Wafer polisher head having floating retainer ring

Claim 2

A polishing head for positioning a semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with a polishing surface, comprising: (a) a carrier for a wafer; (b) a retainer for resisting lateral force on a wafer caused by engagement of the face thereof with said polishing surface during the polishing of said face, which retainer engages said polishing surface with said wafer during the polishing of said face; and (c) a connector between said carrier and said retainer allowing the latter both to float on said surface while said wafer face is polished and to project beyond said carrier to form a pocket therewith for a wafer to facilitate application of the same to said carrier.

Claim 3

The polishing head of claim 1 wherein said retainer encloses a portion of said carrier with which it defines said pocket, further including means for selectively projecting said portion beyond said retainer.

Claim 4

The polishing head of claim 2 wherein said portion includes an insert to adhere said wafer within said pocket.

Claim 5

The polishing head of claim 1 wherein said connector is a flexible membrane.

Claim 6

The polishing head of claim 4 wherein said flexible membrane is positioned to respond to a pressure differential between two volumes on opposite sides of the same, means are provided for forming said pressure differential to cause said float during said engagement, and interfering mechanical construction means is provided to counteract said pressure differential to provide said retainer projection and consequent wafer pocket.

Claim 7

The polishing head of claim 5 further including means for changing the location at which said interfering mechanical construction means counteracts said pressure differential.

Claim 8

The polishing head of claim 6 wherein said means for changing said location is positioned to be accessible from the exterior of said head.

Claim 9

The polishing head of claim 5 wherein said interfering mechanical construction means has a first position in which it overcomes said pressure differential and allows said retainer to project beyond said carrier to form a pocket therewith and a second position at which said carrier projects beyond said retainer.

Claim 10

The polishing head of claim 8 further including means for determining whether said interfering mechanical construction provides said first or said second position.

Claim 11

The polishing head of claim 9 wherein said means for determining is positioned to be manipulatable from the exterior of said head.

Claim 12

The polishing head of claim 4 or of claim 5 wherein said membrane also provides means for selectively projecting said carrier beyond said retainer.

Claim 13

In a method of using an edge retainer on a semiconductor wafer carrier to define a pocket for a wafer to resist lateral forces which may be applied to such wafer during the treatment of a face thereof which includes engagement of said face with a treating surface, the steps of: (a) allowing said edge retainer to move during said engagement to accommodate angular variations between said wafer face and said treating surface; and (b) fixing the position of said edge retainer to define said wafer pocket at a time that said face is not in engagement with said treating surface.

Claim 14

In a method of using an edge retainer on a semiconductor wafer carrier to define a pocket for a wafer to resist lateral forces which may be applied to such wafer during the treatment of a face thereof which includes engagement of said face with a treating surface, the steps of: (a) allowing said edge retainer to move during said engagement to accommodate angular variations between said wafer face and said treating surface; and (b) fixing the position of said edge retainer to define said wafer pocket at a time that said face is not in engagement with said treating surface.

Claim 15

The method of claim 12 wherein said step of allowing said edge retainer to move includes allowing the position of the same to float during said engagement.

Claim 16

The method of claim 13 wherein said retainer encloses a portion of said carrier with which it defines said pocket, further including the step of selectively projecting said portion beyond said retainer.

Claim 17

The method of claim 12 wherein a flexible membrane connects said retainer and said carrier, which membrane is positioned to respond to a pressure differential on opposite sides of the same and means are provided for forming said pressure differential, and wherein said step of allowing said edge retainer to move during said engagement includes allowing said engagement to overcome said pressure differential and flex said membrane.

Claim 18

The method of claim 15 wherein said step of fixing the position of said edge retainer includes providing interfering mechanical construction means to counteract said pressure differential.

Claim 19

The method of claim 16 wherein said retainer encloses a portion of said carrier with which it defines said pocket, further including the step of selectively projecting said portion beyond said retainer.

Claim 20

The method of claim 17 wherein said step of selectively projecting said portion beyond said retainer includes changing the location at which said interfering mechanical construction means counteracts said pressure differential.

Claim 21

A polishing head for positioning a semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with a polishing surface, comprising: (a) means for carrying said water, said carrying means including an edge retainer to define a pocket for said wafer; (b) means for allowing said edge retainer to move during said engagement to accommodate angular variations between said wafer face and said polishing surface; and (c) means for fixing the position of said edge retainer to define said wafer pocket at a time that said face is not in engagement with said polishing surface.

Claim 22

A polishing head for positioning a semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with a polishing surface, comprising: (a) means for carrying said water, said carrying means including an edge retainer to define a pocket for said wafer; (b) means for allowing said edge retainer to move during said engagement to accommodate angular variations between said wafer face and said polishing surface; and (c) means for fixing the position of said edge retainer to define said wafer pocket at a time that said face is not in engagement with said polishing surface.

Claim 23

A polishing head for positioning a disk-shaped semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with the polishing surface of a polishing pad, comprising: (a) a carrier having a portion for holding a disk-shaped wafer with a face thereof to be polished exposed; (b) an annular retainer for circumscribing said portion, defining therewith a pocket for a disk-shaped wafer, and for resisting lateral force on a wafer in said pocket caused by engagement of said face with said polishing surface during the polishing of said face, which retainer engages said polishing surface with said wafer during the polishing of said face; (c) a flexible membrane connecting said carrier and said retainer positioned to respond to a pressure differential between two volumes on opposite sides of the same; (d) means for forming said pressure differential and cause said retainer to float on said polishing surface while said wafer face is being polished; and (e) interfering mechanical construction means to overcome said pressure differential and allow said retainer to project beyond said carrier to form a pocket therewith for a wafer.

Claim 24

A polishing head for positioning a disk-shaped semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with the polishing surface of a polishing pad, comprising: (a) a carrier having a portion for holding a disk-shaped wafer with a face thereof to be polished exposed; (b) an annular retainer for circumscribing said portion, defining therewith a pocket for a disk-shaped wafer, and for resisting lateral force on a wafer in said pocket caused by engagement of said face with said polishing surface during the polishing of said face, which retainer engages said polishing surface with said wafer during the polishing of said face; (c) a flexible membrane connecting said carrier and said retainer positioned to respond to a pressure differential between two volumes on opposite sides of the same; (d) means for forming said pressure differential and cause said retainer to float on said polishing surface while said wafer face is being polished; and (e) interfering mechanical construction means to overcome said pressure differential and allow said retainer to project beyond said carrier to form a pocket therewith for a wafer.

Claim 25

The polishing head of claim 20 further including an insert within said pocket for adhering said wafer to said carrier; wherein said interfering mechanical construction means has a first position in which it overcomes said pressure differential and allows said retainer to project beyond said carrier to form a pocket therewith and a second position at which said carrier projects beyond said retainer to facilitate the changing of said insert without interference by said retainer; and further including means accessible from the exterior of said carrier for changing the location at which said interfering mechanical construction means overcomes said pressure differential.