Patent US5205032A successfully refreshed from Google Patents.
US5205032A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic parts mounting apparatus
Assignee: Toshiba Corp
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Filing: 1991-09-27
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Granted: 1993-04-27
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Expires: 2011-09-27
Abstract
Abstract An electronic parts mounting device according to this invention is characterized by including a mount body which is obtained by bonding at least two substrates each having a predetermined thicknesses and a smooth surface and which has at least one bonding portion, the mount body having at least one recessed portion selectively formed in one exposed surface of the mount body to reach the bonding portion, and the recessed portion having a tapered shape widened from the bonding portion to the exposed surface, and an electronic part mounted in the recessed portion.
Inventors
- 👤 Fumihiko Kuroda
- 👤 Hideto Furuyama
- 👤 Mayumi Sakaguchi
- 👤 Hiroshi Hamasaki
- 👤 Masaru Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:42
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/07337; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/30; H10W72/351; H10W72/352; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178; Y10T29/53265
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
74 words
An electronic parts mount device comprising: a mount body which is obtained by bonding at least two substrates each having a predetermined thickness and a smooth surface, wherein one of said substrates has at least one bonding portion, said mount body having at least one recessed portion selectively formed in one exposed surface of said mount body to a depth which reaches said bonding portion; and an electronic part mounted in said recessed portion.
Claim 2
Dependent Claim
74 words
An electronic parts mount device comprising: a mount body which is obtained by bonding at least two substrates each having a predetermined thickness and a smooth surface, wherein one of said substrates has at least one bonding portion, said mount body having at least one recessed portion selectively formed in one exposed surface of said mount body to a depth which reaches said bonding portion; and an electronic part mounted in said recessed portion.
Claim 3
Dependent Claim
31 words
An electronic parts mounting device according to claim 1, further comprising a member filled between a side surface of said recessed portion and said electronic part and having a surface tension.
Claim 4
Dependent Claim
36 words
An electronic parts mounting device according to claim 1, wherein said mount body is constituted by sequentially stacking and bonding at least three substrates and has a plurality of bonding portions, said substrates having different thicknesses.
Claim 5
Dependent Claim
34 words
An electronic parts mounting device according to claim 3, wherein said mount body has a plurality of recessed portions selectively formed in said substrates and having different depths to selectively reach said bonding portions.
Claim 6
Dependent Claim
30 words
An electronic parts mounting device according to claim 4, further comprising at least one recessed portion selectively formed in a substrate opposing to another exposed surface of said mount body.
Claim 7
Dependent Claim
62 words
An electronic parts mounting device according to claim 1, wherein said mount body has a first recessed portion formed to extend from said exposed surface to said bonding portion of said mount body, and a second recessed portion formed at a position corresponding to said first recessed portion and extending from said bonding portion to another exposed surface of said mount body.
Claim 8
Dependent Claim
27 words
An electronic parts mounting device according to claim 6, wherein the width of said first recessed portion is wider than the width of said second recessed portion.
Claim 9
Dependent Claim
24 words
An electronic parts mounting device according to claim 7, wherein said electronic part is supported by a side surface of said first recessed portion.
Claim 10
Dependent Claim
90 words
An electronic parts mounting device comprising: a mount body (150) constituted by at least three substrates having predetermined thicknesses and bonded by stacking; said mount body having first and second bonding portions, first and second exposed surfaces, and at least one recessed portion selectively formed to extend from said first exposed surface and reach said second bonding portion through said first bonding portion, and the width of said first recessed portion being wider than the width of said second recessed portion; and an electronic part mounted in said recessed portion.
Claim 11
Dependent Claim
90 words
An electronic parts mounting device comprising: a mount body (150) constituted by at least three substrates having predetermined thicknesses and bonded by stacking; said mount body having first and second bonding portions, first and second exposed surfaces, and at least one recessed portion selectively formed to extend from said first exposed surface and reach said second bonding portion through said first bonding portion, and the width of said first recessed portion being wider than the width of said second recessed portion; and an electronic part mounted in said recessed portion.
Claim 12
Dependent Claim
33 words
An electronic parts mounting device according to claim 9, wherein said electronic part is supported by a side surface of said recessed portion between said first bonding portion and said first exposed surface.
Claim 13
Dependent Claim
35 words
An electronic parts mounting device according to claim 9, wherein said first bonding portion of said first recessed portion has an area smaller than that of said first bonding portion of said second recessed portion.
Claim 14
Independent Claim
74 words
An apparatus for mounting electronic parts comprising: a substrate having a recessed portion for mounting an electronic part therein, the electronic part being machined to have a predetermined shape; holding means for holding said substrate; moving means for holding the electronic part and moving the electronic part to said recessed portion of said substrate; and vibration generating means for applying a small vibration to at least one of said substrate and the electronic part.
Claim 15
Independent Claim
74 words
An apparatus for mounting electronic parts comprising: a substrate having a recessed portion for mounting an electronic part therein, the electronic part being machined to have a predetermined shape; holding means for holding said substrate; moving means for holding the electronic part and moving the electronic part to said recessed portion of said substrate; and vibration generating means for applying a small vibration to at least one of said substrate and the electronic part.
Claim 16
Dependent Claim
36 words
An apparatus for mounting electronic parts according to claim 12, wherein said vibration generating means includes one of an electromagnetic vibrating element and a piezoelectric vibrating element for converting an electrical vibration to a mechanical vibration.
Claim 17
Dependent Claim
31 words
An apparatus for mounting electronic parts according to claim 12, wherein said vibration generating means includes means for applying an ultrasonic vibration to one of said substrate and the electronic part.
Claim 18
Dependent Claim
108 words
An electronic parts mount device comprising: a mount body which is obtained by bonding together at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the first substrate has at least one bonding portion located on a surface thereof which is in contact with said intermediate bonding layer, the mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate and said bonding layer to a depth which reaches said bonding portion of said first substrate; and an electronic part mounted in said recessed portion.
Claim 19
Dependent Claim
108 words
An electronic parts mount device comprising: a mount body which is obtained by bonding together at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the first substrate has at least one bonding portion located on a surface thereof which is in contact with said intermediate bonding layer, the mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate and said bonding layer to a depth which reaches said bonding portion of said first substrate; and an electronic part mounted in said recessed portion.
Claim 20
Dependent Claim
119 words
An electronic parts mounts device comprising: a mount body which is obtained by bonding at least two substrates each having a predetermined thickness and a smooth surface, wherein one of said substrates has at least one bonding portion, said mount body having at least one recessed portion selectively formed in one exposed surface of said mount body to a depth which reaches said bonding portion; an electronic part being machined to have a predetermined shape; holding means for holding said mount body; moving means for holding said electronic part and moving said electronic part to said recessed portion; and vibration generating means for applying a small vibration to at least one of said mount body and said electronic part.
Claim 21
Dependent Claim
119 words
An electronic parts mounts device comprising: a mount body which is obtained by bonding at least two substrates each having a predetermined thickness and a smooth surface, wherein one of said substrates has at least one bonding portion, said mount body having at least one recessed portion selectively formed in one exposed surface of said mount body to a depth which reaches said bonding portion; an electronic part being machined to have a predetermined shape; holding means for holding said mount body; moving means for holding said electronic part and moving said electronic part to said recessed portion; and vibration generating means for applying a small vibration to at least one of said mount body and said electronic part.
Claim 22
Dependent Claim
152 words
An electronic parts mount device comprising: a mount body which is obtained by bonding at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the first substrate has at least one bonding portion located on a surface thereof which is in contact with said intermediate bonding layer, said mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate and said bonding layer to a depth which reaches said bonding portion of said first substrate; an electronic part being machined to have a predetermined shape; holding means for holding said mount body; moving means for holding said electronic part and moving said electronic part to said recessed portion; and vibration generating means for applying a small vibration to at least one of said mount body and seaid electronic part.
Claim 23
Dependent Claim
152 words
An electronic parts mount device comprising: a mount body which is obtained by bonding at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the first substrate has at least one bonding portion located on a surface thereof which is in contact with said intermediate bonding layer, said mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate and said bonding layer to a depth which reaches said bonding portion of said first substrate; an electronic part being machined to have a predetermined shape; holding means for holding said mount body; moving means for holding said electronic part and moving said electronic part to said recessed portion; and vibration generating means for applying a small vibration to at least one of said mount body and seaid electronic part.
Claim 24
Dependent Claim
105 words
An electronic parts mount device comprising: a mount body which is obtained by bonding together at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the intermediate bonding layer has at least one bonding portion located on a surface thereof which is in contact with said second substrate, the mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate to a depth which reaches said bonding portion of said intermediate bonding layer; and an electronic part mounted in said recessed portion.
Claim 25
Dependent Claim
105 words
An electronic parts mount device comprising: a mount body which is obtained by bonding together at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the intermediate bonding layer has at least one bonding portion located on a surface thereof which is in contact with said second substrate, the mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate to a depth which reaches said bonding portion of said intermediate bonding layer; and an electronic part mounted in said recessed portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-26 | 1996-10-26 | 1997-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-26 | 2000-10-26 | 2001-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-26 | 2004-10-26 | 2005-04-27 | $7700.00 | Window Closed / Lapsed |