High density parallel interconnect

Claim 2

A connector comprising: a contact module comprising, a housing having first and second sides; a first array of contacts disposed on the first side of said housing along a first plane of said contact module; and a second array of contacts disposed on the second side of said housing along a second plane of said contact module with the second plane being parallel to the first plane in which said first array of contacts are disposed; a matched impedance film disposed in contact with said first and second arrays of contacts said matched impedance film comprising, a dielectric sheet; first and second arrays of contact pads disposed on said dielectric sheet, said first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module; and means for electrically interconnecting said first and second arrays of contact pads; and at least one interactive biasing module including at least one resilient pad, at least one plate in cooperation with said at least one resilient pad and at least one force generating means interacting with said matched impedance film for providing substantially uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module.

Claim 3

The connector of claim 1 wherein said interactive biasing module comprises: resilient pad disposed over a first surface of said matched impedance film proximate to said first and second arrays of contact pads of said matched impedance film, wherein said resilient pad provides displacement tolerance relief for said first and second arrays of contacts of said contact module; a first plate, disposed over a first surface of said resilient pad, wherein said plate provides substantially uniform distribution of contact forces over a first one of said first and second arrays of contacts of said contact module; a second plate disposed over a first surface of said resilient pad, wherein said plate provides substantially uniform distribution of contact forces over a second one of said first and second arrays of contacts of said contact module; and force generating means engaging said first and second plates and providing contact forces promoting electrical coupling between said first and second arrays of contact pads of said matched impedance film and said first and second arrays of contacts of said contact module.

Claim 4

The connector of claim 2 wherein: at least one of said first and second arrays of contacts comprise: a plurality of contacts wherein each of said contacts are disposed in a corresponding one of a like plurality of openings in said housing and each of said contacts comprise: a first electrically conductive member disposed in the corresponding opening of said housing with a first end of said first electrically conductive member having a ramp surface and a second end of said first electrically conductive member disposed through a first end of the opening of said housing and extending beyond a first surface of said housing; and a second electrically conductive member disposed over the first end of said first electrically conductive member the second electrically conductive member having spring means cooperative with the ramp surface of said first electrically conductive member.

Claim 5

A modified high density backplane connector comprising: a contact module comprising: means for aligning said modified high density backplane connector with first and second printed circuit boards; a first array of contacts disposed along a first plane of said contact module to electrically couple predetermined ones of signal and ground contact pads disposed on the first printed circuit board; and a second array of contacts disposed along a second plane of said contact module means said second plane being parallel to said first plane with said second array of contacts electrically coupled to predetermined ones of ground and signal contact pads disposed on the second printed circuit board; a matched impedance film disposed in contact with said first and second contact arrays said matched impedance film comprising: first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means; and means for electrically interconnecting said first and second arrays of contact pads; at least one interactive biasing module means interacting with said matched impedance film for providing uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means, said interactive biasing means comprising: resilient pad means engaging said matched impedance film proximate to said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means; plate means engaging said resilient pad means for providing substantially uniform distribution of contact forces against said first and second arrays of contacts of said contact module means; and force generating spring means engaging said plate means for providing contact forces and for facilitating electrical coupling between said first and second arrays of contact pads of said matched impedance film and said first and second arrays of contact pads of said contact module means.

Claim 6

A modified high density backplane connector comprising: a contact module comprising: means for aligning said modified high density backplane connector with first and second printed circuit boards; a first array of contacts disposed along a first plane of said contact module to electrically couple predetermined ones of signal and ground contact pads disposed on the first printed circuit board; and a second array of contacts disposed along a second plane of said contact module means said second plane being parallel to said first plane with said second array of contacts electrically coupled to predetermined ones of ground and signal contact pads disposed on the second printed circuit board; a matched impedance film disposed in contact with said first and second contact arrays said matched impedance film comprising: first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means; and means for electrically interconnecting said first and second arrays of contact pads; at least one interactive biasing module means interacting with said matched impedance film for providing uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means, said interactive biasing means comprising: resilient pad means engaging said matched impedance film proximate to said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means; plate means engaging said resilient pad means for providing substantially uniform distribution of contact forces against said first and second arrays of contacts of said contact module means; and force generating spring means engaging said plate means for providing contact forces and for facilitating electrical coupling between said first and second arrays of contact pads of said matched impedance film and said first and second arrays of contact pads of said contact module means.

Claim 7

A modified high density backplane connector for mating and electrically interconnecting first and second printed circuit boards having predetermined geometric arrays of signal, ground and contact pads, comprising: contact module means for aligning said modified high density backplane connector with the second printed circuit board, said contact module means including a first array of contacts disposed in a first plane and a second array of contacts disposed in a second plane parallel to said first plane with said first and second array of contacts corresponding to the predetermined geometric arrays of signal and ground contact pads of the first and second printed circuit boards, respectively, and said second array of contacts being electrically interconnected to the predetermined geometric array of ground and signal contact pads of the second printed circuit board; flexible film means for providing a conductive matrix including first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means and means for electrically interconnecting said first and second arrays of contact pads of said conductive matrix, said flexible film means interacting with said contact module means to provide electrical interconnection between said first and second arrays of contacts of said contact module means by means of said conductive matrix; at least one interactive biasing module means interacting with said flexible film means for providing substantially uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means, said interactive biasing means comprising: resilient pad means abutting said flexible film opposite said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means; plate means abutting said resilient pad means for providing substantially uniform distribution of contact forces over said first and second arrays of contacts of said contact module means; and force generating spring means engaging said plate means for providing said contact forces to bias said first and second arrays of contact pads of said conductive matrix into electrical engagement with said first and second arrays of contact pads of said contact module means.

Claim 8

A modified high density backplane connector for mating and electrically interconnecting first and second printed circuit boards having predetermined geometric arrays of signal, ground and contact pads, comprising: contact module means for aligning said modified high density backplane connector with the second printed circuit board, said contact module means including a first array of contacts disposed in a first plane and a second array of contacts disposed in a second plane parallel to said first plane with said first and second array of contacts corresponding to the predetermined geometric arrays of signal and ground contact pads of the first and second printed circuit boards, respectively, and said second array of contacts being electrically interconnected to the predetermined geometric array of ground and signal contact pads of the second printed circuit board; flexible film means for providing a conductive matrix including first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means and means for electrically interconnecting said first and second arrays of contact pads of said conductive matrix, said flexible film means interacting with said contact module means to provide electrical interconnection between said first and second arrays of contacts of said contact module means by means of said conductive matrix; at least one interactive biasing module means interacting with said flexible film means for providing substantially uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means, said interactive biasing means comprising: resilient pad means abutting said flexible film opposite said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means; plate means abutting said resilient pad means for providing substantially uniform distribution of contact forces over said first and second arrays of contacts of said contact module means; and force generating spring means engaging said plate means for providing said contact forces to bias said first and second arrays of contact pads of said conductive matrix into electrical engagement with said first and second arrays of contact pads of said contact module means.

Claim 9

The connector of claim 3 wherein said force generating means comprise a spring having a first surface disposed against a first one of said first and second plates and a second surface disposed against a second one of said first and second plates.