.

Claim 6

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulation layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers being made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern, each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of each said first pattern, said first pattern and said second pattern being alternately arranged, wherein said each first pattern is a substantially octagon form having a side contacting one of said at least one second pattern, said contacting side being at least as large as the widthwise dimension W2 of said one of said at least one second pattern, and said widthwise dimension W1 of said each first pattern and said widthwise dimension of said second each pattern W2 have the following relationship: when W1>2 μm, W2≈0.8 W1 when 1 μm<=W1<=2 μm, W2≈0.7 W1 when W1<1 μm, W2≈0.5 W1.

Claim 7

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulation layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers being made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern, each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of each said first pattern, said first pattern and said second pattern being alternately arranged, wherein said each first pattern is a substantially octagon form having a side contacting one of said at least one second pattern, said contacting side being at least as large as the widthwise dimension W2 of said one of said at least one second pattern, and said widthwise dimension W1 of said each first pattern and said widthwise dimension of said second each pattern W2 have the following relationship: when W1>2 μm, W2≈0.8 W1 when 1 μm<=W1<=2 μm, W2≈0.7 W1 when W1<1 μm, W2≈0.5 W1.

Claim 8

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulation layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers being made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern, each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of said each first pattern, said first pattern and said second pattern being alternately arranged, wherein said second pattern is a substantially rectangular form, and said widthwise dimension W1 of said each first pattern and said widthwise dimension of said each second pattern W2 have the following relationship: when W1>2 μm, W2≈0.8 W1 when 1 μm<=W1<=2 μm, W2≈0.7 W1 when W1<1 μm, W2≈0.5 W1.

Claim 9

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulation layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers being made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern, each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of said each first pattern, said first pattern and said second pattern being alternately arranged, wherein said second pattern is a substantially rectangular form, and said widthwise dimension W1 of said each first pattern and said widthwise dimension of said each second pattern W2 have the following relationship: when W1>2 μm, W2≈0.8 W1 when 1 μm<=W1<=2 μm, W2≈0.7 W1 when W1<1 μm, W2≈0.5 W1.

Claim 10

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulation layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers being made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of said each first pattern, wherein said contact includes at least one third pattern in addition to said at least one first pattern and said at least one second pattern, and said widthwise dimension W1 of said each first pattern and said widthwise dimension of said each second pattern W2 have the following relationship: when W1>2 μm, W2≈0.8 W1 when 1 μm<=W1<2 μm, W2≈0.7 W1 when W1 1 μm, W2≈0.5 W1.

Claim 11

A semiconductor integrated circuit with a contact having a relatively longer lengthwise contact dimension than a widthwise contact dimension for electrically connecting a first conducting layer to an adjacent second conducting layer through an insulation layer, to form a plurality of layers in a laminated structure including conducting layers and insulating layers deposited therebetween, said conducting layers being made of at least one of a semiconductor substrate, polycrystalline silicon and metal, said contact comprising at least one first pattern, each first pattern having a widthwise dimension W1 substantially equal to a lengthwise dimension L1, and at least one second pattern each second pattern having a widthwise dimension W2 smaller than the widthwise dimension W1 of said each first pattern, wherein said contact includes at least one third pattern in addition to said at least one first pattern and said at least one second pattern, and said widthwise dimension W1 of said each first pattern and said widthwise dimension of said each second pattern W2 have the following relationship: when W1>2 μm, W2≈0.8 W1 when 1 μm<=W1<2 μm, W2≈0.7 W1 when W1 1 μm, W2≈0.5 W1.

Claim 12

The semiconductor integrated circuit as set forth in claim 7, wherein said at least one first pattern, said at least one second pattern and said at least one third pattern are repeatedly and regularly arranged.

Claim 13

The semiconductor integrated circuit as set forth in claim 7, wherein said at least one first pattern, said at least one second pattern and said at least one third pattern are randomly arranged.