US5205036A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a semiconductor device with selective coating on lead frame
Assignee: Semiconductor Energy Laboratory Co Ltd
•
Filing: 1992-07-27
•
Granted: 1993-04-27
•
Expires: 2012-07-27
Abstract
Abstract A method for manufacturing a lead frame for assemble with a semiconductor device comprises the steps of covering, with a cover film, a die to which an electronic device is attached and a conducting section of a lead section to be electrically connected to the die, covering the whole of the die and lead section and the cover film with an inorganic protective film, and removing the cover film and the protective film formed over the cover film to partly expose the die and the conducting section for electric connection.
Inventors
- 👤 Shunpei Yamazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 03:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/458; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
112 words
A method for forming an electric device including at least a lead frame, a semiconductor device mounted on said lead frame, and an electrical connection between said lead frame and a terminal of said semiconductor device, said method comprising the sequential steps of: coating a protective film on said lead frame except for the portions on which said semiconductor device is to be mounted and said electrical connection will be made; said semiconductor device on the lead frame; making said electrical connection between said terminal of said semiconductor device and an uncoated portion of the lead frame; and encapsulations the lead frame having said protective coating formed thereon with an organic material.
Claim 2
Independent Claim
112 words
A method for forming an electric device including at least a lead frame, a semiconductor device mounted on said lead frame, and an electrical connection between said lead frame and a terminal of said semiconductor device, said method comprising the sequential steps of: coating a protective film on said lead frame except for the portions on which said semiconductor device is to be mounted and said electrical connection will be made; said semiconductor device on the lead frame; making said electrical connection between said terminal of said semiconductor device and an uncoated portion of the lead frame; and encapsulations the lead frame having said protective coating formed thereon with an organic material.
Claim 3
Dependent Claim
16 words
The method of claim 1 wherein said terminal and said portion are electrically connected by wirebonding.
Claim 4
Dependent Claim
13 words
The method of claim 1 wherein said electric device is a semiconductor chip.
Claim 5
Dependent Claim
25 words
The method of claim 1 wherein said protective film is selected from the group of silicon nitride, silicon oxide, silicon carbide and DLC (Diamond-Like Carbon).
Claim 6
Dependent Claim
13 words
The method of claim 1 wherein said protective film is 300 to 5000Å.
Claim 7
Dependent Claim
16 words
The method of claim 1 wherein said protective film is formed by a plasma CVD method.
Claim 8
Independent Claim
114 words
A method for forming a protective film on a lead frame having a portion on which a semiconductor device will be mounted and a portion on which electrical connections are made with said semiconductor device comprising the steps of: coating a removable cover film on the portions of a lead frame on which said semiconductor device will be mounted and on which said electrical connections will be made; coating a protective film on the surface of the lead frame and on said removable cover film on said lead frame; and removing said cover film together with the protective film formed over said portions of said lead frame on which electric contacts will be made.
Claim 9
Independent Claim
114 words
A method for forming a protective film on a lead frame having a portion on which a semiconductor device will be mounted and a portion on which electrical connections are made with said semiconductor device comprising the steps of: coating a removable cover film on the portions of a lead frame on which said semiconductor device will be mounted and on which said electrical connections will be made; coating a protective film on the surface of the lead frame and on said removable cover film on said lead frame; and removing said cover film together with the protective film formed over said portions of said lead frame on which electric contacts will be made.
Claim 10
Dependent Claim
23 words
The method of claim 7 wherein said protective film is selected from the group of silicon nitride, silicon oxide, silicon carbide and DLC
Claim 11
Dependent Claim
14 words
The method of claim 7 wherein said protective film is 300 to 500Å thick.
Claim 12
Dependent Claim
16 words
The method of claim 7 wherein said protective film is formed by a plasma CVD method.
Claim 13
Dependent Claim
21 words
The method of claim 7 wherein said cover film is removed by the use of an organic solvent and ultrasonic waves.
Claim 14
Dependent Claim
14 words
The method of claim 7 wherein said cover film is made of organic resin.
References Cited (Backward Citations)
US3795044A
Cited
US3878554A
Cited
US4079511A
Cited
GB2090466A
Cited
US4486945A
Cited
US4396458A
Cited
US4461924A
Cited
US4562091A
Cited
US4707724A
Cited
US4862586A
Cited
US4770897A
Cited
US4888449A
Cited
US4878990A
Cited
US5070041A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-26 | 1996-10-26 | 1997-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-26 | 2000-10-26 | 2001-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-26 | 2004-10-26 | 2005-04-27 | $7700.00 | Window Closed / Lapsed |